Claims
- 1. A wire scribed circuit board having a volume resistivity between 20.degree. C. and 120.degree. C. of at least 10.sup.8 megohm-cm and an insulation resistance as measured in accordance with MIL-STD-202 of at least 1.times.10.sup.6 megohms, said circuit board comprising at least one C-staged adhesive layer on a substrate and wire conductors scribed into the adhesive layer; said adhesive layer being formed from a film forming polymeric resin having a number average molecular weight greater than about 10,000 and a hydroxyl, epoxide or unsaturated functionality greater than about 7, said polymeric resin being selected from the group of polyols consisting of polyesters, polyurethanes, phenoxies, epoxies and mixtures thereof.
Parent Case Info
This is a divisional of co-pending application Ser. No. 07/841,228 filed Feb. 21, 1992 which in turn is a file wrapper continuation of Ser. No. 07/335,139 filed Apr. 6, 1989. Ser. No. 07/335,139 is a divisional of application Ser. No. 07/332,110 filed Mar. 13, 1989, which is a file wrapper continuation of application Ser. No. 07/075,351 filed Jul. 20, 1987, which in turn is a continuation-in-part of application Ser. No. 06/811,421 filed Dec. 20, 1985, abandoned.
US Referenced Citations (18)
Foreign Referenced Citations (3)
Number |
Date |
Country |
97815 |
Jan 1984 |
EPX |
1237936 |
|
FRX |
1504252 |
|
GBX |
Divisions (2)
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Number |
Date |
Country |
Parent |
841228 |
Feb 1992 |
|
Parent |
332110 |
Apr 1989 |
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Continuations (2)
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Number |
Date |
Country |
Parent |
335139 |
Apr 1989 |
|
Parent |
75351 |
Jul 1987 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
811421 |
Dec 1985 |
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