Patent Application
20130340988
The present invention relates to heat dissipating structures, and more particularly, to a heat dissipating structure, a heat dissipating pad, and a heat dissipating bag which enable heat generated from an electronic device to be dissipated.
Conventional portable electronic devices operating at a high speed generate high heat which accumulates to have a significant effect upon the electronic devices. For example, the heat thus accumulated causes a computation delay, a computation error, or a breakdown to the electronic devices.
To overcome the aforesaid drawbacks of the prior art, improved prior art teaches positioning an electronic device on a heat dissipating pad equipped with a fan for removing the heat generated from the electronic device. With the heat dissipating pad being equipped with the, it is necessary for the fan to be electrically connected to a power supply or be supplied with power from the electronic device in order for the fan to operate.
In addition to the aforesaid power requirement, a conventional heat dissipating pad is disadvantaged by its lack of portability.
Accordingly, it is imperative to overcome the aforesaid drawbacks of the prior art.
It is an objective of the present invention to provide a heat dissipating structure having a plurality of ribs for supporting an electronic device and minimizing the area of contact with the electronic device, wherein heat dissipating grooves formed between the ribs are conducive to rapid removal of heat generated from the electronic device, so as to prevent the heat from accumulating inside the electronic device.
Another objective of the present invention is to provide the heat dissipating structure having a main rib and a plurality of auxiliary ribs, with the auxiliary ribs having a height less than the main rib, such that the contact area between the electronic device and the heat dissipating structure is reduced.
Yet another objective of the present invention is to provide a heat dissipating pad and a plurality of heat dissipating bodies which comes in the form of a plurality of ribs and are alternately disposed on a substrate to not only effectuate heat dissipation but also lessen the demand for a consumable material.
A further objective of the present invention is to provide the heat dissipating pad for removing the heat generated from the electronic device in the absence of any additional power supply.
A further objective of the present invention is to provide a heat dissipating bag. The heat dissipating bag comprises a receiving space formed by coupling together the plurality of heat dissipating pads of the present invention. The receiving space receives the electronic device. The ribs of the heat dissipating pads are exposed from the heat dissipating bag. Once the electronic device is positioned on the heat dissipating pads, the heat generated by the electronic device is dissipated through the ribs of the heat dissipating pads.
A further objective of the present invention is to provide the heat dissipating bag. The heat dissipating bag comprises a receiving space formed by coupling together the plurality of heat dissipating pads of the present invention. The receiving space receives the electronic device. The electronic device is tightly clamped by the ribs of the heat dissipating pads and positioned in the receiving space of the heat dissipating bag. Therefore, the electronic device is contained in the heat dissipating bag and well protected.
In order to achieve the above and other objectives, the present invention provides a heat dissipating structure for removing heat generated from an electronic device. The heat dissipating structure comprises a substrate and heat dissipating bodies. The heat dissipating bodies are disposed on the substrate. The heat dissipating bodies comprise a main rib and a plurality of auxiliary ribs. The main rib is half-wave shaped and protrudes from the substrate periodically. The main rib is disposed on the substrate defined with a plurality of main rib peak regions and a plurality of main rib trough regions. The auxiliary ribs flank the first main rib such that the first auxiliary ribs are spaced apart by a space width and occupy a plurality of first auxiliary rib peak regions and a plurality of first auxiliary rib trough regions defined on the substrate, the first auxiliary rib peak region corresponding in position to the first main rib peak region, and the first auxiliary rib trough region corresponding in position to the first main rib trough region. A distance between the first main rib and each of the first auxiliary ribs determines a ratio of an area of the first auxiliary rib peak region to an area of the first main rib peak region.
In order to achieve the above and other objectives, the present invention provides a heat dissipating pad for removing heat generated from an electronic device. The heat dissipating pad comprises a substrate, a first heat dissipating body and a second heat dissipating body. The first heat dissipating body is disposed on the substrate. The first heat dissipating body comprises a first main rib and a plurality of first auxiliary ribs. The second heat dissipating body is disposed on the substrate and positioned proximate to the first heat dissipating body. The second heat dissipating body comprises a second main rib and a plurality of second auxiliary ribs. The first main rib is half-wave shaped and protrudes from the substrate with a first period. The first main rib occupies a plurality of first peak regions and a plurality of first trough regions which are defined on the substrate. The first auxiliary ribs flank the first main rib such that the first auxiliary ribs are spaced apart by a space width and occupy a plurality of first auxiliary rib peak regions and a plurality of first auxiliary rib trough regions defined on the substrate, the first auxiliary rib peak region corresponding in position to the first main rib peak region, and the first auxiliary rib trough region corresponding in position to the first main rib trough region. A distance between the first main rib and each of the first auxiliary ribs determines a ratio of an area of the first auxiliary rib peak region to an area of the first main rib peak region. The second main rib is half-wave shaped and protrudes from the substrate with a second period. The second main rib occupies a plurality of second main rib peak regions and a plurality of second main rib trough regions which are defined on the substrate. The second period differs from the first period by an angle. The second auxiliary ribs flank the second main rib such that the second auxiliary ribs are spaced apart by a space width and occupy a plurality of second auxiliary rib peak regions and a plurality of second auxiliary rib trough regions defined on the substrate, the second auxiliary rib peak region corresponding in position to the second main rib peak region, the second auxiliary rib trough region corresponding in position to the second main rib trough region. A distance between the second main rib and each of the second auxiliary ribs determines a ratio of an area of the second auxiliary rib peak region to an area of the second main rib peak region.
In order to achieve the above and other objectives, the present invention provides a heat dissipating bag for removing heat generated from an electronic device and containing the electronic device. The heat dissipating bag comprises a first heat dissipating pad and a second heat dissipating pad. The first heat dissipating pad comprises a first substrate and a first heat dissipating layer. The first heat dissipating layer is disposed on the first substrate. The first heat dissipating layer comprises a first main rib and a plurality of first auxiliary ribs. A plurality of first heat dissipating grooves is formed between the first main rib and the first auxiliary ribs. The first main rib and the first auxiliary ribs are half-wave shaped and periodically protrude from the first substrate. The second heat dissipating pad comprises a second substrate and a second heat dissipating layer. The second heat dissipating layer is disposed on the second substrate. The second heat dissipating layer comprises a second main rib and a plurality of second auxiliary ribs. A plurality of second heat dissipating grooves is formed between the second main rib and the second auxiliary ribs. The second main rib and the second auxiliary ribs are half-wave shaped and periodically protrude from the second substrate. The first heat dissipating pad and the second heat dissipating pad are coupled together to form a receiving space for receiving the electronic device, such that heat generated by the electronic device is dissipated by at least one of the first heat dissipating grooves and the second heat dissipating grooves.
Compared with the prior art, the present invention provides a heat dissipating structure, a heat dissipating pad, and a heat dissipating bag, such that heat dissipating grooves formed between ribs are conducive to heat dissipation. Each of the ribs is half-wave shaped and protrudes from a substrate periodically such that, once an electronic device comes into contact with the ribs, the electronic device will be in contact with the half-wave shaped peak of the each of the ribs only, thereby reducing the contact area between the electronic device and the ribs. When the first and second heat dissipating pads are formed inside or outside the heat dissipating bag, not only can the electronic device be contained in the heat dissipating bag, clamped firmly, and well protected, but the electronic device can also undergo heat dissipation.
Objectives, features, and advantages of the present invention are hereunder illustrated with specific embodiments in conjunction with the accompanying drawings, in which:
Referring to
The heat dissipating structure 10 comprises a substrate 12 and a heat dissipating body 14.
The heat dissipating body 14 is disposed on the substrate 12. The substrate 12 is made of nylon, for example. In this embodiment, in addition to nylon, the substrate 12 can be made of any other appropriate material, as long as the substrate 12 is suitable for being coupled to the heat dissipating body 14 and fixing the heat dissipating body 14 in place. The heat dissipating body 14 has a main rib 142 and a plurality of auxiliary ribs 144.
Referring to
The substrate 12 is defined with a plurality of auxiliary rib peak regions 1442 and a plurality of auxiliary rib trough regions 1444. The auxiliary rib peak region 1442 and the auxiliary rib trough region 1444 alternate. The auxiliary ribs 144 are formed on the substrate 12 in a manner that the auxiliary ribs 144 cover all the auxiliary rib peak regions 1442 and all the auxiliary rib trough regions 1444. The auxiliary rib peak region 1442 and the auxiliary rib trough region 1444 adjacent thereto together define a wavelength of the half-wave shape of each of the auxiliary ribs 144.
The auxiliary rib peak region 1442 corresponds in position to the main rib peak region 1422. The auxiliary rib trough region 1444 corresponds in position to the main rib trough region 1424.
Referring to
The space width SPW is defined as the distance from any one of the auxiliary ribs to the main rib 142 and is for use in calculating the ratio R of the area of the auxiliary rib peak region 1442 of that specific auxiliary rib 144 to the area of the main rib peak region 1422 of the main rib 142 (to be described in detail below). The mathematical relation between the space width SPW and the ratio R is as follows:
R
n=|(1−B×SPWn/D)|
where B denotes a constant, and D denotes the distance (in millimeters) between the main rib 142 and the nearest ones of the auxiliary ribs thereto. To differentiate the auxiliary ribs, the auxiliary ribs are identified with n which denotes an integer equal to 1, 2, 3, and 4, respectively. When n is equal to 4, it refers to the auxiliary ribs farthest from the main rib. When n is equal to 1, it refers to the auxiliary ribs nearest to the main rib. The remaining ones of the auxiliary ribs 144 are indicated by n equal to 2 and 3, respectively. The above arrangement in this embodiment is illustrative rather than restrictive of the present invention.
In this embodiment, the constant B is set to 0.2, and D to 0.3 mm. Take n equal to 1 (referring to the auxiliary ribs 144′ shown in
The ratio R also applies to height. Hence, the height of the peak of the auxiliary ribs 144′ is equal to 80% of the height of the peak 1426 of the main rib 142. That is to say, the height of the peak of the auxiliary ribs 144′ is less than the height of the peak 1426 of the main rib 142 by 20%.
By analogy, as the distance between the main rib 142 and the auxiliary ribs 144 increases, the ratio R decreases progressively by 0.2, that is, the ratio R starts from 0.8, and then decreases to 0.6, 0.4, and 0.2 progressively.
The main rib 142 and the auxiliary ribs 144 are made of a material that manifests resilience, plasticity, and flexibility.
Referring to
The first main rib 242 and the plurality of first auxiliary ribs 244 of the first heat dissipating body 24 are substantially identical to the main rib 142 and the auxiliary ribs 144 described in the preceding embodiment, respectively.
The first main rib 242 is half-wave shaped. The first main rib 242 protrudes from the substrate 22 with a first period. The substrate 22 is defined with a plurality of first main rib peak regions 2422 and a plurality of first main rib trough regions 2424. The first main rib peak region 2422 and the first main rib trough region 2424 alternate. The first main rib 242 is formed on the substrate 22 to cover all the first main rib peak regions 2422 and all the first main rib trough regions 2424.
The substrate 22 is defined with a plurality of first auxiliary rib peak regions 2442 and a plurality of first auxiliary rib trough regions 2444. The first auxiliary rib peak region 2442 and the first auxiliary rib trough region 2444 alternate. The first auxiliary ribs 244 are formed on the substrate 22 to cover all the first auxiliary rib peak regions 2442 and all the first auxiliary rib trough regions 2444.
The first auxiliary ribs 244 flank the first main rib 242. The first auxiliary ribs 244 are spaced apart from each other by a space width SPW. The first auxiliary rib peak region 2442 corresponds in position to the first main rib peak region 2422. The first auxiliary rib trough region 2444 corresponds in position to the first main rib trough region 2424. The distance between the first main rib 242 and each of the first auxiliary ribs 244 determines the ratio of the area of the first auxiliary rib peak region 2442 to the area of the first main rib peak region 2422.
A second main rib 262 and a plurality of second auxiliary ribs 264 of the second heat dissipating body 26 are substantially identical to the main rib 142 and the auxiliary ribs 144 described in the preceding embodiment, respectively, and protrude from the substrate 22.
A point to note is that there is still a slight difference between the first heat dissipating body 24 and the second heat dissipating body 26.
Although the second main rib 262 is half-wave shaped, the second main rib 262 protrudes from the substrate 22 with a second period. The second period differs from the first period by an angle θ. In this embodiment, the angle θ is exemplified by 90 degrees.
With the angle θ being 90 degrees, the first heat dissipating body 24 and the second heat dissipating body 26 are disposed on the substrate 22 alternately.
Likewise, the first main rib 242 has a peak (that is, the maximum height of the first main rib 242) in each of the first main rib peak regions 2422, whereas the first auxiliary ribs 244 each have a peak (that is, the maximum height of the first auxiliary ribs 244) in each of the first auxiliary rib peak regions 2444. The peaks of the first main rib 242 are higher than the peaks of the first auxiliary ribs 244 in order to support the electronic device. The second main rib 262 has the same structure and function as the first main rib 242.
Referring to
Referring to
The heat dissipating bag 30 comprises a first heat dissipating pad 32 and a second heat dissipating pad 34.
The first heat dissipating pad 32 comprises a first substrate 322 and a first heat dissipating layer 324. The first heat dissipating layer 324 is disposed on the first substrate 322. The first heat dissipating layer 324 comprises a first main rib 3242 and a plurality of first auxiliary ribs 3244. A plurality of first heat dissipating grooves 326 is formed between the first main rib 3242 and the first auxiliary ribs 3244 and is formed between the first auxiliary ribs 3244. The first main rib 3242 and the first auxiliary ribs 3244 are half-wave shaped and protrude from the first substrate 322 periodically.
The second heat dissipating pad 34 comprises a second substrate 342 and a second heat dissipating layer 344. The second heat dissipating layer 344 is disposed on the second substrate 342. The second heat dissipating layer 344 comprises a second main rib 3442 and a plurality of second auxiliary ribs 3444. A plurality of second heat dissipating grooves 346 is formed between the second main rib 3442 and the second auxiliary ribs 3444 and is formed between the second auxiliary ribs 3444. The second main rib 3442 and the second auxiliary ribs 3444 are half-wave shaped and protrude from the second substrate 342 periodically.
The first heat dissipating pad 32 and the second heat dissipating pad 34 are coupled together to form a receiving space 36 for receiving the electronic device, such that heat generated by the electronic device is dissipated by means of the first heat dissipating grooves 326 and/or the second heat dissipating grooves 346.
A point to note is that the space width SPW between the first main rib 3242 and each of the first auxiliary ribs 3244 determines the first ratio of the height of the first auxiliary ribs 3244 to the height of the first main rib 3242 as well as the area of the peak region of the first main rib 3242 and the area of the peak region of each of the first auxiliary ribs 3244. Likewise, the space width SPW between the second main rib 3442 and each of the second auxiliary ribs 3444 determines the second ratio of the height of each of the second auxiliary ribs 3444 to the height of the second main rib 3442 as well as the area of the peak region of each of the second auxiliary ribs 3444 to the area of the peak region of the second main rib 3442. The mathematical relation that expresses the relationship between the space width SPW and the first ratio and expresses the relationship between the space width SPW and the second ratio is as follows:
R
n=|(1−B×SPWn/D)|
where B denotes a constant, and D denotes the distance (in millimeters) from the first main rib 3242 (or the second main rib 3442) to the nearest one of the auxiliary ribs. To differentiate the auxiliary ribs, the auxiliary ribs are identified with n which denotes an integer equal to 1, 2, 3, and 4, respectively. When n is equal to 4, it refers to the auxiliary rib farthest from the first main rib (or the second main rib). When n is equal to 1, it refers to the auxiliary rib nearest to the first main rib (or the second main rib). The remaining ones of the auxiliary ribs are indicated by n equal to 2 and 3, respectively. The above arrangement in this embodiment is illustrative rather than restrictive of the present invention.
In another embodiment, the heat dissipating bag 30 further comprises an anti-slip layer 38. The anti-slip layer 38 is disposed on a side of the first heat dissipating pad 32, wherein the anti-slip layer-disposed side of the first heat dissipating pad 32 does not bear the first heat dissipating layer 324. The anti-slip layer 38 is also disposed on a side of the second heat dissipating pad 34, wherein the anti-slip layer-disposed side of the second heat dissipating pad 34 does not bear the second heat dissipating layer 344. The anti-slip layer 38 serves to clamp and position the electronic device in the receiving space 36.
Accordingly, the present invention provides a heat dissipating structure, a heat dissipating pad and a heat dissipating bag, such that heat dissipating grooves formed between ribs are conducive to heat dissipation. Each of the ribs is half-wave shaped and protrudes from a substrate periodically such that, once an electronic device comes into contact with the ribs, the electronic device will be in contact with the half-wave shaped peak of the each of the ribs only, thereby reducing the contact area between the electronic device and the ribs. When the first and second heat dissipating pads are formed inside or outside the heat dissipating bag, not only can the electronic device be contained in the heat dissipating bag, clamped firmly, and well protected, but the electronic device can also undergo heat dissipation.
The present invention is disclosed above by preferred embodiments. However, persons skilled in the art should understand that the preferred embodiments are illustrative of the present invention only, but should not be interpreted as restrictive of the scope of the present invention. Hence, all equivalent modifications and replacements made to the aforesaid embodiments should fall within the scope of the present invention. Accordingly, the legal protection for the present invention should be defined by the appended claims.
