Protection against mechanical damage

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H01L23/562

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/562Protection against mechanical damage

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including support structures
- Patent number 12,176,300
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,176,302
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Hidetoshi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,176,352
- Issue date Dec 24, 2024
- Innolux Corporation
- Ardour Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist structure for embedded die packaging of power semicon...
- Patent number 12,166,115
- Issue date Dec 10, 2024
- Infineon Technologies Canada Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,164,446
- Issue date Dec 10, 2024
- Kioxia Corporation
- Kenji Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 12,165,992
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,843
- Issue date Dec 3, 2024
- Kioxia Corporation
- Daisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride-based semiconductor devices on patterned substrates and...
- Patent number 12,154,864
- Issue date Nov 26, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a semiconductor chip
- Patent number 12,154,865
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi Kawashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flip-chip package core substrate with build...
- Patent number 12,154,866
- Issue date Nov 26, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage optical transformer integration
- Patent number 12,155,297
- Issue date Nov 26, 2024
- Meta Platforms Technologies, LLC
- Renate Eva Klementine Landig
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,148,712
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuya Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,148,713
- Issue date Nov 19, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,148,714
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a substrate, a structure, and an adhesi...
- Patent number 12,148,715
- Issue date Nov 19, 2024
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,142,539
- Issue date Nov 12, 2024
- Winbond Electronics Corp.
- Ming-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240429240
- Publication date Dec 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Atsushi MIYAGUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20240429179
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...
- Publication number 20240421102
- Publication date Dec 19, 2024
- Intel Corporation
- Chunqing Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421103
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrate...
- Publication number 20240421013
- Publication date Dec 19, 2024
- Apple Inc.
- Jixuan Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TESTING STRUCTURE AND CHIP TESTING METHOD
- Publication number 20240418771
- Publication date Dec 19, 2024
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Publication number 20240421101
- Publication date Dec 19, 2024
- Intel Corporation
- Sunny CHUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A SEAL RING
- Publication number 20240413245
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- In Namgung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240413178
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Rita KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE
- Publication number 20240413096
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- OKGYEONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL STRUCTURE FOR METAL BASE PLATE, SEMICONDUCTOR MODUL...
- Publication number 20240404979
- Publication date Dec 5, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240404965
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240404981
- Publication date Dec 5, 2024
- DENSO CORPORATION
- Hiroki YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...
- Publication number 20240395770
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PA...
- Publication number 20240395729
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE
- Publication number 20240395730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240395732
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Seok Min CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING PACKAGE INCLUDING STRESS RELIEF STRUCTURES AND PAC...
- Publication number 20240395733
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE SUBSTRATES
- Publication number 20240395683
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS

Protection against mechanical damage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Floating die package

Package structure and method for forming the same

Memory device including support structures

Semiconductor device and method for manufacturing semiconductor device

Trench capacitor profile to decrease substrate warpage

Semiconductor device and manufacturing method thereof

Electronic device

Lead frame for improving adhesive fillets on semiconductor die corners

Integrated circuit packages and methods of forming the same

Semiconductor structure and manufacturing method thereof

Semiconductor package

Semiconductor device

Solder resist structure for embedded die packaging of power semicon...

Memory system

Package structure and fabricating method thereof

Semiconductor device

III-nitride-based semiconductor devices on patterned substrates and...

Power semiconductor device including a semiconductor chip

Method of fabricating a flip-chip package core substrate with build...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Semiconductor package with nickel-silver pre-plated leadframe

High voltage optical transformer integration

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Three-dimensional memory devices and methods for forming the same

Semiconductor device

Electronic device including a substrate, a structure, and an adhesi...

Semiconductor device and method of forming ultra high density embed...

Stiffener ring combined with ASIC power delivery

Semiconductor structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

DISPLAY DEVICE

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrate...

CHIP TESTING STRUCTURE AND CHIP TESTING METHOD

BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS

SEMICONDUCTOR DEVICES HAVING A SEAL RING

SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING

PACKAGE STRUCTURE

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE

WARPAGE CONTROL STRUCTURE FOR METAL BASE PLATE, SEMICONDUCTOR MODUL...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR MEMORY SYSTEM

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...

CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PA...

PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MAKING PACKAGE INCLUDING STRESS RELIEF STRUCTURES AND PAC...

ELECTRONIC DEVICE WITH A REINFORCING LAYER

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

SEMICONDUCTOR PACKAGE HAVING MULTIPLE SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE