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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/562Protection against mechanical damage

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure and method therefor
- Patent number 12,322,719
- Issue date Jun 3, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring structure
- Patent number 12,322,711
- Issue date Jun 3, 2025
- United Microelectronics Corp.
- Chia-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with finned support pillar structur...
- Patent number 12,322,710
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor packages and methods thereof
- Patent number 12,315,787
- Issue date May 27, 2025
- Georgia Tech Research Corporation
- Nobuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including seal ring structure
- Patent number 12,315,827
- Issue date May 27, 2025
- United Microelectronics Corp.
- Hui-Lung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and method of manufacturing the same
- Patent number 12,315,797
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,315,824
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dam structure having air gap and ele...
- Patent number 12,310,019
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjoo Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for manufacturing the same
- Patent number 12,308,328
- Issue date May 20, 2025
- Kioxia Corporation
- Kyosuke Nanami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-reducing semiconductor structure and fabricating method of...
- Patent number 12,300,633
- Issue date May 13, 2025
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having functional patterns in redundant region...
- Patent number 12,300,635
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for reducing stress on circuit components
- Patent number 12,300,631
- Issue date May 13, 2025
- Analog Devices International Unlimited Company
- Padraig Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable biometric lighter
- Patent number 12,298,005
- Issue date May 13, 2025
- John Gibson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Seal ring structure and method of fabricating the same
- Patent number 12,300,636
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure including elastic material based buffer column str...
- Patent number 12,293,979
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Cheng-Jer Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with signal bump and dummy bump, semiconductor p...
- Patent number 12,288,762
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing deformation resistant tr...
- Patent number 12,288,755
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices with improved overcoat adhesion and/or...
- Patent number 12,283,534
- Issue date Apr 22, 2025
- Wolfspeed, Inc.
- In Hwan Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding alignment
- Patent number 12,283,568
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cumulative sealing structures
- Patent number 12,283,589
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Chen Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20250183196
- Publication date Jun 5, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES
- Publication number 20250183199
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Bey Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183169
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Won Il Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250183197
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE
- Publication number 20250185403
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION
- Publication number 20250183192
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183195
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183194
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Jingyu BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250174599
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jihoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...
- Publication number 20250174575
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Hung-Hsiang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250174576
- Publication date May 29, 2025
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR SEMICONDUCTOR DEVICE
- Publication number 20250176216
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...
- Publication number 20250174557
- Publication date May 29, 2025
- MEDIATEK INC.
- Cing-Yao Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20250174577
- Publication date May 29, 2025
- SAMSUNG DISPLAY CO., LTD.
- JUNYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167134
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Huishu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER
- Publication number 20250167135
- Publication date May 22, 2025
- STATS ChipPAC Pte Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20250167136
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Hyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING-EMITTING DEVICE FILAMENT INCLUDING ELECTRODE PADS
- Publication number 20250167182
- Publication date May 22, 2025
- SEOUL SEMICONDUCTOR CO., LTD.
- Jae Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20250157948
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DE...
- Publication number 20250160114
- Publication date May 15, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhiliang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250157888
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS

Protection against mechanical damage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structure and method therefor

Die seal ring structure

Chip package and method of forming the same

Three-dimensional memory device with finned support pillar structur...

Semiconductor structure and manufacturing method thereof

Semiconductor device package assemblies with direct leadframe attac...

Embedded semiconductor packages and methods thereof

Integrated circuit with guard ring

Semiconductor structure including seal ring structure

Semiconductor substrate structure and method of manufacturing the same

Semiconductor package

Semiconductor device having wire pieces in bonding member

Chiplet first architecture for die tiling applications

Semiconductor device including dam structure having air gap and ele...

Semiconductor memory device and method for manufacturing the same

Warpage-reducing semiconductor structure and fabricating method of...

Semiconductor device having functional patterns in redundant region...

Chip package with lid

Devices and methods for reducing stress on circuit components

Portable biometric lighter

Seal ring structure and method of fabricating the same

Memory structure including elastic material based buffer column str...

Integrated circuit packages and methods of forming the same

Semiconductor chip with signal bump and dummy bump, semiconductor p...

Microelectronic assemblies having conductive structures with differ...

Three-dimensional memory device containing deformation resistant tr...

Power semiconductor devices with improved overcoat adhesion and/or...

Flexible electronic structure

Wafer bonding alignment

Semiconductor device including cumulative sealing structures

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

SEAL RING STRUCTURES

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Fan-Out Package Having a Main Die and a Dummy Die

PASSIVATION SCHEME DESIGN FOR WAFER SINGULATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEAL RING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

LIGHTING-EMITTING DEVICE FILAMENT INCLUDING ELECTRODE PADS

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

PACKAGE STRUCTURE

DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DE...

ELECTRONIC DEVICE