Protection against mechanical damage

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/562Protection against mechanical damage

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Trench structure for reduced wafer cracking
- Patent number 12,211,805
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy pattern not electrically connected...
- Patent number 12,211,806
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for semiconductor device
- Patent number 12,211,917
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,205,905
- Issue date Jan 21, 2025
- United Microelectronics Corp.
- Yen-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures
- Patent number 12,205,907
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Bey Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced seal ring structure and method of making the same
- Patent number 12,199,049
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging stacked substrates and an integrated circuit die using a...
- Patent number 12,199,003
- Issue date Jan 14, 2025
- MARVELL ASIA PTE. LTD.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element housing package and electronic apparatus
- Patent number 12,198,992
- Issue date Jan 14, 2025
- Kyocera Corporation
- Masanori Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 12,191,299
- Issue date Jan 7, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 12,191,263
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 12,183,689
- Issue date Dec 31, 2024
- AMOSENSE CO., LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,690
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die package stiffeners of metal alloys having ex...
- Patent number 12,183,688
- Issue date Dec 31, 2024
- Intel Corporation
- Valery Ouvarov-Bancalero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including support structures
- Patent number 12,176,300
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,176,302
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Hidetoshi Abe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DENDRITE MITIGATION OF PASSIVE COMPONENTS
- Publication number 20250038043
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250038131
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20250036583
- Publication date Jan 30, 2025
- KIOXIA Corporation
- Kenji SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF
- Publication number 20250040275
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIEN-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038128
- Publication date Jan 30, 2025
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250038129
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Wen-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND CHIP THEREOF
- Publication number 20250038130
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Sheng-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250029937
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029936
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jongwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE SUPPORTS AND RELATED METHODS
- Publication number 20250022813
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20250020610
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...
- Publication number 20250022810
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022811
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Myungyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL CO-PACKAGE STRUCTURE AND COMMUNICATION DEVICE
- Publication number 20250022805
- Publication date Jan 16, 2025
- Huawei Technologies Co., Ltd
- Shun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022812
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL
- Publication number 20250022829
- Publication date Jan 16, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE UTILIZING DUMMY MEMORY BLOCKS TO MI...
- Publication number 20250017006
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Fan Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...
- Publication number 20250014959
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Manish Nayini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015014
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIES AND METHOD OF FORMING THE SAME
- Publication number 20250015050
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCA...
- Publication number 20250006659
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ji-Feng Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION
- Publication number 20250006660
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20250006662
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Yun Cheol HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS

Protection against mechanical damage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Trench structure for reduced wafer cracking

Semiconductor package with dummy pattern not electrically connected...

Power supply system and power supply module

Semiconductor package having multiple substrates

Seal ring for semiconductor device

Microelectronic package with solder array thermal interface materia...

Semiconductor package and manufacturing method thereof

Semiconductor structure

Seal ring structures

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Heterogeneous nested interposer package for IC chips

Advanced seal ring structure and method of making the same

Packaging stacked substrates and an integrated circuit die using a...

Electronic element housing package and electronic apparatus

Package structure

Method of fabricating semiconductor device

Semiconductor structure and manufacturing method of semiconductor s...

Thermal performance improvement and stress reduction in semiconduct...

Semiconductor package with dummy MIM capacitor die

Semiconductor device

Ceramic substrate and manufacturing method therefor

Semiconductor package

Integrated circuit die package stiffeners of metal alloys having ex...

Semiconductor device

Low cost package warpage solution

Floating die package

Package structure and method for forming the same

Memory device including support structures

Semiconductor device and method for manufacturing semiconductor device

Patents Applicationslast 30 patents

DENDRITE MITIGATION OF PASSIVE COMPONENTS

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

MEMORY SYSTEM

SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF

STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD

WAFER AND CHIP THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

POWER MODULE STRUCTURE

MULTIDIE SUPPORTS AND RELATED METHODS

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...

SEMICONDUCTOR PACKAGE

OPTICAL-ELECTRICAL CO-PACKAGE STRUCTURE AND COMMUNICATION DEVICE

SEMICONDUCTOR PACKAGE

UNDERFILL MATERIAL

THREE-DIMENSIONAL MEMORY DEVICE UTILIZING DUMMY MEMORY BLOCKS TO MI...

MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

SEMICONDUCTOR DEVICE

DUMMY DIES AND METHOD OF FORMING THE SAME

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCA...

METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...