Protection against mechanical damage

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H01L23/562

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/562Protection against mechanical damage

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for manufacturing the same
- Patent number 12,308,328
- Issue date May 20, 2025
- Kioxia Corporation
- Kyosuke Nanami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dam structure having air gap and ele...
- Patent number 12,310,019
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjoo Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-reducing semiconductor structure and fabricating method of...
- Patent number 12,300,633
- Issue date May 13, 2025
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having functional patterns in redundant region...
- Patent number 12,300,635
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for reducing stress on circuit components
- Patent number 12,300,631
- Issue date May 13, 2025
- Analog Devices International Unlimited Company
- Padraig Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable biometric lighter
- Patent number 12,298,005
- Issue date May 13, 2025
- John Gibson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Seal ring structure and method of fabricating the same
- Patent number 12,300,636
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure including elastic material based buffer column str...
- Patent number 12,293,979
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Cheng-Jer Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with signal bump and dummy bump, semiconductor p...
- Patent number 12,288,762
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing deformation resistant tr...
- Patent number 12,288,755
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Koichi Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices with improved overcoat adhesion and/or...
- Patent number 12,283,534
- Issue date Apr 22, 2025
- Wolfspeed, Inc.
- In Hwan Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding alignment
- Patent number 12,283,568
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cumulative sealing structures
- Patent number 12,283,589
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Chen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with warpage release layer structure in package a...
- Patent number 12,283,553
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside deposition tuning of stress to control wafer bow in semico...
- Patent number 12,276,922
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer seal ring having protrusion extending into tren...
- Patent number 12,278,151
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,278,196
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnect structure with planariz...
- Patent number 12,278,168
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Joongsuk Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and method of fabricating the same
- Patent number 12,278,248
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Bongjin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener
- Patent number 12,272,610
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having elastic member within via
- Patent number 12,272,620
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,274,082
- Issue date Apr 8, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167134
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Huishu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER
- Publication number 20250167135
- Publication date May 22, 2025
- STATS ChipPAC Pte Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20250167136
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Hyuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING-EMITTING DEVICE FILAMENT INCLUDING ELECTRODE PADS
- Publication number 20250167182
- Publication date May 22, 2025
- SEOUL SEMICONDUCTOR CO., LTD.
- Jae Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DE...
- Publication number 20250160114
- Publication date May 15, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhiliang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20250157948
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250157888
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR MITIGATING WARPAGE IN INTEGRATED...
- Publication number 20250157946
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Resham Raj Thapa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157947
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20250157955
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING STEPS AND RELATED METHODS
- Publication number 20250157950
- Publication date May 15, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACKSTOP BARRIER ARCHITECTURE FOR HYBRID BONDED SEMICONDUCTOR PACK...
- Publication number 20250149465
- Publication date May 8, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149467
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Juil Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149409
- Publication date May 8, 2025
- Fuji Electric Co., Ltd.
- Hideo AMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250149466
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20250149468
- Publication date May 8, 2025
- ABSOLICS INC.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WARPAGE OCCURRED TO SUBSTRATE DURING PACKAGING...
- Publication number 20250149348
- Publication date May 8, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250140712
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME
- Publication number 20250140690
- Publication date May 1, 2025
- Hon Young Semiconductor Corporation
- Kuang-Hao CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SUPPORT STRUCTURES
- Publication number 20250132267
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS

Protection against mechanical damage

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chiplet first architecture for die tiling applications

Semiconductor memory device and method for manufacturing the same

Semiconductor device including dam structure having air gap and ele...

Warpage-reducing semiconductor structure and fabricating method of...

Semiconductor device having functional patterns in redundant region...

Chip package with lid

Devices and methods for reducing stress on circuit components

Portable biometric lighter

Seal ring structure and method of fabricating the same

Memory structure including elastic material based buffer column str...

Integrated circuit packages and methods of forming the same

Semiconductor chip with signal bump and dummy bump, semiconductor p...

Microelectronic assemblies having conductive structures with differ...

Three-dimensional memory device containing deformation resistant tr...

Power semiconductor devices with improved overcoat adhesion and/or...

Flexible electronic structure

Wafer bonding alignment

Semiconductor device including cumulative sealing structures

Extended seal ring structure on wafer-stacking

Semiconductor die with warpage release layer structure in package a...

Backside deposition tuning of stress to control wafer bow in semico...

Semiconductor wafer seal ring having protrusion extending into tren...

Methods and heat distribution devices for thermal management of chi...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device including interconnect structure with planariz...

Image sensor package and method of fabricating the same

Heterogeneous nested interposer package for IC chips

Semiconductor package with stiffener

Semiconductor structure having elastic member within via

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

LIGHTING-EMITTING DEVICE FILAMENT INCLUDING ELECTRODE PADS

DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DE...

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

ELECTRONIC DEVICE

APPARATUS, SYSTEM, AND METHOD FOR MITIGATING WARPAGE IN INTEGRATED...

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

SEMICONDUCTOR DEVICES COMPRISING STEPS AND RELATED METHODS

CRACKSTOP BARRIER ARCHITECTURE FOR HYBRID BONDED SEMICONDUCTOR PACK...

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

METHOD FOR REDUCING WARPAGE OCCURRED TO SUBSTRATE DURING PACKAGING...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

MEMORY DEVICE INCLUDING SUPPORT STRUCTURES