HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No. PCT/CN2023/096646, filed on May 26, 2023, which claims priority to Chinese Patent Application No. 202210912579.3, filed with the China National Intellectual Property Administration on Jul. 30, 2022 and entitled “HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE”, both of which are hereby incorporated by reference in its entirety.

TECHNICAL FIELD

This application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation apparatus and an electronic device.

BACKGROUND

In the pursuit of China's Carbon Peaking and Carbon Neutrality Goals, energy efficiency improvement in data centers has become a hot topic today. In an existing electronic device, there are usually a large quantity of hard disks and the total power consumption is large, which causes excessive heat generation in the hard disks. However, efficiency of heat conduction between an existing heat dissipation apparatus and a hard disk is relatively low, and heat dissipation performance is poor.

SUMMARY

This application provides a heat dissipation apparatus and an electronic device, to improve efficiency of heat conduction between the heat dissipation apparatus and hard disks and improve heat dissipation performance.

According to a first aspect, this application provides a heat dissipation apparatus, including a heat sink and a plurality of heat conduction components. The plurality of heat conduction components are connected to the heat sink, and the plurality of heat conduction components are arranged at intervals. One plug interface is formed between two adjacent heat conduction components, and the plug interface is used for one hard disk to be plugged in.

In a heat dissipation apparatus shown in this application, heat generated by a working hard disk may be first transferred to two adjacent heat conduction components, and then transferred to the heat sink through the two adjacent heat conduction components, thereby effectively improving heat conduction efficiency between the heat sink and the hard disk, improving heat dissipation performance of the heat sink for the hard disk, and implementing effective heat dissipation for the hard disk. When the heat dissipation apparatus is used in an electronic device, the electronic device can support deployment of high-density hard disks, and can further implement heat dissipation for the high-power hard disks.

In a possible implementation, the hard disk includes a first contact surface and a second contact surface that are disposed opposite to each other, and the first contact surface and the second contact surface are respectively in contact with two adjacent heat conduction components, to increase a contact area between the hard disk and the heat conduction components, improve efficiency of heat transfer between the hard disk and the heat conduction components, and improve heat dissipation performance of the heat dissipation apparatus for the hard disk.

In a possible implementation, both the first contact surface and the second contact surface are parallel to an extension direction of the hard disk, to ensure that a surface with a largest area of the hard disk is in contact with the heat conduction component, increase a contact area between the hard disk and the heat conduction component, improve efficiency of heat transfer between the hard disk and the heat conduction component, and improve heat dissipation performance of the heat dissipation apparatus for the hard disk.

In a possible implementation, the heat conduction component includes a body and at least one heat conduction member, and a material of the body is a heat conducting material. The body includes a third contact surface and a fourth contact surface that are disposed opposite to each other, the heat conduction member is located on at least one of the third contact surface and the fourth contact surface, and the heat conduction member is connected to the heat sink.

Heat generated by the working hard disk may be transferred to the heat conduction member, or may be transferred to the heat conduction member through the body, and then transferred to the heat sink through the heat conduction member, so as to effectively dissipate heat from the hard disk.

In a possible implementation, the heat conduction member is a heat pipe, to improve efficiency of heat transfer between the hard disk and the heat conduction member, and further improve efficiency of heat transfer between the hard disk and the heat conduction component.

Alternatively, when the heat conduction member is not on the contact surface on which the contact member is located, the contact member is directly in contact with the body.

Heat generated by the working hard disk may be transferred to the contact part, and then transferred to the heat conduction member through the contact member, or transferred to the heat conduction member through the contact member and the body, and finally transferred to the heat sink through the heat conduction member, thereby effectively dissipating heat from the hard disk.

In a possible implementation, the heat conduction component includes a body and at least one heat conduction member, and a material of the body is not a heat conducting material. The body includes a third contact surface and a fourth contact surface that are disposed opposite to each other, the heat conduction member is located on at least one of the third contact surface and the fourth contact surface that faces the hard disk, and the heat conduction member is connected to the heat sink.

Heat generated by the working hard disk can be transferred to the heat conduction member, and then transferred to the heat sink through the heat conduction member, so as to effectively dissipate heat from the hard disk.

In a possible implementation, the heat conduction component further includes at least one contact member, and the contact member is located on at least one of the third contact surface and the fourth contact surface on which the heat conduction member exists. The first contact surface is located on a side that is of the contact member and that is away from the body, and is in contact with the contact member.

Heat generated by the working hard disk may be transferred to the contact member, then transferred to the heat conduction member through the contact member, and finally transferred to the heat sink through the heat conduction member, to effectively dissipate heat from the hard disk.

In a possible implementation, the contact member is a spring plate to implement plugging and unplugging of the hard disk, which can not only increase effective contact area between the hard disk and the heat conduction component, but also achieve better contact between the hard disk and the heat conduction component, so that the heat of the hard disk can be transferred to the heat sink through heat conduction component more efficiently, thereby effectively dissipating heat from the hard disk.

In a possible implementation, the heat dissipation apparatus further includes a casing. A through groove is disposed on the casing, the heat sink is disposed on a side of the casing, and is disposed opposite to the through groove. The plurality of heat conduction components pass through the through groove, and portions of the plurality of heat conduction components that extend out of the through groove are connected to the heat sink.

In a possible implementation, the heat sink is a cold plate.

In a possible implementation, the heat sink is provided with a receiving chamber and a plurality of insertion ports, the receiving chamber accommodates a cooling medium, the plurality of insertion ports are in communication with the receiving chamber, one end of each heat conduction component is inserted into one insertion port, extends to the receiving chamber, and is immersed in the cooling medium.

According to a second aspect, this application provides an electronic device, including at least one hard disk and any one of the foregoing heat dissipation apparatuses, where each hard disk is plugged into one plug interface.

In an electronic device shown in this application, heat generated by the working hard disk may be transferred to the heat conduction component, and then to the heat sink through the heat conduction component. This can effectively improve efficiency of heat conduction between the heat sink and the hard disk, improve heat dissipation performance of the heat sink for the hard disk, and implement effective heat dissipation for the hard disk, so that the electronic device supports deployment of high-density hard disks and further implements heat dissipation for the high-power hard disks.

In a possible implementation, the electronic device further includes a hard disk backplane. The hard disk backplane is located on a side of the heat sink that faces the plurality of heat conduction components, and is electrically connected to the at least one hard disk. The hard disk can work based on an electrical signal provided by the hard disk backplane.

In a possible implementation, an avoidance space is disposed on the hard disk backplane. The avoidance space penetrates the hard disk backplane in a thickness direction of the hard disk backplane, and the plurality of heat conduction components pass through the avoidance space.

BRIEF DESCRIPTION OF DRAWINGS

To describe the technical solutions in embodiments of this application more clearly, the following describes the accompanying drawings required in the embodiments of this application.

FIG. 1 is a schematic diagram of a structure of an electronic device according to an embodiment of this application;

FIG. 2 is a schematic diagram of a structure of a hard disk in the electronic device shown in FIG. 1;

FIG. 3 is a schematic diagram of a structure of a second heat dissipation apparatus in the electronic device shown in FIG. 1;

FIG. 4 is a schematic diagram of an exploded structure of the second heat dissipation apparatus shown in FIG. 3;

FIG. 5 is a schematic diagram of a structure of a plurality of heat conduction components in the second heat dissipation apparatus shown in FIG. 3;

FIG. 6 is a schematic diagram of a structure of a heat conduction component shown in FIG. 5 in a first implementation;

FIG. 7 is a schematic diagram of an exploded structure of the heat conduction component shown in FIG. 6;

FIG. 8a is a schematic diagram of a structure of a heat conduction component shown in FIG. 5 in a second implementation;

FIG. 8b is a schematic diagram of a structure of the heat conduction component shown in FIG. 8a at another angle;

FIG. 9a is a schematic diagram of an exploded structure of the heat conduction component shown in FIG. 8a;

FIG. 9b is a schematic diagram of an exploded structure of the heat conduction component shown in FIG. 8b;

FIG. 10a is a schematic diagram of a structure of a heat conduction component shown in FIG. 5 in a third implementation;

FIG. 10b is a schematic diagram of a structure of the heat conduction component shown in FIG. 10a at another angle;

FIG. 11a is a schematic diagram of an exploded structure of the heat conduction component shown in FIG. 10a;

FIG. 11b is a schematic diagram of an exploded structure of the heat conduction component shown in FIG. 10b;

FIG. 12 is a schematic diagram of an assembly structure of a plurality of hard disks, a hard disk backplane, and a second heat dissipation apparatus in the electronic device shown in FIG. 1; and

FIG. 13 is a schematic diagram of an assembly structure of a heat sink and a heat conduction component of a second heat dissipation apparatus in a second electronic device according to an embodiment of this application.

DESCRIPTION OF EMBODIMENTS

The following clearly describes the technical solutions in embodiments of this application with reference to the accompanying drawings of embodiments of this application.

FIG. 1 is a schematic diagram of a structure of an electronic device 100 according to an embodiment of this application. Solid lines with arrows shown in FIG. 1 are flow paths of cooling medium.

The embodiment of this application provides the electronic device 100, and the electronic device 100 may be a device that requires an information storage, such as a computer, a router, a switch, and a server. An example in which the electronic device 100 is a server is used for description in the following. For ease of description, a length direction of the electronic device 100 is defined as an X-axis direction, a width direction of the electronic device 100 is defined as a Y-axis direction, a height direction of the electronic device 100 is defined as a Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

The electronic device 100 includes a housing 110, a memory module (not shown in the figure), a processor (not shown in the figure), hard disks 120, a hard disk backplane 130, and heat dissipation apparatuses 140. The memory module, the processor, the hard disks 120, the hard disk backplane 130, and the heat dissipation apparatuses 140 are installed inside the housing 110. There are two heat dissipation apparatuses 140 and a plurality of hard disks 120. The two heat dissipation apparatuses 140 are a first heat dissipation apparatus 140a and a second heat dissipation apparatus 140b. The first heat dissipation apparatus 140a is configured to dissipate heat from the memory module and the processor, and the second heat dissipation apparatus 140b is configured to dissipate heat from the plurality of hard disks 120. It should be noted that “a plurality of” mentioned in embodiments of this application refers to two or more.

The memory module, the processor, and the first heat dissipation apparatus 140a are located on a right side of the electronic device 100. The first heat dissipation apparatus 140a may conduct heat generated when the memory module and the processor work to the outside of the housing 110, so as to dissipate heat from the memory module and the processor. The processor may be a central processing unit (CPU).

It should be understood that, in embodiments of this application, orientation words “top”, “bottom”, “left”, “right”, “front”, “rear”, and the like mentioned for describing the electronic device 100 are described based on the directions shown in FIG. 3, with the positive Z-axis direction being “top”, the negative Z-axis direction being “bottom”, the negative X-axis direction being “left”, the positive X-axis direction being “right”, the positive Y-axis direction being “front”, and the negative Y-axis direction being “rear”, without imposing limitations on an actual application scenario of the second heat dissipation apparatus 140b.

In this embodiment, the first heat dissipation apparatus 140a includes a first heat sink 150 and a second heat sink 160. The first heat sink 150 is configured to dissipate heat from the memory module, and the second heat sink 160 is configured to dissipate heat from the processor. Both the first heat sink 150 and the second heat sink 160 are cold plates. It should be understood that the cold plate is a sealed heat sink that can contain the flow of liquid, and is usually fitted to a heat generating component by using a heat conducting interface material, so as to dissipate heat generated by the heat generating component. In some other embodiments, the first heat sink 150 and/or the second heat sink 160 may alternatively be other components capable of dissipating heat. This is not specifically limited in this application.

For example, there are four first heat sinks 150 and two second heat sinks 160. Every two first heat sinks 150 and one second heat sink 160 form a heat sink group (not marked in the figure). In some other embodiments, there may be one, two, three, or more than five first heat sinks 150, and/or there may be one or more than three second heat sinks 160.

The plurality of hard disks 120, the hard disk backplane 130, and the second heat dissipation apparatus 140b are located on one side of the electronic device 100. In this embodiment, the second heat dissipation apparatus 140b includes a plurality of heat conduction components 143 and a heat sink 142. In the Y-axis direction, the plurality of heat conduction components 143 are arranged at intervals. A plug interface 144 is formed between two adjacent heat conduction components 143. Each plug interface 144 is used for one hard disk 120 to be plugged in. The heat sink 142 is connected to the plurality of heat conduction components 143. The heat sink 142 is a cold plate. The hard disk backplane 130 is located on a side that is of the heat sink 142 and that is away from the first heat dissipation apparatus 140a, and the hard disk backplane 130 is disposed facing the plurality of plug interfaces 144. The plurality of hard disks 120 are plugged into the plurality of plug interfaces 144 in a one-to-one manner, and are electrically connected to the hard disk backplane 130.

The plurality of hard disks 120 may function based on electrical signals provided by the hard disk backplane 130. Heat generated by each working hard disk 120 may be transmitted to the heat sink 142 through two heat conduction components 143. The heat sink 142 transmits the heat to the outside of the housing 110, thereby implementing heat dissipation of the plurality of hard disks 120, to solve a heat dissipation problem of the high-density and high-power hard disks 120 in the electronic device 100, and reduce a working load of a cooling fan (not shown in the figure) in the electronic device 100.

In some other embodiments, the electronic device 100 may alternatively include one or more hard disks 120 and one or more virtual hard disks (not shown in the figure), and the one or more hard disks 120 and the one or more virtual hard disks are plugged into the plurality of plug interfaces 144 in a one-to-one manner. It should be understood that the virtual hard disk is a component that has the same external structure as the hard disk 120 but cannot work based on an electric signal provided by the hard disk backplane 130.

The following describes an internal flow path of cooling medium in the electronic device 100 by using the paths of the cooling medium shown in FIG. 1 as an example.

After the cooling medium such as coolant or cooling gas enters the inside of the housing 110, the cooling medium is split into three paths of cooling medium. One path of cooling medium directly enters the heat sink 142 of the second heat dissipation apparatus 140b, takes away heat transmitted to the heat sink 142 through the plurality of heat conduction components 143, and exits the housing 110, so as to dissipate heat from the plurality of hard disks 120. The other two paths of cooling medium flow through two heat sink groups respectively, and each path sequentially passes through a first heat sink 150, a second heat sink 160, and a first heat sink 150 of the heat sink group, and then flows out of the housing 110, so as to implement heat dissipation for the memory module and the processor.

It may be understood that, in this embodiment, the two heat sink groups of the first heat dissipation apparatus 140a and the heat sink 142 of the second heat dissipation apparatus 140b are disposed in parallel, and the three paths of cooling medium respectively flow through the two heat sink groups and the heat sink 142 of the second heat dissipation apparatus 140b, so that heat dissipation for the memory module, the processor, and the hard disks 120 can be maximized.

In some other embodiments, the two heat sink groups of the first heat dissipation apparatus 140a may alternatively be disposed in series. In this case, after the cooling medium enters the inside of the housing 110, the cooling medium is split into two paths of cooling medium, and the two paths of cooling medium respectively flow through the first heat dissipation apparatus 140a and the second heat dissipation apparatus 140b. Similarly, heat dissipation for the memory module, the processor, and the hard disks 120 can be implemented. This application sets no specific limitation on a connection manner of the two heat sink groups of the first heat dissipation apparatus 140a.

Refer to FIG. 1 and FIG. 2. FIG. 2 is a schematic diagram of a structure of the hard disk 120 in the electronic device 100 shown in FIG. 1.

In an embodiment, the hard disk 120 is in a rectangular shape. The hard disk 120 includes a first contact surface 121, a second contact surface 122, and a connection surface 123. The first contact surface 121 and the second contact surface 122 are disposed opposite to each other, and are respectively used to be in contact with two adjacent heat conduction components 143, so as to increase a contact area between the hard disk 120 and the heat conduction components 143, and to quickly transfer to the two heat conduction components 143 heat generated by the working hard disk 120, thereby improving efficiency of heat transfer between the hard disk 120 and the heat conduction components 143, and improving heat dissipation performance of the second heat dissipation apparatus 140b for the hard disk 120. Both the first contact surface 121 and the second contact surface 122 are parallel to an extension direction (in the X-axis direction shown in the figure) of the hard disk 120, so as to ensure that a surface with a largest area of the hard disk 120 is in contact with the heat conduction component 143, and to increase a contact area between the hard disk 120 and the heat conduction component 143. The connection surface 123 is connected between the first contact surface 121 and the second contact surface 122, and is used to electrically connect to the hard disk backplane 130, so as to implement electrical connection between the hard disk 120 and the hard disk backplane 130.

Refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of a structure of the second heat dissipation apparatus 140b in the electronic device 100 shown in FIG. 1, and FIG. 4 is a schematic diagram of an exploded structure of the second heat dissipation apparatus 140b shown in FIG. 3. FIG. 3 and FIG. 4 merely show four heat conduction components 143 of the second heat dissipation apparatus 140b.

The second heat dissipation apparatus 140b further includes a casing 145, an inlet pipe 146, and an outlet pipe 147. A through groove (not marked in the figure) is disposed on the casing 145, and the through groove accommodates a plurality of heat conduction components 143 to protect the plurality of heat conduction components 143. Both the inlet pipe 146 and the outlet pipe 147 are in communication with the heat sink 142. The inlet pipe 146 inputs a cooling medium outside the housing 110 (as shown in FIG. 1) to the heat sink 142, and the outlet pipe 147 outputs the cooling medium from the heat sink 142 to the outside of the housing 110, so as to transmit heat to the outside of the housing 110, thereby implementing heat dissipation for the plurality of hard disks 120.

The casing 145 includes a first casing 148 and a second casing 149. Both the first casing 148 and the second casing 149 are fixedly connected to the plurality of heat conduction components 143, and jointly form the through groove through enclosing. A left end face of the first casing 148 and a left end face of the second casing 149 jointly form a first opening 145a through enclosing, and a right end face of the second casing 149 and a right end face of the second casing 149 jointly form a second opening 145b through enclosing. For example, both the first casing 148 and the second casing 149 may be fixedly connected to the plurality of heat conduction components 143 by using fasteners such as screws or bolts. In some other embodiments, the first casing 148 and the second casing 149 may alternatively be fixedly connected to the plurality of heat conduction components 143 in a welding or bonding manner. This is not specifically limited in this application.

The heat sink 142 is disposed on a side of the casing 145, and is spaced apart from the casing 145. Specifically, the heat sink 142 is located on a side of the second opening 145b away from the first opening 145a, and is disposed facing the through groove. The heat sink 142 is provided with an insertion port 142a, a receiving chamber (not shown in the figure), an inlet port 142b, and an outlet port 142c. An opening of the insertion port 142a is located on a surface that is of the heat sink 142 and that faces the casing 145. There are a plurality of insertion ports 142a. The plurality of insertion ports 142a are arranged at intervals along the Y-axis direction, and are disposed facing the plurality of heat conduction components 143 in a one-to-one manner. For example, there are four insertion ports 142a. In some other embodiments, there may alternatively be one, two, three, or more than five insertion ports 142a. This is not specifically limited in this application.

The receiving chamber is disposed inside the heat sink 142, and is used to receive a cooling medium. A plurality of heat dissipation fins may be disposed in the receiving chamber, so as to increase heat dissipation efficiency of the heat sink 142. The inlet port 142b and outlet port 142c are arranged at an interval, and both are in communication with the receiving chamber. Specifically, both openings of the inlet port 142b and the outlet port 142c are disposed on a side surface of the heat sink 142. The inlet pipe 146 is inserted into the inlet port 142b to input a cooling medium outside the housing 110 to the receiving chamber through the inlet port 142b. The outlet pipe 147 is inserted into the outlet port 142c to output the cooling medium in the receiving chamber to the outside of the housing 110 through the outlet port 142c.

Refer to FIG. 3 and FIG. 5. FIG. 5 is a schematic diagram of a structure of the plurality of heat conduction components 143 in the second heat dissipation apparatus 140b shown in FIG. 3.

The plurality of heat conduction components 143 pass through the through groove, and portions of the plurality of heat conduction components 143 that extend out of the through groove are connected to the heat sink 142. Specifically, in each heat conduction component 143, a portion of the heat conduction component 143 is located between the first opening 145a and the second opening 145b. A portion of the heat conduction component 143 extends out of the second opening 145b, and is inserted into the insertion port 142a and connected to the heat sink 142. One plug interface 144 is formed between two adjacent heat conduction components 143, and a plurality of plug interfaces 144 are in communication with the first opening 145a and the second opening 145b. Each plug interface 144 is used for one hard disk 120 to be plugged in.

It should be noted that structures of the plurality of heat conduction components 143 may be one or more of the following heat conduction components 143. The structures of the plurality of heat conduction components 143 may be the same or different. The following specifically describes several different structures of the heat conduction component 143.

Refer to FIG. 6 and FIG. 7. FIG. 6 is a schematic diagram of a structure of a heat conduction component 143 shown in FIG. 5 in a first implementation. FIG. 7 is a schematic diagram of an exploded structure of the heat conduction component 143 shown in FIG. 6.

In this embodiment, the heat conduction component 143 extends in the X-axis direction. The heat conduction component 143 includes a body 10, a heat conduction member 20, and a contact member 30. Both the heat conduction member 20 and the contact member 30 are installed on the body 10.

The body 10 includes a third contact surface 101 and a fourth contact surface 102, and the third contact surface 101 and the fourth contact surface 102 are disposed opposite to each other. The third contact surface 101 is a surface of the body 10 that faces the negative direction of the Y-axis, and the fourth contact surface 102 is a surface of the body 10 that faces the positive direction of the Y-axis. The body 10 is provided with a first mounting groove 103 and a second mounting groove 104. An opening of the first mounting groove 103 is located on the third contact surface 101. The first mounting groove 103 is recessed in a direction from the third contact surface 101 to the fourth contact surface 102 (the Y-axis positive direction shown in the figure). An opening of the second mounting groove 104 is located on a groove bottom wall of the first mounting groove 103. The second mounting groove 104 is recessed in a direction from the groove bottom wall of the first mounting groove 103 to the fourth contact surface 102 (the Y-axis positive direction shown in the figure). A material of the body 10 may be a heat conducting material. For example, the material of the body 10 is a metal material with a relatively high heat conductivity coefficient such as copper or aluminum.

The heat conduction member 20 is located on one of the third contact surface 101 and the fourth contact surface 102. In this implementation, the heat conduction member 20 is located on the third contact surface 101. Specifically, the heat conduction member 20 is installed in the second mounting groove 104. The heat conduction member 20 includes an auxiliary surface 201 facing the same direction as the opening direction of the second mounting groove 104. The auxiliary surface 201 is flush with the groove bottom wall of the first mounting groove 103. The heat conduction member 20 may use a size of the body 10 in the Y-axis direction, which helps reduce a size of the heat conduction component 143 in the Y-axis direction.

In some other implementations, the auxiliary surface 201 may not be flush with the groove bottom wall of the first mounting groove 103. For example, the auxiliary surface 201 is recessed relative to the groove bottom wall of the first mounting groove 103, or the auxiliary surface 201 protrudes relative to the groove bottom wall of the first mounting groove 103. This is not specifically limited in this application.

The heat conduction member 20 is a heat pipe, to ensure high heat conductivity of the heat conduction member 20. For example, the heat conduction member 20 may be installed in the second mounting groove 104 through welding. It should be understood that the heat pipe is a heat transfer element with extremely high heat conductivity, and heat is transmitted through evaporation and condensation of liquid in the fully enclosed vacuum pipe. For example, the heat pipe is a long-strip-shaped flat tube made of copper. In some other embodiments, the heat conduction member 20 may alternatively be another heat conduction device with high heat conductivity. This is not specifically limited in this application.

The contact member 30 is located on a contact surface that is in the third contact surface 101 and the fourth contact surface 102 where the heat conduction member 20 exists. In this implementation, the contact member 30 is located on the third contact surface 101. Specifically, the contact member 30 is installed in the first mounting groove 103, and is in contact with the auxiliary surface 201 of the heat conduction member 20. The contact member 30 is in contact with the hard disk 120 (as shown in FIG. 2). In this case, the first contact surface 121 of the hard disk 120 is located on a side of the contact member 30 away from the body 10, and is in contact with the contact member 30.

In an embodiment, the contact member 30 is a spring plate. In an example, the contact member 30 is installed on the body 10 through welding. A material of the contact member 30 is a heat conducting material. For example, the material of the contact member 30 is a material with a relatively high heat conductivity coefficient such as beryllium copper.

Specifically, the contact member 30 includes a body part 31 and a spring plate part 32, and the spring plate part 32 is fixedly connected to the body part 31. The spring plate part 32 is in contact with the hard disk 120. The body part 31 is installed in the first mounting groove 103, and is in contact with the auxiliary surface 201 of the heat conduction member 20. A plurality of mounting holes 33 are disposed on the body part 31, and each mounting hole 33 penetrates the body part 31 in a thickness direction (the Y-axis direction shown in the figure) of the body part 31. The plurality of mounting holes 33 are arranged at intervals in an extension direction (the X-axis direction shown in the figure) of the body part 31.

There are a plurality of spring plate parts 32. Each spring plate part 32 is fixedly connected to the left edge of one mounting hole 33. Each spring plate part 32 extends in the positive X-axis direction, and is spaced from the right edge of the mounting hole 33. Specifically, each spring plate part 32 protrudes, from a surface of the body part 31 away from the heat conduction member 20. Each spring plate part 32 is in a wave shape, to increase elasticity of the spring plate part 32. In addition, a plurality of through holes 34 are disposed on each spring plate part 32. The plurality of through holes 34 are arranged at intervals in the Z-axis direction. An extension direction of each through hole 34 is parallel to an extension direction of the spring plate part 32, to increase elasticity of the spring plate part 32.

In some other embodiments, the heat conduction component 143 may alternatively not include the contact member 30. In this case, heat generated by the working hard disk 120 may be transferred to the heat conduction member 20 and transferred to the body 10, and then to the heat sink 142 through the heat conduction member 20 and the body 10. Alternatively, the hard disk is in contact with the surface on which no heat conduction member 20 exists, for example, the hard disk is in contact with the fourth contact surface 102, and the heat conduction member 20 is located on the third contact surface 101. In this case, heat generated when the hard disk 120 works may be transferred from the body 10 to the heat conduction member 20, and then is transferred to the heat sink 142 through the heat conduction member 20 and the body 10.

Alternatively, the material of the body 10 may be a non-heat conducting material. The heat conduction member 20 is located on one of the third contact surface 101 and the fourth contact surface 102 that faces the hard disk 120, and the contact member 30 is located on one of the third contact surface 101 and the fourth contact surface 102 where the heat conduction member 20 exists. In this case, heat generated by the working hard disk 120 may be transferred to the heat conduction member 20 through the contact member 30, and then to the heat sink 142 through the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120.

Refer to FIG. 8a, FIG. 8b, FIG. 9a, and FIG. 9b. FIG. 8a is a schematic diagram of a structure of the heat conduction component 143 shown in FIG. 5 in a second implementation. FIG. 8b is a schematic diagram of a structure of the heat conduction component 143 shown in FIG. 8a at another angle. FIG. 9a is a schematic diagram of an exploded view of the heat conduction component 143 shown in FIG. 8a. FIG. 9b is a schematic diagram of an exploded view of the heat conduction component 143 shown in FIG. 8b.

The heat conduction component 143 includes a body 10, a heat conduction member 20, and a contact member 30. Both the heat conduction member 20 and the contact member 30 are installed on the body 10. A difference between the heat conduction component 143 shown in the present embodiment and the heat conduction component 143 shown in the foregoing first implementation is that the contact member 30 and the heat conduction member are located on different contact surfaces. For example, an opening of the first mounting groove 103 is located on the fourth contact surface 102. The first mounting groove 103 is recessed in a direction from the fourth contact surface 102 to the third contact surface 101 (the Y-axis negative direction shown in the figure). An opening of the second mounting groove 104 is located on the third contact surface 101. The second mounting groove 104 is recessed in a direction from the third contact surface 101 to the fourth contact surface 102 (the Y-axis positive direction shown in the figure). Structures of the body 10, the heat conduction member 20, and the contact member 30 of the heat conduction component 143 are basically the same as the structures of the body 10, the heat conduction member 20, and the contact member 30 of the heat conduction component 143 in the foregoing first implementation, and details are not described herein again.

Refer to FIG. 2 and FIG. 3. In an embodiment, portions of the body 10 and the heat conduction member 20 that extend out of the second opening 145b are inserted into the insertion port 142a, and are connected to the heat sink 142. Similar to an embodiment described earlier, a material of the body 10 may be a heat conducting material. When the hard disk 120 is in contact with a side where the contact member exists, heat generated by the working hard disk 120 may be transferred to the body 10 through the contact member 30, then to the heat conduction member 20 through the body 10, and finally to the heat sink 142 through the body 10 and the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120. When the hard disk 120 is in contact with a side where the heat conduction member exists, heat generated by the working hard disk 120 may be transferred to the body 10 through the heat conduction member 20, then to the contact member 30 through the body 10, and finally to the heat sink 142 through the body 10 and the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120.

Alternatively, the material of the body 10 may be a non-heat conducting material. The heat conduction member 20 is located on one of the third contact surface 101 and the fourth contact surface 102 that faces the hard disk 120, and the contact part 30 is located on the other contact surface. In this case, heat generated by the working hard disk 120 may be transferred to the heat sink 142 through the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120.

Refer to FIG. 10a, FIG. 10b, FIG. 11a, and FIG. 11b. FIG. 10a is a schematic diagram of a structure of the heat conduction component 143 shown in FIG. 5 in a third implementation. FIG. 10b is a schematic diagram of a structure of the heat conduction component 143 shown in FIG. 10a at another angle. FIG. 11a is a schematic diagram of an exploded view of the heat conduction component 143 shown in FIG. 10a. FIG. 11b is a schematic diagram of an exploded view of the heat conduction component 143 shown in FIG. 10b.

The heat conduction component 143 includes a body 10, a heat conduction member 20, and two contact members 30. Both the heat conduction member 20 and the contact members 30 are installed on the body 10. A difference between the heat conduction component 143 shown in this embodiment and the heat conduction component 143 shown in a foregoing implementation lies in that there are two contact members 30 in this embodiment. The two contact members 30 are a first contact member 31 and a second contact member 32, the first contact member 31 is located on a third contact surface 101, and the second contact member 32 is located on a fourth contact surface 102. Structures of the body 10, the heat conduction member 20, and the contact members 30 of the heat conduction component 143 are basically the same as the structures of the body 10, the heat conduction member 20, and the contact member 30 in a foregoing implementation, and details are not described herein again.

In addition, the body 10 is further provided with a third mounting groove 105, and an opening of the third mounting groove 105 is located on the fourth contact surface 102. The third mounting groove 105 is recessed in a direction from the fourth contact surface 102 to the third contact surface 101 (the Y-axis negative direction shown in the figure). The first contact member 31 is installed in the first mounting groove 103, and is in contact with an auxiliary surface 201 of the heat conduction member 20. The second contact member 32 is installed in the third mounting groove 105.

Refer to FIG. 2 and FIG. 3. In an embodiment, portions of the body 10 and the heat conduction member 20 that extend out of the second opening 145b are inserted into the insertion port 142a, and are connected to the heat sink 142. Similar to an embodiment described earlier, a material of the body 10 may be a heat conducting material. When the hard disk 120 is in contact with the first contact member 31, heat generated when the hard disk 120 works may be transferred to the body 10 and the heat conduction member 20 through the first contact member 31, and then to the heat sink 142 through the body 10 and the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120 on the rear side of the heat conduction component 143. When the hard disk 120 is in contact with the second contact member 32, heat generated when the hard disk 120 works may be transferred to the body 10 through the second contact member 32, and then to the heat sink 142 through the body 10 and the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120 on the front side of the heat conduction component 143.

Alternatively, the material of the body 10 may be a non-heat conducting material. The heat conduction member 20 is located on at least one of the third contact surface 101 and the fourth contact surface 102 that faces the hard disk 120, and the contact members 30 are located on two of the third contact surface 101 and the fourth contact surface 102. In this case, heat generated by the working hard disk 120 may be transferred to the heat conduction member 20 through the contact member 30, and then to the heat sink 142 through the heat conduction member 20, thereby implementing heat dissipation for the hard disk 120.

In some other implementations, there may be two heat conduction members 20, and the two heat conduction members 20 are a first heat conduction member and a second heat conduction member. The body 10 may be further provided with a fourth mounting groove (not shown in the figure), and an opening of the fourth mounting groove is located on a groove bottom wall of the third mounting groove 105. The fourth mounting groove is recessed in a direction from the groove bottom wall of the third mounting groove 105 to the third contact surface 101 (the Y-axis negative direction shown in the figure). The first heat conduction member is installed in the second mounting groove 104, the second heat conduction member is installed in the fourth mounting groove, and the second contact member 32 is installed in the third mounting groove 105, and the second contact member 32 is in contact with the second heat conduction member. In this case, when the hard disk 120 is in contact with the first contact member 31, heat generated when the hard disk 120 works may be transferred to the first heat conduction member and the body 10 through the first contact member 31, and may be further transferred to the second heat conduction member through the body 10 and then to the heat sink 142 through the body 10, the first heat conduction member, and the second heat conduction member, to implement heat dissipation for the hard disk 120. When the hard disk 120 is in contact with the second contact member 32, heat generated when the hard disk 120 works may be transferred to the second heat conduction member and the body 10 through the second contact member 32, and may be further transferred to the first heat conduction member through the body 10 and then to the heat sink 142 through the body 10, the first heat conduction member, and the second heat conduction member, thereby implementing heat dissipation for the hard disk 120.

Alternatively, when there may be two heat conduction members 20, the heat conduction component 143 may not include the first contact member 31, or may not include the second contact member 32.

It should be noted that when there are two heat conduction members 20, because the heat conduction members are disposed on both contact surfaces of the body, the body may be a heat conducting material or may be a non-heat conducting material, and the hard disk 120 may be in contact with either of the contact surfaces of the heat conduction component.

In conclusion, the heat conduction component 143 may include the body and at least one heat conduction member. The body includes the third contact surface and the fourth contact surface that are disposed opposite to each other, and portions of the body and portions of the heat conduction member that extend out of the second opening 145b are inserted into the insertion port 142a, and are connected to the heat sink 142.

When the material of the body is a heat conducting material, the heat conduction member is located on at least one of the third contact surface and the fourth contact surface, and the heat conduction member is connected to the heat sink. For example, the heat conduction member may be a heat pipe. The heat conduction component may further include at least one contact member, and the contact member is located on at least one of the third contact surface and the fourth contact surface.

When the heat conduction member is disposed on a contact surface on which the contact member is located, the contact member is located on a side that is of the heat conduction member and that is away from the body, and is in contact with the heat conduction member. Alternatively, when there is no heat conduction member on the contact surface on which the contact member is located, the contact member is directly in contact with the body. For example, the contact member may be a spring plate.

When the material of the body is not a heat conducting material, the heat conduction member is located on at least one of the third contact surface and the fourth contact surface that faces the hard disk, and the heat conduction member is connected to the heat sink. For example, the heat conduction member may be a heat pipe. The heat conduction component may further include at least one contact member, and the contact member is located on at least one of the third contact surface and the fourth contact surface on which the heat conduction member exists. The contact member is located on a side that is of the heat conduction member and that is away from the body, and is in contact with the heat conduction member. For example, the contact member may be a spring plate.

Refer to FIG. 5. In an embodiment, the plurality of heat conduction components 143 include two first heat conduction components 143a and at least one heat conduction component 143b. It should be understood that the division of the first heat conduction component 143a and the second heat conduction component 143b is based on a location of each heat conduction component 143. The two first heat conduction components 143a are heat conduction components 143 located on outermost sides, and the second heat conduction component 143b is a heat conduction component 143 located in the middle, and is located between the two first heat conduction components 143a.

Specifically, the two first heat conduction components 143a have a same structure. The two first heat conduction components 143a are respectively a first front heat conduction component 143c and a first rear heat conduction component 143d. The first front heat conduction component 143c is the headmost heat conduction component 143, and the first rear heat conduction component 143d is the backmost heat conduction component 143. The first front heat conduction component 143c uses the structure of the heat conduction component 143 shown in the foregoing first implementation, and the heat conduction member is disposed in a direction facing the hard disk, that is, is disposed backward. The first rear heat conduction component 143d also uses the structure of the heat conduction component 143 shown in the foregoing first implementation, and the heat conduction member is disposed in a direction facing the hard disk, that is, is disposed forward. The second heat conduction component 143b uses the structure of the heat conduction component 143 shown in the foregoing third implementation.

It may be understood that in some other embodiments, the first front heat conduction component 143c may alternatively use the structure of the heat conduction component 143 shown in the foregoing second or third implementation, and/or the first rear heat conduction component 143d may use the structure of the heat conduction component 143 shown in the foregoing first or third implementation, and/or the second heat conduction component 143b may use the structure of the heat conduction component 143 shown in the foregoing first or second implementation.

For example, there are two heat conduction components 143b. Portions that are of the two first heat conduction components 143a and that extend out of the second opening 145b are inserted into the four insertion ports 142a of the heat sink 142 respectively, and are connected to the heat sink 142. Portions that are of the two second heat conduction components 143b and that extend out of the second opening 145b are inserted into the four insertion ports 142a of the heat sink 142 respectively, and are connected to the heat sink 142. So the connection between the plurality of heat conduction components 143 and the heat sink 142 can be implemented. In some other embodiments, there may alternatively be one or at least three second heat conduction components 143b. This is not specifically limited in this application.

Refer to FIG. 2 and FIG. 12. FIG. 12 is a schematic diagram of an assembly structure of the plurality of hard disks 120, the hard disk backplane 130, and the second heat dissipation apparatus 140b in the electronic device 100 shown in FIG. 1.

The hard disk backplane 130 is located between the heat sink 142 and the casing 145, and is disposed at intervals from the heat sink 142 and the casing 145. An avoidance space (not shown in the figure) is disposed on the hard disk backplane 130, and the avoidance space penetrates the hard disk backplane 130 in a thickness direction (the X-axis direction shown in the figure) of the hard disk backplane 130. Specifically, portions of the plurality of heat conduction components 143 that extend out of the second opening 145b pass through the avoidance space. The hard disk backplane 130 is a circuit board.

The plurality of hard disks 120 are inserted into the plurality of plug interfaces 144 respectively from the first opening 145a, extend out of the second opening 145b, and are electrically connected to the hard disk backplane 130. Specifically, the first contact surface 121 and the second contact surface 122 of the hard disk 120 are respectively in contact with the contact members of two adjacent heat conduction components 143, and the connection surface 123 is electrically connected to the hard disk backplane 130. The hard disk 120 may work based on an electrical signal provided by the hard disk backplane 130, and the heat of the hard disk 120 may be transferred to the heat conduction component 143 through the first contact member or the second contact member, and is transferred to the heat sink 142 through the heat conduction component 143, so as to effectively dissipate heat from the hard disk 120.

For a hard disk 120 located between two heat conduction components 143, a first contact surface 121 is in contact with a contact member 30 of one heat conduction component 143, and a second contact surface 122 is in contact with a contact member 30 of the other heat conduction component 143. It should be noted that, because the contact member of the heat conduction component 143 is a spring plate, when the hard disk 120 is plugged into the plug interface 144, plugging and unplugging of the hard disk 120 can be implemented by using the spring plate part 32a, and an effective contact area between the hard disk 120 and the heat conduction component 143 can be increased, so that the hard disk 120 and the heat conduction component 143 can be in better contact, and the heat of the hard disk 120 can be transferred to the heat sink 142 through the heat conduction component 143 more efficiently, to implement effective heat dissipation for the hard disk 120. In this way, the electronic device 100 supports deployment of the high-density hard disks 120, and heat dissipation can be further implemented for the large-power hard disks 120.

Refer to FIG. 13. FIG. 13 is a schematic diagram of an assembly structure of a heat sink 142 and a heat conduction component 143 of a second heat dissipation apparatus in a second electronic device according to an embodiment of this application. Solid lines with arrows shown in FIG. 1 are flow paths of cooling medium.

A difference between the heat sink of the heat dissipation apparatus in the electronic device shown in this embodiment of this application and the heat sink 142 of the heat dissipation apparatus 140 in the electronic device 100 shown in a foregoing embodiment is that the heat sink 142 is an immersed heat sink. Specifically, an insertion port 142a of the heat sink 142 is in communication with a receiving chamber 142d. A cooling medium is accommodated in the receiving chamber 142d of the heat sink 142. A liquid level of the cooling medium is higher than the insertion port 142a. Both an inlet port 142b and an outlet port 142c of the heat sink 142 are higher than the liquid level of the cooling medium. A cooling medium enters the receiving chamber 142d through the inlet port 142b and is output from the receiving chamber 142d through the outlet port 142c, to replace the cooling medium in the receiving chamber 142d.

One end of the heat conduction component 143 is inserted into the insertion port 142a, extends into the receiving chamber 142d, and is immersed in the cooling medium. Heat generated by the working hard disk 120 is transferred to the cooling medium through the heat conduction component 143, and the heat is transferred to the outside through replacement of the cooling medium, thereby implementing heat dissipation for the hard disk 120.

In an embodiment, heat generated by the working hard disk 120 may be transferred to the heat conduction component 143 through a first contact surface 121 and a second contact surface 122, and then transferred to the heat sink 142 through the heat conduction component 143. This can effectively improve efficiency of heat conduction between the heat dissipation apparatus 140 and the hard disk 120, improve heat dissipation performance of the heat dissipation apparatus 140 for the hard disk 120, and implement effective heat dissipation for the hard disk 120, so that the electronic device 100 can further implement heat dissipation for high-power hard disks 120 while supporting deployment of the high-density hard disks 120.

The foregoing descriptions are merely specific implementations of this application, and are not intended to limit the protection scope of this application. Any change or replacement readily devised by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Under non-conflicting circumstances, the embodiments of this application and features in the embodiments may be mutually combined. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

	Number	Date	Country
Parent	PCT/CN2023/096646	May 2023	WO
Child	18918937		US

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE

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