1. Technical Field
The present disclosure relates to heat dissipation apparatuses, particularly to a heat dissipation apparatus for an electronic device.
2. Description of Related Art
Heat dissipating apparatus performs critical functions of removing heat from a computer system. A Balanced Technology Extended (BTX) dissipating apparatus may be used in a Small Form Factor (SFF) computer chassis, wherein the SFF has a small volume. The BTX dissipating apparatus includes a heat dissipating device and a fan. However, an additional securing member is needed to secure the fan to the device. Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The heating dissipating device 10 includes a heat conduction core 11 and a plurality of fins 12 around the heat conduction core 11. Each of the plurality of fins 12 is arcuate. Four pairs of securing fin assemblies 125 are evenly arranged among the plurality of fins 12. Each of the four pairs of securing fin assemblies 125 includes a first securing fin 121 and a second securing fin 123 adjacent to the first securing fin 121. The first securing fin 121 and the second securing fin 123 all extend out of the plurality of fins 12, and a length of the first securing fin 121 is less than that of the second securing fin 123. A first securing hole 124 is defined in the first securing fin 121, and a second securing hole 126 is defined in the second securing fin 123. In one embodiment, the first securing hole 124 includes a cutout (not labeled).
The fan 20 includes an outer frame 21, and a receiving hole 201 is defined in the outer frame 21. A plurality of fan blades 202 are received in the receiving hole 201. The outer frame 21 includes a top panel 23 and bottom panel 24. The top panel 23 defines four mounting holes 231 arranged at the four corners of the top panel 23. Four fixing holes 241, arranged at the four corners of the bottom panel 24, are defined in the bottom panel 24. The four fixing holes 241 correspond to the first securing holes 124.
The air guiding duct 30 is hollow and defines an air guiding opening 31. Four securing posts 32 and four clipping portions 34 extend from a side of the air guiding duct 30. Each of the four clipping portions 34 is adjacent to each of the four securing posts 32. In one embodiment, a cross-section of the air guiding duct 30 is rectangular, and the air guiding opening 31 is rectangular. A size of the air guiding opening 31 is substantially equal to that of the receiving hole 201.
Referring to
The four securing posts 32 are engaged in the four mounting holes 231, and the four clipping portions 34 are engaged with the top panel 23, to secure the air guiding duct 30 to the fan 20. At this point, the air guiding opening 31 corresponds to the fan 20.
Referring to
When the heat dissipating apparatus is secured to the circuit board 50, the heat conduction core 11 abuts the heat generating component 51. The four second securing holes 126 are aligned with the four positioning holes 53. Four mounting members 70 are engaged in the four second securing holes 126 and the four positioning holes 53, to secure the heat dissipating apparatus to the circuit board 50. The heat generated by the heat generating component 51 is transmitted to the heat conduction core 11. The heat conduction core 11 transmits the heat to the plurality of fins 12. The fan 20 can dissipate the heat from of the plurality of fins 12 via the air guiding opening 31.
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201110250839.7 | Aug 2011 | CN | national |