Patent Application
20180192545
The subject matter herein generally relates to a heat dissipation apparatus. More specifically, the subject matter herein relates to a heat dissipation device having a portion extending away from the base.
Heat sinks, or heat dissipation apparatus, are commonly used with electronic devices to improve heat dissipation and/or heat rejection thereby increasing performance of the associated electronic devices. Heat sinks utilize fin arrays and/or an airflow across the fin array to increase the exposed surface area for rejecting heat from the electronic device to the environment. A heat dissipation apparatus can include a heat pipe and/or a vapor chamber within the base to abuttingly engage the electronic device to extract increase heat transfer away from the electronic device to the fin array. However, the base in such devices typically provides a limited surface area for implementing a heat pipe or vapor chamber.
A heat dissipation apparatus is provided having a base, a heat dissipater, and a plurality of fin arrays. The heat dissipater has at least one horizontal portion disposed in the base and at least one portion extending therefrom. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one portion extending from the base of the heat dissipater.
The at least one portion extending from the heat dissipater can be two vertically extending portions. The two vertically extending portions can be evenly spaced along the base and form a substantially twin “T” shape. The at least one portion extending from the heat dissipater can alternatively be three vertically extending portions.
The heat dissipater can be a vapor chamber, or the heat dissipater can be a base plate coupled with one or more heat pipes. The base plate can form a bottom surface of the base. The one or more heat pipes can be a plurality of heat pipes, at least one heat pipe disposed in the at least one portion extending from the base and at least one heat pipe disposed in the at least one horizontal portion. In some instances, the base plate can be a vapor chamber forming a bottom surface the base and one or more heat pipes forming the one or more portions extending from the vapor chamber.
The at least one fin array coupled to with the at least one horizontal portion can extend substantially perpendicular to the horizontal portion and the at least one fin array coupled with the at least one portion extending from the base can extend substantially perpendicular to the extending portion.
The at least one fin array coupled to with the at least one horizontal portion can radially extend relative to the horizontal portion and the at least one fin array coupled with the at least one extending portion can radially extend relative to the vertical portion.
In some instances, the base can has at least one horizontal portion having an upper surface and disposed in the base and at least one portion extending away from the upper surface. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one portion extending away from the upper surface.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures, wherein:
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “substantially” is defined to be essentially conforming to the particular dimension, shape or other word that substantially modifies, such that the component need not be exact. For example, substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
The present disclosure relates to a heat dissipation apparatus having a base, a heat dissipater, and a plurality of fin arrays. The heat dissipater has at least one horizontal portion having an upper surface and disposed in the base and at least one portion extending away from the upper surface. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one portion extending away from the upper surface.
The heat dissipater 104 can have at least one horizontal portion 110 having an upper surface 112 and at least one vertical portion 114 extending away therefrom. The upper surface 112 can be coupled with one or more of the plurality of fin arrays 106. The at least one vertical portion 114 can have an exterior surface 116 and the exterior surface 116 can be coupled with one or more of the plurality of fin arrays 106. The at least one horizontal portion 110 is disposed in the base 102 and configured to be at least partially exposed to the heat source via the bottom surface 108 of the base 102. The heat dissipater 104 can formed of any thermally conductive material including, but not limited to copper, aluminum, or a combination thereof.
The plurality of fin arrays 106 are coupled with the heat dissipater 104 and increase the rejection of thermal energy from the heat source to the environment. At least one of the plurality of fin arrays 106 can be coupled with the base 102, the at least one horizontal portion 110 of the heat dissipater 104, and/or the at least one vertical portion 114. The heat dissipater 104 having the horizontal portion 110 and the vertical portion 114 can reduce the overall length of each fin within a fin array 106, thus increasing the efficiency of the plurality of fin arrays 106 while maintaining the surface area of the plurality of fin arrays 106.
The plurality of fin arrays 106 can increase the exposed surface area of the heat dissipater 104, thereby improving the rejection of thermal energy transferred from the heat source to the heat dissipater 104.
The heat dissipation apparatus 100 can be implemented with a fan (not shown) generating an air flow across the plurality of fin arrays 106, thereby increasing heat transfer from the plurality of fin arrays 106 to the environment. Fan power requirements can be determined by the arrangement of the heat dissipation apparatus 100 and the pressure drop (Δp) associated with airflow across the heat dissipation apparatus 100. Fin thickness of the plurality of fin arrays 106 and arrangement and orientation of the plurality of fin arrays can alter the associated pressure drop and thus alter the fan power requirements for the heat dissipation apparatus.
The heat pipe 208 can be a substantially circular tube having opposing ends. The heat pipe 208 is vacuum sealed tube having a working fluid disposed therein. As the working fluid absorbs thermal energy it boils to a vapor and travels from one end to the opposing end where it condenses back to a liquid, thus transferring the heat away from the one end and to the opposing end. The heat pipe 208 can also include a wicking material configured to allow the condensed working fluid to transition back to the one end of the heat pipe 208. The one end of the heat pipe 208 is adjacent and/or engaged with the heat source and the opposing end is disposed away from the heat source. The heat transfer of the heat pipe 208 is along the length of the heat pipe 208 from one end to the other, thus unidirectional. The heat pipe 208 can be made of any highly thermally conductive material, including but not limited to, copper, aluminum, or an alloy thereof. In some instances, at least a portion of the base 202 is constructed of a similarly highly thermally conductive material.
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Each of the two horizontal heat pipes 210 and the three vertical heat pipes 212 can have a curved, or substantially U-shape, maximizing total length of the heat pipes 208. The two horizontal heat pipes can be placed within the base such that one horizontal heat pipe 210 has an end within an inner portion 214 of the substantially U shape formed by the other horizontal heat pipe 210.
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While the illustrated embodiment shows the at least one vapor chamber 312 extending away from the base 302 in a substantially vertical arrangement, it is within the scope of this disclosure to vary the angle at which the at least one vapor chamber 312 extends away from the base 302. In some instances, the at least vapor chamber 312 can extend away from the base at an angle between 15 degrees and 75 degrees.
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While the illustrated embodiment details three vertically extending fin arrays 118 and three horizontally extending fin arrays 120, any number of fin arrays 106 can be implemented in a vertical or horizontal arrangement without deviating from the scope of the present disclosure. For example, the heat dissipation apparatus 100 can have two, four, five, six or any number of vertically extending fin arrays 118 in conjunction with two, four, five, six or any number of horizontally extending fin arrays 120.
Further, while the plurality of fin arrays 106 are detailed in a vertical or horizontal arrangement, the plurality of fin arrays 106 can be disposed at any angle relative to the respective heat dissipater 104. For example, each of the plurality of fin arrays 106 can radially extend away from the heat dissipater. In other instances, horizontal, vertical, and a radially extending fin arrays 106 can be implemented together depending on the configuration of the heat dissipater 104.
It is believed the exemplary embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
