Patent Application
20230413479
The present disclosure relates to the technical field of heat dissipation for an electronic device, and specifically to a heat-dissipation assembly, a housing assembly, and an electronic device.
With the continuous improvement of Internet technology, electronic devices are becoming an increasingly important part of people's daily lives. Although the widespread popularity of electronic devices has led to an increasing variety of design patterns, it is still not sufficient to meet the increasingly diverse needs of people. In recent years, the functional requirements for consumer electronic products have become more and more obvious, and in the design of products, engineers may stack a large number of modules/structures to meet the needs of users in order to further increase the functionality of products. However, with the increasing modules/structures inside electronic devices, power consumption of the electronic devices is also gradually increasing.
In one aspect of the present disclosure, a heat-dissipation assembly is provided. The heat-dissipation assembly may include a liquid-cooling plate having a coolant flow path inside the liquid-cooling plate, with a cooling fluid sealed inside the coolant flow path. The liquid-cooling plate may have a coolant inlet and a coolant outlet in communication with the coolant flow path. The heat-dissipation assembly may include a piezoelectric ceramic pump provided on the liquid-cooling plate and in communication with the coolant flow path. The piezoelectric ceramic pump may have a pump-in port connected to the coolant outlet, and a pump-out port connected to the coolant inlet.
In a further aspect of the present disclosure, a housing assembly is provided. The housing assembly may include liquid-cooling plate including a first cover body and a second cover body with a coolant flow path there-between. A cooling fluid may be sealed inside the coolant flow path. The liquid-cooling plate may have a coolant inlet and a coolant outlet in communication with the coolant flow path. The housing assembly may include piezoelectric ceramic pump provided on the liquid-cooling plate and in communication with the coolant flow path. The piezoelectric ceramic pump may have a pump-in port connected to the coolant outlet, and a pump-out port connected to the coolant inlet.
In a further aspect of the present disclosure, an electronic device is provided. The electronic device may include a housing assembly as previously described. The housing assembly may include an electronic device accommodation space, a battery, and a motherboard. The battery and the motherboard may be located inside the electronic device accommodation space defined by the housing assembly. The piezoelectric ceramic pump in the housing assembly may be electrically connected to the motherboard, and the motherboard may be electrically connected to the battery.
The foregoing and/or additional aspects and advantages of the present disclosure will be apparent and readily understood from the description of embodiments in conjunction with the accompanying drawings below.
Embodiments of the present disclosure will be detailed below. The embodiments described below are exemplary and intended only to explain the present disclosure. Where specific techniques or conditions are not indicated in the embodiments, the embodiments may follow the techniques or conditions described in literature of the art or follow the product's specification.
Heat dissipation technologies, which adopt coolant circulation as active cooling, have been used in data centers, servers, laser displays, and other devices. Since coolant has advantages of larger specific heat capacity, more adequate contact with heat-generating devices, faster and controllable flow rate, the heat flux density of coolant circulation heat dissipation can reach more than one hundred times of natural convection. However, various difficulties in miniaturization of the coolant circulation heat dissipation may occur.
For instance, miniaturization of a coolant pump may be difficult to achieve because it is difficult to take into account both high-flow rate and high-pressure head. An insufficient flow rate may lead to a larger thermal resistance caused by a temperature rise of the coolant itself, which reduces the heat transfer efficiency. Low-pressure head makes it difficult for the coolant pump to overcome a resistance of the flow path to the coolant. A main cause of the resistance may be the friction of the coolant due to its own viscosity with a wall of the coolant flow path, which in turn leads to insufficient flow rate of the coolant flow path. Electronic devices have higher requirements for lightweight and thinness of the liquid-cooling plate. Current liquid-cooling plate is generally made of a material such as aluminum alloy, copper, stainless steel, etc., and has a thickness usually above millimeter level, which brings greater blocks to the thinness and portability of electronic devices. Coolant circulation heat dissipation generally adopts external circulation heat dissipation using water storage devices, which is unachievable in electronic devices. In addition, miniaturization of coolant circulation heat dissipation also induces other problems, e.g., such as low heat transfer coefficient between the coolant flow path and heat source, larger size of the coolant pump, larger size of the fan, and noise caused by the fan, which reduces the quality of the user experience.
In one aspect of the present disclosure, an exemplary heat-dissipation assembly is proposed, with reference to
According to some embodiments of the present disclosure, referring to
The support plate 220 may be located between the piezoelectric ceramic plate and the base 230. In some embodiments, the support plate may be a stainless steel plate. A thickness of the support plate may be relatively small, as long as it is sufficient to play a role for supporting the piezoelectric ceramic plate and increasing oscillation amplitude. For example, the support plate and piezoelectric ceramic element may be adjacent to each other, and an overall thickness of the two can be about 0.2 mm. The base 230 is located on one side of the support plate away from the piezoelectric ceramic sheet, and may include a side wall surrounding the support plate and a bottom surface connected with the side wall. The bottom surface may have a pump-in port 21 and a pump-out port 22. That is, the pump-in port 21 and pump-out port 22 may be located on a surface of the base away from the support plate. Consequently, the base may define a fluid accommodation space 240 between a bottom surface where the pump-in port and pump-out port are located, and the support plate. As such, oscillation of the piezoelectric ceramic plate on the other side of the fluid accommodation space can provide power for pumping in and out the fluid in the fluid accommodation space. In some examples, the base needs to define a cavity for the piezoelectric ceramic pump, and an overall thickness of the base may be about 2 mm. The valve body is provided inside the fluid accommodation space and can be cyclically controlled to open one of the pump-in port and the pump-out port while closing the other one when the piezoelectric diaphragm oscillates.
The structure of the valve body is not particularly limited, as long as the cyclic control can be achieved to pump in and out the cooling liquid in the fluid accommodation space. For example, referring to
According to other embodiments of the present disclosure, referring to
Specifically, referring to
The check valve membrane 253 of the valve body can oscillate in the first direction or negative direction with oscillation of the piezoelectric ceramic sheet 251. Thus, when oscillation of the check valve membrane in the first direction occurs, the check valve membrane moves toward the check valve upper cover. At this point, the solid portion blocks smaller through-holes in the check valve upper cover, while larger through-holes are not fully covered. Therefore the flow path on the side of larger through-holes of the check valve upper cover are open, while the flow path on the side of smaller through-holes is closed. Conversely, when oscillation of the check valve membrane in the second direction occurs, the check valve membrane moves toward the check valve lower cover. At this point, the solid portion blocks smaller through-holes in the check valve lower cover, while larger through-holes are not fully covered. As such, the flow path on the side of large through-holes of the check valve upper cover is closed, while the flow path on the side of smaller through-holes is open.
Specifically, referring to
The check valve membrane 253 of the valve body may oscillate in the first direction or negative direction with oscillation of the piezoelectric ceramic plate 251. Consequently, when oscillation of the check valve membrane in the first direction occurs, the check valve membrane moves toward the check valve upper cover. At this point, the solid portion blocks the second through-hole in the check valve upper cover, while the first through-hole is not fully covered. As such, the flow path on the first through-hole side of the check valve upper cover is open, and the flow path on the second through-hole side is closed.
Conversely, when oscillation of the check valve membrane in the second direction occurs, the check valve membrane moves toward one side away from the check valve upper cover, e.g., toward the side of the liquid-cooling plate. At this point, the solid portion covers one of the coolant inlet and the coolant outlet on the liquid-cooling plate corresponding to the first through-hole, and the other of the coolant inlet and the coolant outlet on the liquid-cooling plate corresponding to the second through-hole is not fully covered. Thus, the flow path on the first through-hole side of the check valve upper cover is closed, and the flow path on the second through-hole side is open. Hence, the check valve lower cover and a base of the pump body can be omitted. In this way, the thickness of the piezoelectric ceramic pump may be reduced.
Specifically, a thickness of the piezoelectric diaphragm of the thinned piezoelectric ceramic pump may be in a range of 0.15-0.25 mm, a thickness of the check valve upper cover may be in a range of 0.17-0.23 mm, a thickness of the check valve membrane may be in a range of 0.03-0.07 mm, and an overall thickness of the piezoelectric ceramic pump may be in a range of 0.35-0.55 mm.
According to some embodiments of the present disclosure, when the cover body (e.g., the first cover body or the second cover body) on one side of the liquid-cooling plate, where the piezoelectric ceramic pump is arranged, has increased elasticity to deform with the piezoelectric ceramic sheet in the piezoelectric ceramic pump, the cover body on one side of the liquid-cooling plate, where the piezoelectric ceramic pump is arranged, can be used to act directly as the check valve lower cover, thus facilitating further reduction in an overall thickness of the heat-dissipation assembly.
For better understanding, the principle by which the heat-dissipation assembly can achieve the above-mentioned beneficial effects will be briefly described in the following.
The liquid-cooling plate, as a heat-dissipation assembly for electronic devices, may be used to keep the electronic device at a lower operating temperature by either internal heat equalization or heat exchange with an external cooling source. Through direct contact with the heat source, energy from the heat source passes through a housing of the liquid-cooling plate to the cooling fluid, which is driven by a liquid pump to carry heat to a low-temperature region where it flows, and is carried away from the electronic device by means of natural convection or forced cooling through the housing of the liquid-cooling plate. In existing devices, the liquid-cooling plate is usually made of a rigid non-bendable metal. Although the thermal conductivity of metal is high, which is conducive to heat transfer in the liquid-cooling plate, the thinness of portable electronic devices has a significant impact on the human-computer experience, and a volume of the metal liquid-cooling plate is large, so there is not enough space in the electronic device to arrange the liquid-cooling plate, and the metal material may shield and interfere RF antennas of the electronic device, thereby affecting the operation stability of the electronic device.
In the present disclosure, a piezoelectric ceramic pump is instead used as a driving pump for the cooling fluid. The size of a miniature piezoelectric ceramic pump is smaller than that of a traditional mechanical pump, and the driving power of the piezoelectric ceramic pump is extremely low (e.g., usually on the order of tens of milliwatts) due to extremely poor conductivity and extremely low operating current of the piezoelectric ceramic. The small size and low energy consumption facilitate its carriage in electronic devices. Also, the piezoelectric ceramic pump abandons electromagnetic coils in the traditional liquid pump, and does not produce electromagnetic interference to the electronic device, which contributes to the improvement in operational stability of the device. In the exemplary system described herein (e.g., referring to
According to some embodiments of the present disclosure, in order to prevent the coolant from directly flowing between the pump-in port and pump-out port without passing through the coolant flow path and short-circuiting the liquid (e.g., referring to
By dividing the coolant flow path into a water supply area and a water return area through the blocking piece, the coolant flow rate can be accelerated through the arrangement of the piezoelectric ceramic pump, thereby improving temperature homogeneity of the heat-dissipation assembly. For example, as the liquid-cooling plate has a structure as shown in
Taking an example of the pump outlet near a camera through-hole 170 in
Additionally and/or alternatively, referring to
According to some embodiments of the present disclosure, with reference to
According to some embodiments of the present disclosure, a depth of the coolant flow path is not particularly limited. For instance, the depth of the coolant flow path may not be less than 25 microns. When the depth of the coolant flow path is less than 25 microns, a volume of the cooling fluid in the coolant flow path may be undesirably small, resulting in a cooling effect that is insufficient to meet the use requirements.
According to some embodiments of the present disclosure, in order to ensure that the piezoelectric ceramic pump has a sufficient pressure head to create a coolant flow rate enough to dissipate heat, a volume of the piezoelectric ceramic pump and the coolant flow path is not particularly limited. For example, the volume of the piezoelectric ceramic pump and the coolant flow path may be configured so that the coolant flow rate in the coolant flow path is not less than 0.5 mL/min. When the coolant flow rate in the coolant flow path is less than 0.5 mL/min, the coolant (e.g., water) may be unable to effectively dissipate heat from the heat source. By way of example and not limitation, at least one of a thickness H and a diameter D of the piezoelectric ceramic sheet in the piezoelectric ceramic pump needs to meet the conditions of: 0.1 mm≤H≤0.5 mm and/or 3 mm≤D≤12 mm. As such, the piezoelectric ceramic sheet can oscillate under an electric field, and the mechanical oscillation can provide power for the flow of coolant. A conventional piezoelectric ceramic sheet may include a sheet with upper and lower surfaces coated with conductive material (for formation of electrodes), where the material and size of the piezoelectric ceramic sheet determines the power that can be provided by the piezoelectric ceramic pump. The material of the piezoelectric ceramic sheet is not limited, but may include zirconium-based ceramic, for example.
It is understood by those skilled in the art that the area of the heat-dissipation assembly cannot be too small for an electronic device to effectively equalize heat from a heat source to an area outside the heat source. In other words, the size of the heat-dissipation assembly may cover at least one heat source in the electronic device, and a sufficiently large area outside the heat source. For the volume of commonly used electronic devices (e.g., mobile terminals such as cell phones, tablet devices, laptops, etc.), a piezoelectric ceramic sheet with a thickness of not less than 0.1 mm and not more than 0.5 mm and a diameter of not less than 3 mm and not more than 12 mm can provide sufficient power for the heat-dissipation assembly, while ensuring that a flow rate of the coolant sealed inside the heat-dissipation assembly is not less than 0.5 mL/min, and that the heat-dissipation assembly is of moderate volume and weight, and can be placed in the electronic device with relative simplicity.
According to some embodiments of the present disclosure, to enhance buffering effect of the fluid at the pump-out port, the coolant flow path adjacent to the coolant inlet and the coolant outlet may have a buffer section, and a width of the buffer section can be greater than a width of the coolant flow path at the non-buffer sections.
That is, the pumped-out or pumped-in fluid can be further buffered by increasing a cross-sectional area (e.g., in the width direction) of the coolant flow path at a junction of the pump-in or pump-out ports of the piezoelectric ceramic pump with the first or second cover bodies. For instance, the width of the buffer section can be at least two times the width of the coolant flow path at the non-buffer sections.
According to some embodiments of the present disclosure, referring to
According to some embodiments of the present disclosure, formation of a coolant flow path between the first cover body and the second cover body, and a specific shape of the coolant flow path are not particularly limited, as long as a coolant can be sealed and circulated with the power provided by the piezoelectric ceramic pump. For example, referring to
According to some embodiments of the present disclosure, formation of a coolant flow path between the first cover body and the second cover body, and a specific shape of the coolant flow path are not particularly limited, as long as a coolant can be sealed and circulated with the power provided by the piezoelectric ceramic pump. For example, referring to
According to some embodiments of the present disclosure, referring to
As mentioned above, the material forming the first cover body, the second cover body, and the spacer is not particularly limited, and may independently include at least one of polyester, polyimide, polymethyl methacrylate, polyethylene, polyvinyl chloride, polystyrene, ceramic, and glass, respectively. In this way, the liquid-cooling plate formed by sealing the first cover body with the second cover body, or the liquid-cooling plate formed by sealing the first cover body, the second cover body and the spacer can result in a rigid liquid-cooling plate or a flexible liquid-cooling plate, depending on the materials as used. That is, the heat-dissipation assembly formed by a combination of the liquid-cooling plate and the piezoelectric ceramic pump can be either rigid or flexible.
According to some embodiments of the present disclosure, when the material forming at least one of the first cover body and the second cover body is a flexible material, e.g., at least one of the first cover body and the second cover body is formed by a flexible material, the heat-dissipation assembly may further include a water-oxygen barrier film, which is located on one side of the cover body formed by the flexible material away from the coolant flow path. The aforementioned flexible material may be a polymer material, in some non-limiting examples.
For better understanding, a method for preparing the heat-dissipation assembly as described above in the present disclosure will be briefly described below in conjunction with specific embodiments. The method may include providing a liquid-cooling plate having a coolant flow path inside the liquid-cooling plate with a cooling fluid sealed inside the coolant flow path. The liquid-cooling plate may have a coolant inlet and a coolant outlet in communication with the coolant flow path. The method may include providing a piezoelectric ceramic pump on one side of the liquid-cooling plate. The piezoelectric ceramic pump may be communicated with the coolant flow path and having a pump-in port connected to the coolant outlet and a pump-out port connected to the coolant inlet. Thus, the foregoing liquid-cooling plate can be easily obtained. In some examples, the method may include the following operations.
For example, in a first operation, the method may include providing a liquid-cooling plate. As mentioned above, the material and structure for forming the liquid-cooling plate are not particularly limited, as long as a sealed and communicated coolant flow path is formed inside the liquid-cooling plate. According to some embodiments of the present disclosure, with reference to
After etching, the first cover body or the second cover body may be obtained by cleaning and removing the remaining barrier layer from a surface of the cover body. The first recess and the second recess can be formed in the same way, and then the first and second cover bodies can be aligned and sealed by an alignment mark or an alignment machine. For the cover body formed of a plastic material (e.g., a polymer material), the sealing process can be chosen from a solder-less welding such as thermal bonding, laser sealing welding, or an inter-facial agent sealing, such as gluing, inter-layer bonding. After the sealing and a leak test are completed, a plate body with temperature homogeneity can be obtained.
Additionally and/or alternatively, referring to
In a second operation, the method may include providing a piezoelectric ceramic pump on one side of the liquid-cooling plate. According to some embodiments of the present disclosure, in this operation, the piezoelectric ceramic pump may be arranged on one side of the liquid-cooling plate. For instance, the piezoelectric ceramic pump can be installed at an interface reserved on the liquid-cooling plate. In other words, the coolant inlet and the coolant outlet, and the interface may be sealed by means of dispensing, fusing, etc. The structure and operation of the piezoelectric ceramic pump have been described in detail, and will not be repeated here.
As a result, the aforementioned heat-dissipation assembly can be obtained easily. This method can be used to obtain a heat-dissipation assembly with a thinner overall thickness, and designs of the piezoelectric ceramic pump and the liquid-cooling plate can ensure that the coolant inside the liquid-cooling plate achieve a certain flow rate to meet the requirements for temperature homogeneity and heat dissipation. Moreover, the processing method of the liquid-cooling plate is simple and the production cost is relatively low, thus facilitating the preparation in large-size and large-scale.
In a further aspect of the present disclosure, the application proposes a housing assembly including: a liquid-cooling plate including a first cover body and a second cover body defining a coolant flow path there-between for receiving a cooling liquid. The liquid-cooling plate may have a coolant inlet and a coolant outlet in communication with the coolant flow path. A piezoelectric ceramic pump provided on the liquid-cooling plate, the piezoelectric ceramic pump may have a pump-in port in communication with the coolant outlet and a pump-out port in communication with the coolant inlet. For instance, a cooling fluid may be sealed inside the coolant flow path. Thus, the piezoelectric ceramic pump can accelerate the flow of the cooling fluid in the coolant flow path, thereby accelerating heat transfer between the cooling fluids and finally obtaining a cooling fluid with temperature homogeneity. Furthermore, a housing assembly with rapid heat dissipation, temperature homogeneity and miniaturized size can be obtained.
According to some embodiments of the present disclosure, the housing assembly may be applicable in an electronic device, and a structure of the first cover body is not particularly limited. Referring to
Still further, the housing assembly may include only a first water-oxygen barrier membrane. The housing assembly may include only a second water-oxygen barrier membrane. The housing assembly may include only a decorative layer. The housing assembly may include only the first water-oxygen barrier membrane and the second water-oxygen barrier membrane. The housing assembly may include only the first water-oxygen barrier membrane and the decorative layer. The housing assembly may include only the second water-oxygen barrier membrane and the decorative layer. The housing assembly may include the first water-oxygen barrier film, the second water-oxygen barrier film and the decorative layer. Other structures in the housing assembly are not particularly limited, and can be selected by those skilled in the art according to actual situations.
When the housing assembly further includes the first water-oxygen barrier film, the second water-oxygen barrier film, and the decorative layer (e.g., referring to
The provision of a decorative layer may result in a housing assembly with better visual effect and higher aesthetics. The first water-oxygen barrier film and the second water-oxygen barrier film may be provided to isolate water and gas, thereby reducing the damage to electronic components due to fluid leakage within the coolant flow path, and also reducing occurrence of a flow rate drop due to accumulation of air bubbles in the coolant flow path. Thus, the housing assembly with the aforementioned structure can be used directly as a cover body for the electronic device, thereby reducing an overall thickness of the electronic device and improving applicability of the housing assembly.
According to some embodiments of the present disclosure, the type of adhesives in the first bonding layer and the second bonding layer is not particularly limited. For example, the first bonding layer and the second bonding layer may be an optical adhesive. The optical adhesive has characteristics of colorless and transparency, high light-transmission rate, good bonding strength, capability of being cured at room or medium temperature, small curing shrinkage, etc., which is helpful to form a housing assembly with good structural stability.
According to some embodiments of the present disclosure, the thicknesses of the texture sub-layer, coating sub-layer, color sub-layer, and bottom ink sub-layer included in the decorative layer are not particularly limited. For example, a thickness of the texture sub-layer may range from 15 to 25 microns, a thickness of the coating sub-layer may range from 180 to 220 microns, and a thickness of the cover ink sub-layer may range from 15 to 25 microns.
According to some embodiments of the present disclosure, with reference to
According to some embodiments of the present disclosure, a structure of the housing assembly is not particularly limited. For example, the liquid-cooling plate may include a folding portion, a first liquid-cooling section, and a second liquid-cooling section, and the first liquid-cooling section and the second liquid-cooling section are connected to each other via the folding portion, and can be folded at the folding portion in the same direction as a rear cover of the electronic device. Thus, the housing assembly can be applied in a foldable device. Referring to
According to some embodiments of the present disclosure, the piezoelectric ceramic pump may include one or more of the following. For example, the piezoelectric ceramic pump may include a piezoelectric diaphragm which includes a piezoelectric ceramic plate and a support plate in contact with the piezoelectric ceramic plate. A surface of the piezoelectric ceramic plate may be provided with electrodes capable of generating an electric field, which controls oscillation of the piezoelectric ceramic plate. the piezoelectric ceramic pump may include a valve body which is provided between the piezoelectric diaphragm and the liquid-cooling plate and located on the liquid-cooling plate. The piezoelectric diaphragm may be located on one side of the valve body away from the liquid-cooling plate. The valve body may include a check valve cover and a check valve membrane. The check valve cover may have a first through-hole and a second through-hole. The area of the first through-hole may be larger than that of the second through-hole. The check valve membrane may be located between the check valve cover and the liquid-cooling plate, and may be configured to oscillate with oscillation of the piezoelectric ceramic plate. The check valve membrane may have two skeletonized areas of the same shape, both having a solid portion. An orthographic projection of the solid portion is located at the first through-hole and the second through-hole. An orthographic projection of the first through-hole on the liquid-cooling plate may fully cover one of the coolant inlet and the coolant outlet. An orthographic projection of the second through-hole on the liquid-cooling plate may be located within the other one of the coolant inlet and the coolant outlet. An orthographic projection of the solid portion on the check valve upper cover corresponding to the second through-hole may fully cover the second through-hole. An orthographic projection of the solid portion on the liquid-cooling plate corresponding to the first through-hole may fully cover said one of the coolant inlet and the coolant outlet.
The structure and operation of the piezoelectric ceramic pump in the housing assembly may be similar to those of the piezoelectric ceramic pump in the aforementioned heat-dissipation assembly, which have been described in detail earlier and will not be repeated here.
According to some embodiments of the present disclosure, the coolant flow path may further include a blocking piece. The coolant inlet and the coolant outlet may be provided adjacent to each other, and the blocking piece may be located between the coolant inlet and the coolant outlet to divide the coolant flow path into a water supply area and a water return area. The water supply area may be connected to the coolant inlet on one side, the water return area is connected to the coolant outlet, the water supply area and the water return area are connected on one side away from the coolant inlet. The blocking piece in the housing assembly is similar to that in the aforementioned heat-dissipation assembly, which has been described in detail earlier and will not be repeated here.
According to some embodiments of the present disclosure, the liquid-cooling plate may include a first cover body and a second cover body. The first cover body has a first recess on one side facing the second cover body, the second cover body has a second recess on one side facing the first cover body, and the first recess and the second recess form a coolant flow path. The first cover body or second cover body has a through-hole penetrating the cover body, the through-holes constituting a coolant inlet and a coolant outlet. A structure of the liquid-cooling plate in the housing assembly is similar to that of the liquid-cooling plate in the aforementioned heat-dissipation assembly, which has been described in detail earlier and will not be repeated here.
According to some embodiments of the present disclosure, the liquid-cooling plate may include a first cover body and a second cover body with a spacer disposed between them. The spacer may have a skeletonized pattern constituting a coolant flow path. The first cover body or the second cover body may have two through-holes penetrating the cover body with the through-holes constituting the coolant inlet and the coolant outlet. A structure of the liquid-cooling plate in the housing assembly is similar to that of the liquid-cooling plate in the aforementioned heat-dissipation assembly, which has been described in detail earlier and will not be repeated here.
According to some embodiments of the present disclosure, the liquid-cooling plate may satisfy at least one of the following conditions. These conditions may include, e.g., a volume of the piezoelectric ceramic pump and the coolant flow path is configured so that a flow rate of the coolant in the coolant flow path is not less than 0.5 mL/min; a depth of the coolant flow path is not less than 25 microns; and at least one of a thickness H and a diameter D of the piezoelectric ceramic sheet of the piezoelectric ceramic pump satisfies: 0.1 mm≤H≤0.5 mm and/or 3 mm≤D≤12 mm Structural parameters of the liquid-cooling plate in the housing assembly are consistent with those of the liquid-cooling plate in the aforementioned heat-dissipation assembly, which have been described in detail earlier and will not be repeated here.
For better understanding, a method for preparing the housing assembly described above in the present disclosure will be briefly described below in connection with some specific embodiments. The method may include providing a liquid-cooling plate, and arranging a piezoelectric ceramic pump on the liquid-cooling plate. As a result, a housing assembly with a coolant flow path therein. In other words, the aforementioned housing assembly may be obtained through this method, and thus, this method has all the features and advantages of the aforementioned housing assembly. The method for preparing a liquid-cooling plate and a piezoelectric ceramic pump in the housing assembly may be the same as the method for preparing a liquid-cooling plate and a piezoelectric ceramic pump in the heat-dissipation assembly described above. That is, the method for preparing the housing assembly has all the features and advantages of the method for preparing the heat-dissipation assembly described above. In general, the method can produce a housing assembly with good temperature homogeneity.
It shall be noted that in the preparation of the aforementioned housing assembly, there is no sequence between the steps of sealing a first cover body and a second cover body, and arranging a piezoelectric ceramic pump on the liquid-cooling plate. In other words, the first cover body and the second cover body is sealed first and then the piezoelectric ceramic pump is arranged on the liquid-cooling plate, or the piezoelectric ceramic pump is arranged on the first cover body or the second cover body first and then the first cover body and second cover body are sealed. The sequence can be chosen by those skilled in the art according to actual situations.
According to some embodiments of the present disclosure, the method may further include, when the first cover body includes an electronic device rear cover and a first membrane, the first membrane and the second cover may first be sealed to obtain a coolant flow path; the first membrane and the second cover body are laminated to the electronic device rear cover to obtain a liquid-cooling plate. Then, a piezoelectric ceramic pump may be arranged on the liquid-cooling plate. According to some embodiments of this application, the way of laminating treatment is not particularly limited. For example, the laminating treatment may include at least one of roller lamination and press lamination. For example, when the electronic device rear cover is a flat glass rear cover, the roller lamination process can be used, where after the first membrane and the second cover body are laminated to the electronic device rear cover, the lamination process is carried out, and finally the piezoelectric ceramic pump is arranged on the liquid-cooling plate. For example, when the electronic device rear cover is 3D glass, the first film and the second cover body can be first laminated to an inner surface of the electronic device rear cover, and then a vacuum lamination jig is used for the laminating process, ensuring the lamination flatness.
According to some embodiments of the present disclosure, the way of sealing the first membrane with the second cover body is not particularly limited. For example, the way of sealing the first membrane with the second cover body may include at least one of bonding and gluing.
According to some embodiments of the present disclosure, when the first cover body includes an electronic device rear cover and a first membrane, the method may further include one or more of the following. The method may include providing an electronic device rear cover; affixing a first bonding layer to one side of the electronic device rear cover facing the first membrane. The method may include removing a release film of the first bonding layer on the side away from the electronic device rear cover. The method may include affixing a first water-oxygen barrier film to one side of the first membrane away from the second cover body. The method may include sealing the first membrane with the second cover body; affixing the first membrane and the second cover body on one side of the first water-oxygen barrier film away from the first bonding layer. The method may include arranging a piezoelectric ceramic pump on the liquid-cooling plate. The method may include affixing a second water-oxygen barrier film on one side of the second cover body away from the first membrane; affixing a second bonding layer on one side of the second water-oxygen barrier film away from the second cover body. The method may include removing a release film of the second bonding layer on the side away from the second water-oxygen barrier film. The method may include affixing a decorative layer on one side of the second cover body away from the first cover body, e.g., on the side away from the first membrane or the electronic device rear cover, and a lamination process is carried out from one side of the decorative layer away from the second bonding layer.
Through the aforementioned method, a housing assembly with a coolant flow path therein is obtained, e.g., the obtained housing assembly is the foregoing housing assembly, and therefore, the method has all the features and advantages of the foregoing housing assembly. In general, the method can produce a housing assembly with fast heat dissipation, temperature homogeneity, and miniaturized size.
In a further aspect of the present disclosure, the application proposes an electronic device, which includes one or more of the following. The electronic device may include a housing assembly, which defines an electronic device accommodation space. The electronic device may include a battery. The electronic device may include a motherboard. The housing assembly may include, e.g., a liquid-cooling plate including a first cover body and a second cover body defining a coolant flow path there-between for receiving a cooling liquid. The liquid-cooling plate may have a coolant inlet and a coolant outlet in communication with the coolant flow path. The housing assembly may include a piezoelectric ceramic pump provided on the liquid-cooling plate. The piezoelectric ceramic pump may have a pump-in port in communication with the coolant outlet and a pump-out port in communication with the coolant inlet. The battery and the motherboard may be placed inside the electronic device accommodation space defined by the housing assembly. The piezoelectric ceramic pump may be electrically connected to the motherboard, and the motherboard may be electrically connected to the battery. Thus, the electronic device may have the aforementioned housing assembly with better temperature homogeneity, without local overheating during use, and with an improved user experience.
According to some embodiments of the present disclosure, since the housing assembly has a piezoelectric ceramic pump, an external circuit is used to control operation of the piezoelectric ceramic pump. Therefore, electrodes in the piezoelectric ceramic pump of the housing assembly can be electrically connected to the motherboard; and specifically, the electrodes in the piezoelectric diaphragm of the piezoelectric ceramic pump capable of generating an electric field may be connected to the motherboard through an elastic metal piece. As a result, control of the piezoelectric ceramic pump can be easily achieved.
According to some embodiments of the present disclosure, the coolant flow path on the liquid-cooling plate of the housing assembly is divided into a water supply area and a water return area, with one side of the water supply area being connected to the coolant inlet, and the water return area being connected to the coolant outlet. The piezoelectric ceramic pump has a pump-in port connected to the coolant outlet and a pump-out port connected to the coolant inlet. For example, the electronic device may further include a heat source chip, which is located on the side of the water supply area. Further, the heat source chip is located near the coolant inlet of the housing assembly. Heat generation of the electronic device mainly comes from the battery and chip on the motherboard. In general, the temperature in the areas of the battery and motherboard in the electronic device will be higher than in other areas. By arranging the aforementioned housing assembly on the electronic device, a cooling fluid in the coolant flow path of the water supply area inside the housing assembly can be used to quickly transfer heat from the heat source area, where the heat source chip is located, to the water return area, so as to achieve the effect of uniform heat and temperature. Still further, through the design of an internal coolant flow path of the housing assembly, it may be possible to realize a customized distribution of the water supply area and the water return area on the basis of simple heat homogeneity. That is, through the design of direction and location of the coolant flow path, as well as a reasonable layout, the temperature at locations where the user is not easy to contact in use may be increased, and the temperature at locations frequently contacted may be decreased. Thus, the electronic device, having the aforementioned housing assembly with better temperature homogeneity will not experience local overheating during use, and its user experience will be better.
According to embodiments of the present disclosure, a location of the housing assembly in the electronic device is not particularly limited. For example, the housing assembly can be provided inside the electronic device, such as between the battery and the screen. Additionally and/or alternatively, the housing assembly may be provided at a housing of the electronic device. The housing assembly has self-supporting properties and is relatively thin, so that the location can be reasonably designed according to internal components of the electronic device, and can be selected by those skilled in the art according to actual situations.
In the description of the present disclosure, orientation or positional relationships indicated by terms “up”, “down”, etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are intended only to facilitate description of the present disclosure, but not to require that the present disclosure must be constructed and operated in a particular orientation, and thus cannot be construed as limiting the application.
In the description of this specification, reference to terms “an embodiment”, “another embodiment”, etc. means that specific features, structures, materials or properties described in connection with an embodiment are included in at least one embodiment of the present disclosure. In this specification, schematic expressions of the above terms must not be directed to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable way. In addition, without contradicting each other, those skilled in the art may combine different embodiments or examples described in this specification, or those features of different embodiments or examples. In addition, it shall be noted that the terms “first”, “second” are used in this specification for descriptive purposes only, and shall not be construed as indicating or implying relative importance or the number of technical feature.
Although embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are exemplary and shall not be construed as limitation on the application, and that variations, modifications, replacements and variants of the above embodiments may be made by those of ordinary skill in the art within the scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202110295125.1 | Mar 2021 | CN | national |
| 202120570984.2 | Mar 2021 | CN | national |
This is a continuation application of International Patent Application No. PCT/CN2022/079572, filed on Mar. 7, 2022, which claims priorities to Chinese Patent Application Nos. 202110295125.1 and 202120570984.2, both filed on Mar. 19, 2021. The disclosures of these applications are incorporated by reference herein in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2022/079572 | Mar 2022 | US |
| Child | 18240452 | US |
