Patent Application
20120181000
1. Technical Field
The present disclosure relates to heat dissipation assemblies, and particularly relates to a heat dissipation assembly for removing heat from an electronic component.
2. Description of Related Art
With developments in computing technology, electronic devices such as central processing units (CPUs) generate excessive heat during normal operation, which can deteriorate operational stability and damage associated elements. The heat must be removed quickly. A commonly used heat dissipation component includes a heat sink mounted on a CPU. The heat sink may include a plurality of parallel fins and several heat pipes passing therethrough. A fan is mounted on the fins to dissipate heat from the fins. However, the heat dissipation efficiency is often low.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The heat sink 10 includes a base 11. A plurality of fins 13 is located on a top surface of the base 11. A bottom surface of the base 11 thermally contacts a heat generating component 60. In one embodiment, the heat generating component 60 is a CPU, which is located on a printed circuit board 50. Heat generated by the heat generating component 60 is transmitted to the base 11, and then transmitted to the fins 13. The fins 13 are parallel with each other. Each fin 13 includes two opposite side faces 131. The two side faces 131 are symmetrical about a central line of the fin 13. Each side face 13 is wavy, and includes a plurality of convexities 136 and a plurality of concavities 137. The plurality of convexities 136 is interlaced with the plurality of concavities 137. That is a convexity 136 being located between two concavities 137 and a concavity 137 being located between two convexities 136. Because the side face 13 is wavy, it has a great surface area for better heat dissipation.
An air channel 135 is formed between two adjacent side faces 131 of two adjacent fins 13. Because the side faces 131 are waved, a width of the air channel 135 is not consistent. The width of the air channel 135 includes a plurality of wide portions 138 and a plurality of narrow portions 139. The plurality of wide portions 138 are interlaced with the plurality of narrow portions 139. That is a wide portion 138 being located between two narrow portions 139 and a narrow portion 138 being located between two wide portions 138. The wide portion 138 corresponds to concavities 137 of the two adjacent side faces 131. The narrow portion 139 corresponds to convexities 136 of the two adjacent side faces 131. When air flows in the air channel 135, air flows fast in the narrow portions 139 and flows slow in the wide portions 138.
The fan 30 is mounted on the heat sink 10, and located on a side of the air channels 135. The fan 30 rotates to drive air through the air channels 135. Air flows fast in the narrow portions 139, so heat on the convexities 136 are dissipated quickly. After heat on the convexities 136 are dissipated, heat on adjacent concavities 137 are transmitted to the convexities 136. So, heat on the heat sink 10 is dissipated quickly. In another aspect, the convexities 136 have greater areas than plane fins of conventional heat sink. Therefore, the heat dissipation assembly has great heat dissipation efficiency.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110021932.0 | Jan 2011 | CN | national |
