1. Field of the Invention
The disclosure relates generally to heat dissipation, and particularly to a heat dissipation assembly having a containment apparatus for containing a thermal interface material.
2. Description of Related Art
Electronic devices such as central processing units (CPUs) generate considerable heat during normal operation, which, if not properly dissipated, can deteriorate operational stability and damage associated electronic devices. A heat sink is often directly attached to a top surface of an electronic device to remove heat therefrom. Gaps formed between the heat sink and the electronic device reduce heat transfer efficiency To ensure consistent and effective contact between the electronic device and the heat sink, a thermal interface material such as thermal grease or thermal tape is often applied to a surface of the heat sink. A strip of thermal tape applied to the bottom surface of the heat sink in advance does not contaminate surrounding articles or attract contamination by dust or foreign particles during transportation or handling of the heat sink since it is solid at ambient temperature, unlike thermal grease, which cannot be applied to the heat sink in advance since its semi-fluid state at ambient temperature promotes easy removal and contamination by dust or foreign particles before the heat sink is assembled to the CPU. Conventionally, the thermal grease is applied to the heat sink immediately prior to assembly to the CPU, extending assembly time. The thermal tape, while more convenient to use, has a higher viscosity when heated. Further, it cannot enhance heat conductivity of the heat sink as well as thermal grease.
What is needed, therefore, is a heat dissipation assembly providing a containment apparatus which can prevent the thermal grease from unwanted migration to surrounding areas or contamination by dust or foreign particles.
A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. The containment apparatus further includes two ears extending outwardly from two opposite sides of the annular frame. Each ear defines a receiving space accommodating a part of a clip for attaching the heat sink to a heat-generating electronic device.
Other advantages and novel features of the disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Many aspects of the present device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Also referring to
The heat sink 20 is integrally made of metal with high heat conductivity such as copper, aluminum or alloys thereof. The heat sink 20 comprises a rectangular base 22 and a plurality of fins 24 extending downwardly from a bottom surface thereof. The thermal interface material 30 is applied to a top surface of the base 22. The fins 24 are spaced from each other and parallel to two opposite sides of the base 22. An elongated groove 26 is defined at a center of the bottom surface of the base 22 and located between two adjacent fins 24, receiving the clip 40 therein.
The clip 40 is a wire clip integrally made of a resilient metal wire. The clip 40 comprises an abutting body 42 and two locking arms 44 respectively extending perpendicularly but in two opposite directions from two opposite ends of the abutting body 42. A hook 46 is formed on a distal end of each locking arm 44 and configured to fasten to the printed circuit board, whereby the top surface of the base 22 of the heat sink 20 can have an intimate contact with the CPU.
In assembly, referring to
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
2008 1 0066871 | Apr 2008 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
5168926 | Watson et al. | Dec 1992 | A |
5897917 | Hinshaw et al. | Apr 1999 | A |
6029740 | Lee et al. | Feb 2000 | A |
6049458 | Lee et al. | Apr 2000 | A |
6059116 | Hinshaw et al. | May 2000 | A |
6143076 | Rasmussen et al. | Nov 2000 | A |
6644395 | Bergin | Nov 2003 | B1 |
6881265 | Makley et al. | Apr 2005 | B2 |
6935420 | Dong et al. | Aug 2005 | B1 |
6945312 | Czubarow et al. | Sep 2005 | B2 |
7051790 | Lin | May 2006 | B2 |
7063136 | Yu et al. | Jun 2006 | B2 |
7068512 | Lee et al. | Jun 2006 | B2 |
7068514 | Chang et al. | Jun 2006 | B2 |
7319592 | Wang et al. | Jan 2008 | B2 |
7349210 | Sheng et al. | Mar 2008 | B2 |
7365983 | Huang et al. | Apr 2008 | B2 |
7441593 | Wu | Oct 2008 | B2 |
7554807 | Wu et al. | Jun 2009 | B2 |
7589969 | Wang et al. | Sep 2009 | B2 |
7623350 | Tien et al. | Nov 2009 | B2 |
20020163076 | Tzeng et al. | Nov 2002 | A1 |
20060042787 | Yu et al. | Mar 2006 | A1 |
20060232936 | Wu | Oct 2006 | A1 |
20070012421 | Lin et al. | Jan 2007 | A1 |
20070217161 | Wu et al. | Sep 2007 | A1 |
Number | Date | Country | |
---|---|---|---|
20090268409 A1 | Oct 2009 | US |