Organic materials with or without a thermoconductive filler

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H01L23/3737

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3737Organic materials with or without a thermoconductive filler

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Alumina-based thermally conductive oxide and method for producing same
- Patent number 12,281,254
- Issue date Apr 22, 2025
- Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, resin cured product, and composite molded body
- Patent number 12,264,229
- Issue date Apr 1, 2025
- Mitsubishi Chemical Corporation
- Akinori Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite composite and electronic component
- Patent number 12,264,228
- Issue date Apr 1, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Youji Shirato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package heat dissipation including a die attach film
- Patent number 12,199,008
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation using nanoscale materials
- Patent number 12,191,228
- Issue date Jan 7, 2025
- Sanctioned Risk Solutions, Inc.
- Zachary R. Greenhill
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit board module
- Patent number 12,193,143
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya Hosotani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally conductive sheet and method of manufacturing semiconducto...
- Patent number 12,183,656
- Issue date Dec 31, 2024
- Resonac Corporation
- Mika Kobune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-conductive silicone composition, production method therefor...
- Patent number 12,180,368
- Issue date Dec 31, 2024
- Shin-Etsu Chemical Co., Ltd.
- Wataru Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive silicone gel composition
- Patent number 12,152,147
- Issue date Nov 26, 2024
- Fuji Polymer Industries Co., Ltd.
- Takumi Kataishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive articles including entangled or aligned fibers...
- Patent number 12,115,737
- Issue date Oct 15, 2024
- 3M Innovative Properties Company
- Jacob P. Podkaminer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive silicone composition, production method thereo...
- Patent number 12,104,113
- Issue date Oct 1, 2024
- Shin-Etsu Chemical Co., Ltd.
- Takahiro Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermal conductive silicone composition and semiconductor device
- Patent number 12,107,031
- Issue date Oct 1, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shota Akiba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High efficiency heat dissipation using thermal interface material film
- Patent number 12,100,640
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive silicone composition, semiconductor device, and...
- Patent number 12,060,517
- Issue date Aug 13, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shota Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive compositions for targeted heat dissipation of...
- Patent number 12,048,121
- Issue date Jul 23, 2024
- Lenovo (Singapore) Pte. Ltd.
- Bouziane Yebka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component type thermally conductive silicone-gel composition,...
- Patent number 12,037,460
- Issue date Jul 16, 2024
- Dow Toray Co., Ltd.
- Kenji Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Surface-modified inorganic nitride, composition, thermally conducti...
- Patent number 11,945,718
- Issue date Apr 2, 2024
- FUJIFILM Corporation
- Seiichi Hitomi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Two-pack curable composition set, thermally conductive cured produc...
- Patent number 11,915,993
- Issue date Feb 27, 2024
- DENKA COMPANY LIMITED
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
- Patent number 11,881,440
- Issue date Jan 23, 2024
- Intel Corporation
- Marely E. Tejeda Ferrari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material paste and semiconductor package
- Patent number 11,876,031
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste composition, semiconductor device, and electrical/electronic...
- Patent number 11,859,112
- Issue date Jan 2, 2024
- Kyocera Corporation
- Masakazu Fujiwara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermally conductive composition and methods and devices in which s...
- Patent number 11,851,603
- Issue date Dec 26, 2023
- Dow Silicones Corporation
- Xiaolian Hu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manufacturing method for thermal conductive layer, manufacturing me...
- Patent number 11,848,249
- Issue date Dec 19, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096070
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096066
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...
- Publication number 20250096184
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR APPARATUS
- Publication number 20250084239
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Wataru TOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...
- Publication number 20250079252
- Publication date Mar 6, 2025
- AMOGREENTECH CO., LTD.
- In Yong SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A...
- Publication number 20250069987
- Publication date Feb 27, 2025
- Arieca Inc.
- Navid Kazem
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20250038066
- Publication date Jan 30, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE
- Publication number 20250014964
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL
- Publication number 20250014965
- Publication date Jan 9, 2025
- Henkel AG & Co. KGaA
- Yong Joon Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...
- Publication number 20250006670
- Publication date Jan 2, 2025
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Jinliang ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID-COOLED POWER MODULE
- Publication number 20250006589
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive Articles Including Entangled or Aligned Fibers...
- Publication number 20250001706
- Publication date Jan 2, 2025
- 3M Innovative Properties Company
- Jens Eichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FOR HEAT GENERATING ELECTRONIC COMPONENT
- Publication number 20240422944
- Publication date Dec 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuuki SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...
- Publication number 20240395653
- Publication date Nov 28, 2024
- DENSO CORPORATION
- MASAKI AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240376294
- Publication date Nov 14, 2024
- SUMITOMO CHEMICAL CO., LTD.
- Thomas Fletcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...
- Publication number 20240379495
- Publication date Nov 14, 2024
- Intel Corporation
- Smit KAPILA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
- Publication number 20240371725
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS
- Publication number 20240332126
- Publication date Oct 3, 2024
- Intel Corporation
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321673
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND PORTABLE INFORMATION DEVICE
- Publication number 20240297094
- Publication date Sep 5, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Ryota Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER WITH SOLDER RESIST POSTS
- Publication number 20240274516
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...
- Publication number 20240258197
- Publication date Aug 1, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
- Publication number 20240243033
- Publication date Jul 18, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
- Publication number 20240234243
- Publication date Jul 11, 2024
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
- Publication number 20240194628
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- Publication number 20240162111
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS

Organic materials with or without a thermoconductive filler

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alumina-based thermally conductive oxide and method for producing same

Resin composition, resin cured product, and composite molded body

Arrangement and thermal management of 3D stacked dies

Graphite composite and electronic component

Package heat dissipation including a die attach film

Heat dissipation using nanoscale materials

Circuit board module

Thermally conductive sheet and method of manufacturing semiconducto...

Thermal-conductive silicone composition, production method therefor...

Power semiconductor component and method for producing a power semi...

Thermally conductive silicone gel composition

Thermally conductive articles including entangled or aligned fibers...

Thermally conductive silicone composition, production method thereo...

Thermal conductive silicone composition and semiconductor device

High efficiency heat dissipation using thermal interface material film

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Thermal conductive silicone composition, semiconductor device, and...

Thermally conductive compositions for targeted heat dissipation of...

Chip-scale package architectures containing a die back side metal a...

Multi-component type thermally conductive silicone-gel composition,...

Systems of applying materials to components

Compressible foamed thermal interface materials and methods of maki...

Surface-modified inorganic nitride, composition, thermally conducti...

Two-pack curable composition set, thermally conductive cured produc...

Thermal interface material having different thicknesses in packages

Carbon based polymer thermal interface materials with polymer chain...

Thermal interface material paste and semiconductor package

Paste composition, semiconductor device, and electrical/electronic...

Thermally conductive composition and methods and devices in which s...

Manufacturing method for thermal conductive layer, manufacturing me...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...

THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR APPARATUS

INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...

A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A...

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

THERMAL INTERFACE MATERIAL

ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...

FLUID-COOLED POWER MODULE

Thermally Conductive Articles Including Entangled or Aligned Fibers...

COVER FOR HEAT GENERATING ELECTRONIC COMPONENT

HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...

THERMALLY CONDUCTIVE COMPOSITION

STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...

HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS

2D FILLERS FOR REDUCED CTE FOR PID

SEMICONDUCTOR PACKAGE

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

HEAT DISSIPATION STRUCTURE AND PORTABLE INFORMATION DEVICE

INTERPOSER WITH SOLDER RESIST POSTS

METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...

ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

Semiconductor Device and Method of Die Attach with Adhesive Layer C...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS