Heat dissipation device including heat sink and heat pipes

Abstract

A heat dissipation device includes a heat sink (10) and a pair of heat pipes (20). The heat sink includes a base (12), a top plate (18), and a plurality of fins (16) thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to heat dissipation devices, and more particularly to a heat dissipation device including a heat sink and heat pipes for achieving great heat dissipation efficiency.

[0003] 2. Description of Prior Art

[0004] During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the CPU to absorb heat from the CPU. The heat absorbed by the heat sink is then dissipated to ambient air.

[0005] Conventionally, a heat sink comprises a solid metal base attached on the CPU, and a plurality of fins formed from the base. The base is intimately attached on the CPU, and must be adequately cooled to ensure normal operation of the CPU. Most of the heat accumulated at the base is transferred firstly to the fins and then dissipated from the fins. However, the electronics technology continues to advance, and increasing amounts of heat are being generated by powerful state-of-the-art CPUs. Many conventional heat sinks are no longer able to efficiently remove heat from these CPUs.

[0006] An improved heat dissipation device is desired to overcome the above-described disadvantages of the prior art.

SUMMARY OF THE INVENTION

[0007] Accordingly, an object of the present invention is to provide a heat dissipation device which can quickly and efficiently transfer heat away from a base of a heat sink thereof.

[0008] In order to achieve the object set out above, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a heat sink and a pair of heat pipes. The heat sink includes a base, a top plate, and a plurality of fins thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate. Other related embodiments are also efficacious.

[0009] Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is an isometric view of a heat dissipation device in accordance with the preferred embodiment of the present invention;

[0011] FIG. 2 is an isometric view of a heat dissipation device in accordance with an alternative embodiment of the present invention;

[0012] FIG. 3 is an isometric view of a heat dissipation device in accordance with a further alternative embodiment of the present invention; and

[0013] FIG. 4 is an isometric view of a heat dissipation device in accordance with a still further alternative embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0014] Referring to FIG. 1, a heat dissipation device in accordance with the preferred embodiment of the present invention comprises a heat sink 10 and a pair of heat pipes 20.

[0015] The heat sink 10 comprises a solid base 12 adapted to be attached on an electronic package (not shown) and a flat plate 18 separate from and parallel to the base 12. A plurality of fins 16 extends between the base 12 and the plate 18. The plurality of fins 16 has opposite right angled ends 161 thereof soldered with solder such as tin, to the base 12 and the plate 18 at opposite ends thereof. Both of the right angled ends 161 not only provide sufficient area soldering to the corresponding base 12 and plate 18 but also abut against the neighboring fin for mutually enhancing rigidity of the neighboring fins. A pair of first holes 14 is defined in a side of the base 12. A pair of second holes 19 is defined in a corresponding side of the plate 19. Each heat pipe 20 is substantially U-shaped, and forms a capillary structure therein. Work medium is contained in the pipe 20. Opposite ends of each heat pipe 20 are engaged in a respective first hole 14 and a corresponding second hole 19.

[0016] In the present invention as illustrated by the above preferred embodiment, some heat accumulated at the base 12 is transferred to the fins 16 through the solder therebetween, while some said heat is transferred to the plate 18 via the heat pipes 20. The heat on the plate 18 is then transferred to the fins 16 through the solder therebetween. Thus, the base 12 is rapidly cooled.

[0017] Referring to FIG. 2, in the alternative embodiment of the present invention, first holes 14′ are defined in opposite sides of a base 12′ of a heat sink 10′, and second holes 19′ are correspondingly defined in opposite sides of a plate 18′. Four heat pipes 20 are engaged in the corresponding first and second holes 14′, 19′.

[0018] Referring to FIG. 3, in the further alternative embodiment of the present invention, a pair of first cutouts 14″ is defined in a side of a base 12″ of a heat sink 10″, and a pair of second cutouts 19″ is defined in a corresponding side of a plate 18″. A pair of heat pipes 20 is engaged in the corresponding first and second cutouts 14″, 19″.

[0019] Referring to FIG. 4, in the still further alternative embodiment of the present invention, first cutouts 14′″ are defined in opposite sides of a base 12′″ of a heat sink 10′″, and second cutouts 19′″ are correspondingly defined in opposite sides of a plate 18′″. Four heat pipes 20 are engaged in the corresponding first and second cutouts 14′″, 19′″.

[0020] In yet further alternative embodiments of the present invention, the base 12/12′/12″/12′″ maybe hollow and contain work medium therein.

[0021] It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the fill extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation device comprising: a heat sink comprising a base and a plate spaced apart from the base, a plurality of fins soldered to the base and the plate at opposite ends thereof; and a plurality of heat pipes thermally connecting the base and the plate.

2. The heat dissipation device of claim 1, wherein ports are defined in the base and the plate respectively, the ports receiving opposite ends of the heat pipes.

3. The heat dissipation device of claim 1, wherein the ports are holes.

4. The heat dissipation device of claim 1, wherein the ports are cutouts.

5. The hat dissipation device of claim 1, wherein the opposite ends of the fins are right angled and abut against the neighboring fins for not only providing sufficient area for soldering to both said base and plate, but also mutually enhancing rigidity of the neighboring fins.

6. A heat dissipation device comprising: a heat sink comprising a base, a plate spaced apart from the base, and a plurality of fins thermally connecting the base and the plate through solder; and a plurality of heat pipes engaged between the base and the plate, for transferring heat from the base to the plate.

7. The heat dissipation device of claim 6, wherein the solder is tin.

8. The hat dissipation device of claim 6, wherein at least one of the opposite ends of the fin is right angled and abuts against the neighboring fins, which not only provides sufficient area for soldering to the corresponding plate or base, but also mutually enhances rigidity of the neighboring fins.

9. A heat dissipation device comprising: a heat sink comprising a base, a plate spaced apart from the base, and a plurality of fins located between said base and said plate and thermally respectively connecting to at least one of the base and the plate through solder; and a plurality of heat pipes engaged between the base and the plate, for transferring heat from the base to the plate.

10. The hat dissipation device of claim 9, wherein at least one of the opposite ends of each of the fins is right angled and abuts against the neighboring fins, which not only provides sufficient area for soldering to the corresponding plate or base connected thereto, but also mutually enhances rigidity of the neighboring fins.