Patent Application
20070051498
The present invention relates to heat dissipation devices for use in removing heat from electronic devices, and more particularly to a heat dissipation device incorporating a heat pipe for improving heat dissipation efficiency of the heat dissipation device.
During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the electronic device to prevent it from becoming unstable or being damaged. Typically, a heat dissipation device is attached to an outer surface of the electronic device to absorb heat from the electronic device. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
Conventionally, a heat dissipation device comprises a solid metal base attached on the electronic device, and a plurality of fins arranged on the base. The base is intimately attached on the electronic device thereby absorbing the heat generated by the electronic device. Most of the heat accumulated at the base is transferred to the fins and is then dissipated from the fins. However, electronics technology continues to advance, and increasing amounts of heat are being generated by powerful state-of-the-art electronic devices. Many conventional heat dissipation devices are no longer able to efficiently remove heat from these electronic devices.
In order to overcome the disadvantages of the heat dissipation device set out above, one type of heat dissipation device used for the electronic device includes a heat pipe for transferring heat from a position to another position of the heat dissipation device. The heat pipe is a vacuum-sealed pipe that is filled with a phase changeable fluid, usually being a liquid, such as water, alcohol, acetone and so on, and has an inner wall thereof covered with a capillary configuration. As the electronic device heats up, a hot section which is usually called the evaporating section of the heat pipe and is located close to the electronic device also heats up. The liquid in the evaporating section of the heat pipe evaporates and the resultant vapor reaches a cool section usually called condensing section of the heat pipe and condenses therein. Then the condensed liquid flows to the evaporating section along the capillary configuration of the heat pipe. This evaporating/condensing cycle repeats and since the heat pipe transfers heat so efficiently, the evaporating section is kept at or near the same temperature as the condensing section of the heat pipe. Correspondingly, the heat-transfer capability of the heat dissipation device including the heat pipe is improved greatly.
Typically, a heat dissipation device illustrated as follows is used. The heat dissipation device comprises a base for absorbing heat from a heat generating electronic device, a heat pipe thermally connected to the base, and a plurality of fins arranged on the base. Generally, the heat pipe is I-shaped. The base defines a groove substantially in the center thereof receiving the heat pipe therein. In use, the base is in contact with the electronic device and absorbs heat from the electronic device. The heat in the base is absorbed by the heat pipe, and the heat pipe transfers the heat from the center to other parts of the base. The heat in the base spreads to the fins to be dissipated to ambient air. However, the heat pipe is straight, which results in the thermally contacting area between the base and the heat pipe being relatively small. Consequently, the heat in the center of the base can not be transmitted to other parts of the base rapidly and evenly. The heat generated by the electronic device accumulates in the center of the base and the electronic device. Normal functions and abilities of the electronic device are adversely affected. Therefore, the heat dissipation device needs to be improved.
What is needed, therefore, is a heat dissipation device which achieves a greater heat-transfer capability and a greater heat dissipation capability.
A heat dissipation device in accordance with a preferred embodiment of the present invention comprises a seat for absorbing heat from a heat generating electronic device, and a base having a first face and a second face opposite to the first face and thermally contacting the seat. A plurality of fins integrally extends from the first face of the base. Two heat pipes are thermally arranged on the second face of the base. Each of the two heat pipes is bent and has a section sandwiched between the second face of base and the seat, and another section thereof stretching along the second surface of the base from said section to a portion of the base in no attachment with the seat.
Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Referring to
The seat 10 is a substantially rectangular metal plate having great thermal conductivity, and has a bottom face (not labeled) for contacting with the electronic device (not shown) and a top face (not labeled) opposite the bottom face. Two parallel grooves 110 each with semicircular cross section are defined in the top face of the seat 10 for receiving the heat pipes 50 therein.
The heat sink 30 comprises a base 31 and a plurality of fins 33 on the base 31. The base 31 is a substantially rectangular plate and comprises a top face having the fins 33 integrally extending therefrom and a bottom face having a protrusion 34 extending downwardly from a center portion thereof. The protrusion 34 has a bottom face thereof defining two substantially U-shaped grooves 310 therein. The two grooves 310 are juxtaposed in the bottom face of the base 31 but oriented oppositely to each other. Each groove 310 comprises a first section 311 and two parallel second sections 313 substantially perpendicularly extending from two ends of the first section 311, respectively. The first sections 311 of the grooves 310 are located adjacent a center of the protrusion 34. The second sections 313 of the grooves 310 are located adjacent two opposite lateral sides of the bottom face of the base 31. The two first sections 311 of the two grooves 310 are parallel to each other. The corresponding second sections 313 of the two grooves 310 extend oppositely in the bottom face of the base 31. A round corner is formed at each joint of the first section 311 and second sections 313 of each groove 310.
Each of the two heat pipes 50 is substantially U-shaped and is identical to the groove 310 of the base 31 in profile. Each heat pipe 50 comprises a first transferring section 510 and two substantially parallel second transferring sections 530 extending from two ends of the first transferring section 510. A round corner is formed at each joint of the first and second transferring sections 510, 530 of each heat pipe 50.
Referring to
In use, the bottom face of the seat 10 contacts the electronic device to absorb heat from the electronic device. The heat in the seat 10 is absorbed by the first transferring sections 510 of the heat pipes 50 and the protrusion 34 of the heat sink 30. And then, part of the heat in the heat pipes 50 and the protrusion 34 directly spreads upward to the fins 33, and part of the heat is transferred outwardly to lateral portion of the base 31 of the heat sink 30 via the second transferring sections 530 of the heat pipes 50. Subsequently, the heat in the fins 33 is dissipated to ambient air.
According to the first embodiment of the present invention, the heat pipes 50 combined to the bottom of the base 31 of the heat sink 30 are curved to form a U-shape; therefore, the heat pipes 50 and the base 30 have a larger thermal contacting area therebetween; the heat in the center of the base 31 can be transferred to lateral portions of the base 31 rapidly via the second transferring sections of the heat pipes 50 in comparison with the conventional heat dissipation device; therefore, the heat generated by the electronic device is evenly distributed to the base 31, to thereby be dissipated by the fins 33 rapidly. Thus, the heat-dissipating capability of the present invention is improved greatly.
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It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200510037033.4 | Sep 2005 | CN | national |
