Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus and method. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The heat dissipation device comprises a first heat sink 10, a second heat sink 20, a heat pipe 30 and a back plate 40. The first heat sink 10 is disposed at the first side 82 of the circuit board 80 and separate from the electronic component 70 by the heat pipe 30. The second heat sink 20 is disposed at and parallel to the second side 84 of the circuit board 80. The back plate 40 abuts against the second side 84 of the circuit board 80 and disposed between the circuit board 80 and the second heat sink 20. The heat pipe 30 goes round an edge of the circuit board 80 and connects the first and second heat sinks 10, 20.
The first heat sink 10 comprises a base 12 and a plurality of parallel fins 14. The fins 14 extend from the base 12 in a direction away from the electronic component 70. A notch 122 is defined in a bottom of the base 12, opposite to the fins 14. The notch 122 has a rectangular configuration.
The second heat sink 20 comprises a plurality of parallel metallic flakes 24. The flakes 24 are interlocked together. Each flake 24 defines an opening (not labeled) therein. The openings of all of the flakes 24 are in alignment with each other and corporately define a channel 244 intersecting with the flakes after the flakes 24 are interlocked.
The heat pipe 30 is U-shaped, and plate-typed to have a substantially rectangular cross-section. The heat pipe 30 comprises a heat-absorber 32, a central connecter 34 and a heat-exhauster 36. Main surfaces (not labeled) of the heat-absorber 32 and the heat-exhauster 36 are parallel to the first and second sides 82, 84 of the circuit board 80. The heat-absorber 32 is inserted into the notch 122 of the first heat sink 10 and has an exposed main surface (not labeled) facing the first side 82 of the circuit board 80. The main surface is attached to the electronic component 70, whereby heat generated by the electronic component 70 is immediately absorbed by the heat-absorber 32. From the heat-absorber 32, a part of the heat is transferred to the first heat sink 10 for being dissipated to ambient air. Remaining part of the heat is transferred to the heat-exhauster 36 via a phase change of working fluid received in the heat pipe 30. The central connecter 34 connects the heat-absorber 32 to the heat-exhauster 36 to transfer the remaining part of the heat from the heat-absorber 32 to the heat-exhauster 36. The heat-exhauster 36 is fittingly engaged into the channel 244 of the second heat sink 20. The remaining part of the heat transferred to the heat-exhauster 36 is transferred to the flakes 24 for being dissipated to the ambient air.
The back plate 40 is cross-shaped and comprises four ears 41 outwardly extended. A post 410 extends perpendicularly from each ear 41 toward the second side 84 of the circuit board 80. The post 41 defines an inner threaded hole 412 therein for threadedly receiving a fixture 45 which has extended through the first heat sink 10 and the corresponding aperture 62 defined in the circuit board 80, to secure the first heat sink 10 to the circuit board 80 and thereby to render the heat-absorber 32 of the heat pipe 30 in intimate contact with the electronic component 70 and the first heat sink 10. In the preferred embodiment, the heat-absorber 32 can be soldered in the notch 122 and the heat-exhauster 36 can be soldered in the channel 244 in advance so that the first, second heat sinks 10, 20 and the heat pipe 30 form a subassembly before being assembled to the circuit board 80.
To improve air convection in the heat dissipation device, a fan 50 (see
In the preferred embodiment, the heat-absorber 32 of the plate-type heat pipe 30 has a contacting area enough to overlay and intimately contact with the electronic component 70 to absorb the heat generated by the electronic component 70.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200610061556.7 | Jul 2006 | CN | national |