Patent Application
20060104032
The present invention relates to a heat dissipation device, and particularly to a heat dissipation device including a heat sink and heat pipes for achieving great heat dissipation efficiency.
As computer technology continues to advance, electronic components such as central processing units (CPUs) of computers are made to provide faster operational speeds and greater functional capabilities. When a CPU operates at a high speed in a computer enclosure, its temperature usually increases greatly. It is desirable to dissipate the generated heat of the CPU quickly.
Conventionally, a heat dissipation device is used to dissipate heat generated by a CPU. Referring to
An improved heat dissipation device is desired to overcome the above-described disadvantage of the prior art.
Accordingly, an object of the present invention is to provide a heat dissipation device which can quickly and efficiently transfer heat away from an electronic unit.
To achieve the above-mentioned object, a heat dissipation device for an electronic unit comprises a heat sink and at least a heat pipe. The heat sink comprises a base for contacting with the electronic unit and a plurality of fins arranged on the base to create a first heat transfer path for the electronic unit. The heat pipe is attached to the heat sink and comprises an evaporating portion for contacting with the electronic unit, and a condensing portion thermally contacting with the fins to create a second heat transfer path for the electronic unit.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention together with the attached drawings, in which:
Referring to
The heat sink 1 comprises a base 12 adapted to be attached on an electronic unit 3, a plate 14 as an auxiliary member spaced from and parallel to the base 12, and a plurality of parallel fins 16 extending between the base 12 and the plate 14.
The base 12 defines a pair of slots 122. The plate 14 defines a pair of grooves 142. Opposite top and bottom edges of the fins 16 are bent to form a plurality of heat conducting flanges. The heat conducting flanges cooperatively form top and bottom surfaces 164, 162 of the fins 16. The top surface 164 of the fins 16 defines a pair of grooves 166 therein corresponding with the grooves 142 of the plate 14.
Each heat pipe 2 is U-shaped, and forms a capillary structure therein. Working medium is contained in the heat pipe 2. Opposite ends of each heat pipe 2 respectively form an evaporating portion 22 and a condensing portion 24. The evaporating portion 22 is engaged in the slot 122 of the base 12 and the condensing portion 24 is engaged in passages cooperatively formed by the groove 142 of the plate 14 and the groove 166 of the fins 16. The evaporating portion 22 of each heat pipe 2 is flat, and the bottom surface of the evaporating portion 22 is coplanar with the bottom surface of the base 12. The evaporating portion 22 of the heat pipe 2 is exposed along the top and bottom surfaces of the base 12.
The fins 16 are attached on the base 12. The bottom surface 162 of the fins 16 contacts with the top surface of the base 12, and some portions of each of the fins 16 located over the slots 122 contact with the top surfaces of the evaporating portions 22 of the heat pipes 2. The top surface 164 of the fins 16 contacts with the plate 14, and the condensing portions 24 of the heat pipes 2 contact with the fins 16 at the grooves 166.
In the present invention as illustrated by the above preferred embodiment, the connecting between the heat pipes 2 and the base 12, the heat pipes 2 and the plate 14, the heat pipes 2 and the fins 16 is by any joint way such as soldering. Some of heat generated by the electronic unit 3 is directly transferred to the base 12 and then to the fins 16 to create a first heat transfer path. The other of heat generated by the electronic unit 3 is directly transferred to the heat pipes 2 since the evaporating portions 22 of the heat pipes 2 directly contact with the electronic unit 3, and the heat pipes 2 directly transfer the heat to the fins 16 without transmitting the base 12. Therefore, a second heat transfer path is formed by the heat pipes 2 and the fins 16. In the second heat transfer path, the heat resistance is greatly reduced in comparison with the prior art.
Alternatively, the condensing portions 24 of the heat pipes 2 can extend through and connect with the fins 16 without use of the plate 14. In addition, one heat pipe 2 or more heat pipes 2 can be used, which bases on the quantity of heat generated by the electronic unit 3.
It is understood that the heat pipe 2 can be other alternative structures, such as S-shaped heat pipe having an evaporating portion and two parallel condensing portions, so far as the evaporating portion can contacts with the electronic unit 3, and the condensing portion can contacts with the portions of the fins located away from the electronic unit 3.
It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present examples and embodiments are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given therein.
