HEAT DISSIPATION DEVICE

Abstract

A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded view of a heat dissipation device in accordance with a preferred embodiment of the present invention;

FIG. 2 is an assembled view of the heat dissipation device in FIG. 1, together with an electronic package mounted on a printed circuit board; and

FIG. 3 is a bottom view of the heat dissipation device in FIG. 2.

Claims

1. A heat dissipation device, comprising: a first base plate having a flat top surface and a flat bottom surface adapted for connecting with a heat-generating electronic component;a plurality of flattened heat pipes supported on the top surface of the first base plate, each heat pipe comprising an evaporating section and a condensing section bent from the evaporating section;a fin assembly located above the heat pipes; anda thermally conductive layer formed between the heat pipes and the fin assembly, the thermal conductive layer having a flat surface contacting with the heat pipes; wherein the evaporating sections of the heat pipes abut side by side against each other and thermally connect with the first base plate, and the condensing sections thermally connect with the thermally conductive layer.

2. The heat dissipation device as claimed in claim 1, wherein the thermally conductive layer comprises a second base plate parallel to the first base plate, the second base plate comprising a flat bottom surface in contact with the heat pipes.

3. The heat dissipation device as claimed in claim 2, wherein the heat pipes are U-shaped.

4. The heat dissipation device as claimed in claim 3, wherein the heat pipes are arranged on a plane.

5. The heat dissipation device as claimed in claim 3, wherein the heat pipes can be divided into a first group of first heat pipes oriented at a first direction and a second group of second heat pipes oriented at a second direction different from the first direction.

6. The heat dissipation device as claimed in claim 5, wherein the evaporating sections of the first heat pipes and the evaporating sections of the second heat pipes are alternately arranged.

7. The heat dissipation device as claimed in claim 2, wherein the first base plate is smaller than the second base plate.

8. The heat dissipation device as claimed in claim 7, wherein the evaporating sections of the first and second pipes are fixed to the first base plate, while the condensing sections of the first and second heat pipes spread out from the first base plate and extend to reach other parts of the second base plate.

9. The heat dissipation device as claimed in claim 8, wherein the evaporating sections of the heat pipes are located between the condensing sections of the heat pipes.

10. The heat dissipation device as claimed in claim 2, wherein a through hole is defined in each corner of the second base plate for a fastener to extend therethough.

11. The heat dissipation device as claimed in claim 10, wherein four depressions are defined in the fin assembly corresponding to the through holes of the second base plate.

12. The heat dissipation device as claimed in claim 2, wherein the fin assembly comprises a plurality of individual fin plates arranged side by side, the fin plates comprise a plurality of flanges extending from bottom edges thereof, wherein the flanges of the fin plates are coplanar with each other and thermally connect with a flat top surface of the second base plate.

13. The heat dissipation device as claimed in claim 4, wherein the fin plates are oriented perpendicularly to the plane on which the heat pipes are arranged.

14. A base for removing heat from an electronic package, the base comprising: a first base plate having a flat top surface and a flat bottom surface adapted for engaging with the electronic package;a plurality of flattened heat pipes supported on the top surface of the first base plate, each heat pipe comprising an evaporating section and a condensing section bent from the evaporating section; anda second base plate parallel to the first base plate and comprising a flat bottom surface in contact with the heat pipes.

15. The base as claimed in claim 14, wherein the evaporating sections of the heat pipes abut side by side against each other.

16. The base as claimed in claim 14, wherein the heat pipes are U-shaped and arranged on a plane.

17. The heat dissipation device as claimed in claim 16, wherein the heat pipes are oriented at opposite directions.

18. An electronic assembly comprising: a printed circuit board;an electronic package mounted on the printed circuit board;a first flat plate having a flat bottom surface engaging with the electronic package and a flat top surface;a flattened heat pipe having an evaporating section engaging with the flat top surface of the first flat plate and a condensing section; anda fin assembly having a bottom surface thermally connecting with the condensing section of the heat pipe, wherein the heat pipe is sandwiched between the fin assembly and the first flat plate.

19. The electronic assembly of claim 18 further comprising a second flat plate sandwiched between the condensing section of the heat pipe and the bottom surface of the fin assembly, the second flat plate thermally connecting the condensing section of the heat pipe and the bottom surface of the fin assembly together.

20. The electronic assembly of claim 19, wherein the second flat plate is larger than the first flat plate.