The present invention relates generally to a heat dissipation device, and more particularly to a heat sink with low heat resistance.
Electronic devices such as central processing units (CPUs) generate a lot of heat during normal operation. If the heat generated by the electronic devices is not timely and properly dissipated, it can affect their operational stability and damage associated electronic devices. Thus the heat must be removed quickly and efficiently to ensure the normal operation of these electronic devices. A heat dissipation device is often attached to a top surface of the CPU to remove heat therefrom.
A heat dissipation device comprises a heat sink and a fan mounted on the heat sink. The heat sink comprises a central core, a plurality of branches radially extending outwardly from peripheries of the core, and a plurality of fins extending from the core and the branches. The fan comprises a plurality of blades. The branches and the fins extend and are oriented in a direction opposite to a rotational direction of the blades of the fan.
Other advantages and novel features of the present heat dissipation device will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
Many aspects of the present device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
As shown in
The heat sink 10 has a cylindrical configuration and comprises a central core 12 with a shape similar to a cube and four curved symmetrical branches 122 radially extending outwardly from four vertical edges of the core 12. The core 12 comprises four outer side surfaces (not labeled) separated by the branches 122. Each branch 122 comprises an outer side surface (not labeled) and an inner side surface (not labeled). The four outer side surfaces of the core 12 and the side surfaces of the four branches 122 cooperatively define four regions. A plurality of curved fins 14 extend outwardly from side surfaces of the core 12 and the branches 122. From a top-down view, the side surfaces of the core 12 and the branches 122 in each region are smoothly connected and form an inverse L-like projection. The fins 14 in different regions are oriented towards four different directions. In each region, the curved branches 122 and fins 14 extend and are oriented in a same direction, such as, for example, clockwise. The central core 12 comprises a top surface 120 and a bottom surface (not shown) configured for absorbing heat from the CPU. The core 12 has a central axis 16 as indicated by a dashed line in
Four protrusions 126 extend outwardly from lower portions of the branches 122. Each protrusion 126 is C-shaped and has a through hole 128 defined therein. The four fasteners 20 are adapted to engage in the through holes 128, for facilitating an attachment of the heat sink 10 onto the printed circuit board. Two recesses 127 are symmetrically defined in a circumferential periphery of the heat sink 10. In the embodiment the recesses 127 are defined in a middle level of the heat sink 10, and are defined by cutting away outer ends of two symmetrical branches 122 and the fins 14 adjacent to the two symmetrical branches 122.
The fan bracket 30 comprises a tubular frame 300 defining a central opening 310 therein. An annular flange 320 extends horizontally and outwardly from an upper edge of the frame 300 for supporting the fan 40 thereon. Four symmetrical ears 322 extend horizontally and outwardly from an outer edge of the flange 320. A pin 324 and a latch 326 extend perpendicularly and upwardly from each ear 322. The pin 324 and the latch 326 of each ear 322 are spaced from each other. Two symmetrical catches 330 extend downwardly from a lower edge of the frame 300, for engaging in the recesses 127 to firmly secure the fan bracket 30 to the heat sink 10. In the embodiment, the catches 330 are arranged below the two opposite ears 322.
The fan 40 is mounted on the heat sink 10 with the help of the fan bracket 30. The fan 40 has a substantially tubular housing 400 and a hub 402 received in the housing 400. A plurality of blades 404 radially extend from the hub 402. The housing 400 is provided with four pairs of tabs 411, 421 extending outwardly and horizontally from upper and lower edges of the housing 400. The tabs 411 each define a locating hole 413 therein. The holes 413 receive the pins 324 of the fan bracket 30 therein to position the fan 40 onto the fan bracket 30 in a horizontal direction. The tabs 411 are hooked by the latches 326 of the fan bracket 30 to hold the fan 40 on the fan bracket 30 in a vertical direction. The blades 404 of the fan 40 are configured to rotate in a direction opposite to the extension direction of the curved branches 122 and fins 14, such as the counterclockwise direction in the preferred embodiment.
As shown in
Referring to
Each clip 20a comprises a C-like base 22a. Two self-tapping screws 24a extending upwardly from respective ends of the base 22a are adapted to engage in the half-closed holes 154a from the bottom surface of the heat sink 10a. Thus the clips 20a are attached to the heat sink 10a securely. Two ears 222a extend outwardly from two side edges of the ends of the base 22a respectively in a roughly horizontal direction. Each ear 222a defines an aperture (not shown) for engaging with a fastener 25a used to secure the clip 20a to the printed circuit board.
It can be understood that the shape of the core 12 of the heat sink 10 can be prism-like, cylindrical, or parallelepiped, and is not limited to being cube-shaped. Referring to
Referring to
It can be understood that the curving directions of the branches 122, 122a, 522, 622 and the fins 14, 14a, 54, 64 all extend and are oriented opposite to the rotation direction of the blades 404 of the fan 40. Thus the airflow generated by the fan 40 can be conducted into the core 12, 12a, 52, 62 more easily, allowing more airflow to impinge on the core 12, 12a, 52, 62 and the fins 14, 14a, 54, 64. Therefore, the heat on the heat sink 10, 10a, 50, 60 can be quickly transferred to the airflow and dissipated to the surroundings along with the airflow from the heat sink 10, 10a, 50, 60.
It is to be understood, however, that even though numerous characteristics and advantages of the present heat dissipation device have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
2006 1 0060295 | Apr 2006 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
6336499 | Liu | Jan 2002 | B1 |
6343014 | Lin | Jan 2002 | B1 |
6407919 | Chou | Jun 2002 | B1 |
6547540 | Horng et al. | Apr 2003 | B1 |
6557626 | O'Sullivan et al. | May 2003 | B1 |
D478875 | Lee | Aug 2003 | S |
6657862 | Crocker et al. | Dec 2003 | B2 |
6662412 | Chuang et al. | Dec 2003 | B2 |
6671172 | Carter et al. | Dec 2003 | B2 |
6712127 | Lee | Mar 2004 | B2 |
6714415 | Shah | Mar 2004 | B1 |
D491260 | Luo | Jun 2004 | S |
6782941 | Lee | Aug 2004 | B2 |
D500745 | Duan et al. | Jan 2005 | S |
6886627 | Kozyra et al. | May 2005 | B2 |
6896046 | Lee et al. | May 2005 | B2 |
6924982 | Chen et al. | Aug 2005 | B2 |
D509483 | Watanabe et al. | Sep 2005 | S |
D511326 | Watanabe et al. | Nov 2005 | S |
D516526 | Watanabe et al. | Mar 2006 | S |
7038913 | Lee et al. | May 2006 | B2 |
7055578 | Ku et al. | Jun 2006 | B2 |
7113403 | Kuo et al. | Sep 2006 | B2 |
7123483 | Otsuki et al. | Oct 2006 | B2 |
7150311 | Liu | Dec 2006 | B2 |
7160080 | Lin | Jan 2007 | B2 |
D537418 | Watanabe et al. | Feb 2007 | S |
7178587 | Liu | Feb 2007 | B2 |
7188418 | Shah | Mar 2007 | B2 |
7281893 | Pan | Oct 2007 | B2 |
7289330 | Lu et al. | Oct 2007 | B2 |
D561120 | Chen et al. | Feb 2008 | S |
D561122 | Mochizuki et al. | Feb 2008 | S |
D561123 | Mochizuki et al. | Feb 2008 | S |
D561124 | Mochizuki et al. | Feb 2008 | S |
7331756 | Watanabe et al. | Feb 2008 | B2 |
D564460 | Otsuki et al. | Mar 2008 | S |
7411327 | Watanabe et al. | Aug 2008 | B2 |
20070146995 | Zhao et al. | Jun 2007 | A1 |
20070181288 | Chen et al. | Aug 2007 | A1 |
Number | Date | Country |
---|---|---|
2005158812 | Jun 2005 | JP |
Number | Date | Country | |
---|---|---|---|
20070242433 A1 | Oct 2007 | US |