Patent Application
20140116656
1. Technical Field
The disclosure relates to a heat dissipation module and an electronic device with the heat dissipation module, and more particularly to a heat dissipation module having heat dissipation fins and an electronic device with the heat dissipation module having heat dissipation fins.
2. Related Art
Ultra thin laptop is becoming a popular portable electronic device. Due to the blooming of touchscreen monitor technology, it is not easy to distinguish laptop and tablet apart. Diverse usages to portable electronic devices strongly affect the structures of portable electronic devices. To match the different users' needs in utilizing portable electronic devices, adjustable structures are introduced into the market to switch functions and structures of laptop and tablet. Generally speaking, the portable electronic device allows its monitor module and mainframe module to operate with different angles for reaching the most comfortable viewpoint to the user. For example, when operating under a tablet mode, the monitor module and the mainframe module are next to each other in parallel for carrying the portable electronic device conveniently and operating the portable electronic device. When operating under a laptop mode, the monitor module is moved or rotated to form a larger angle between the monitor module and the mainframe module, so that the monitor module is erected on the mainframe module.
However, the performance requirements of the portable electronic device under the tablet mode and the laptop mode are different. The portable electronic device under the tablet mode is usually for running programs making the portable electronic device generate less heat energy. The portable electronic device under the laptop usage mode is usually for running programs making the portable electronic device generate more heat energy
Therefore, the heat dissipation efficiency for portable electronic devices has to be enhanced for ensuring the system stability of portable electronic devices under different usage modes.
The heat dissipation module disclosed by the disclosure comprises a radiator. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density.
The electronic device disclosed by the disclosure comprises a first case, a heat source, a radiator, a fan and a heat conduction pipe. The first case has a plurality of heat dissipation holes. The heat source is disposed inside the first case. The radiator is disposed inside the first case and corresponds to the heat dissipation holes. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density. An air exhaust outlet of the fan faces toward the second fin assembly. The heat conduction pipe is in thermal contact with the first fins of the first fin assembly, the second fins of the second fin assembly and the heat source.
The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus does not limit the disclosure, wherein:
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
Please refer to
An electronic device 10 of this embodiment comprises a first case 11, a second case 12 pivotally connected to the first case 11 and a display module 13. A computing processor is, for example, disposed inside the first case 11 so that the first case 11 is a mainframe case of the electronic device 10. A plurality of heat dissipation holes 114 is, for example, disposed on a surface of the first case 11. The display module 13 is disposed in the second case 12 so that the second case 12 is a monitor case of the electronic device 10. The display module 13 is, for example, a touchscreen monitor.
The second case 12 can be turned relatively to the first case 11 to be at a folded position, overlapping the first case 11 as shown in
The second case 12 can be turned relatively to the first case 11 to be at an unfolded position to form an included angle with the first case 11 as shown in
Please refer to
More specifically, the electronic device 10 further comprises a motherboard 16, a heat source 15 and a heat dissipation module 14.
The motherboard 16 is disposed inside the first case 11. The heat source 15 is disposed inside the first case 11 and on the motherboard 16. The heat source 15 is, but is not limited to, a processing chip, for example a central processing unit (CPU) of the electronic device 10. The first case 11 has an upper surface 111, a lower surface 113 and a lateral surface 112 connected to the upper surface 111 and the lower surface 113. The heat dissipation holes 114 are distributed on a part of the upper surface 111, a part of the lateral surface 112 and a part of the lower surface 113. The heat dissipation module 14 is disposed inside the first case 11, and corresponds to the heat dissipation holes 114 on the first case 11.
The heat dissipation module 14 comprises a radiator 140, a fan 144 and a heat conduction pipe 143 (i.e. a heat pipe).
The radiator 140 is disposed adjacent to the lateral surface 112 of the first case 11. The radiator 140 comprises a first fin assembly 141 and a second fin assembly 142. The first fin assembly 141 comprises a plurality of first fins 1411 arranged abreast of each other, and the first fins 1411 have a first average distribution density. The first average distribution density of the first fins 1411 refers to a quantity of the first fins 1411 within a unit length of the first fin assembly 141. The second fin assembly 142 comprises a plurality of second fins 1421 arranged abreast of each other, and the second fins 1421 have a second average distribution density. The second average distribution density of the second fins 1421 refers to a quantity of the second fins 1421 within a unit length of the second fin assembly 142. More specifically, in this embodiment, the first fins 1411 are disposed at regular intervals. Every two of the adjacent first fins 1411 are separated by a first distance D1. The second fins 1421 are also disposed at regular intervals. Every two of the adjacent second fins 1421 are separated by a second distance D2 smaller than the first distance D1. In other words, the second fins 1421 are arranged with a higher density, and the first fins 1411 are arranged with a lower density. Furthermore, the first fins 1411 and the second fins 1421 of this embodiment are arranged abreast of each other.
An air exhaust outlet 1441 of the fan 144 faces the second fins 1421 of the second fin assembly 142, and the second fins 1421 of the second fin assembly 142 are disposed between the heat dissipation holes 114 on the lateral surface 112 and the fan 144.
The heat conduction pipe 143 is roughly in an L shape and the heat conduction pipe 143 has a first end 1431 and a second end 1432 opposite to the first end 1431. The shape of the heat conduction pipe 143 is taken as an example in this embodiment, and it should not be construed as a limitation to the disclosure. In some embodiments, the heat conduction pipe 143 is in a U shape or other shapes.
The electronic device 10 further comprises a heat conduction element 145 contacting on the heat source 15. The first end 1431 of the heat conduction pipe 143 is contacted on the heat conduction element 145 (i.e. the heat conduction element 145 is disposed between the heat conduction pipe 143 and the heat source 15) so that the first end 1431 of the heat conduction pipe 143 is in thermal contact with the heat source 15 through the heat conduction element 145. The second end 1432 of the heat conduction pipe 143 is in thermal contact with the second fins 1421 of the second fin assembly 142. A central part of the heat conduction pipe 143 between the first end 1431 and the second end 1432 is in thermal contact with the first fins 1411 of the first fin assembly 141 so that the first fin assembly 141 is between the first end 1431 and the second end 1432 of the heat conduction pipe 143.
The heat energy produced by the heated heat source 15 is transferred to the heat conduction pipe 143 through the heat conduction element 145. Then, the heat conduction pipe 143 transfers the heat energy evenly to the first fins 1411 of the first fin assembly 141 and the second fins 1421 of the second fin assembly 142. Because the first fins 1411 are arranged with a lower density, the air resistance can be reduced in favor of a natural convection current flowing through air passages between the first fins 1411. Accordingly, the heat energy absorbed by the first fin assembly 141 can be dissipated more efficiently.
Because the second fins 1421 are arranged with a higher density, the overall heat dissipation surface of the second fin assembly 142 can be enhanced. With a forced convection produced by the fan 144, the heat energy absorbed by the second fin assembly 142 can be dissipated efficiently.
Because the fins of conventional heat dissipation fin assembly are arranged at regular intervals, the conventional heat dissipation fin assembly cannot dissipate heat by using both natural convection and forced convection at the same time. The radiator 140 in this embodiment includes the two fin assemblies with different fin densities for dissipating heat dissipation by using both natural convection and forced convection at the same time. Therefore, the heat dissipation efficiency of the overall heat dissipation module 14 is enhanced.
According to the electronic device and its heat dissipation module of the above embodiment, the first fins of the first fin assembly are arranged with a lower density for reducing the air resistance in favor of dissipating heat by natural convection. Furthermore, the second fins of the second fin assembly are arranged with a higher density for increasing the heat dissipation surface in favor of dissipating heat by forced convection formed by the fan. Therefore, the electronic device and its heat dissipation module of the disclosure can dissipate heat by using both natural convection and forced convection at the same time for enhancing the overall heat dissipation efficiency of the electronic device and its heat dissipation module.
This non-provisional application claims priority under 35 U.S.C. §119(e) on Patent Application No(s). 61/718,540 filed in the United States on Oct. 25, 2012, the entire contents of which are hereby incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| 61718540 | Oct 2012 | US |
