Inner thermal coupling elements in heat dissipating housings

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H05K7/20436

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20436Inner thermal coupling elements in heat dissipating housings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter apparatus of a mobility with stacked coolers
- Patent number 12,150,285
- Issue date Nov 19, 2024
- Hyundai Motor Company
- Ji Hwan Lim
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic control device with heat-dissipating members and support...
- Patent number 12,108,573
- Issue date Oct 1, 2024
- Kubota Corporation
- Motohiro Kawanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inlet module, housing and electronic device
- Patent number 12,096,593
- Issue date Sep 17, 2024
- CHROMA ATE INC.
- Po-Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system and method for medical devices
- Patent number 12,076,525
- Issue date Sep 3, 2024
- ICU Medical, Inc.
- Kevin P. McLennan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fanless computer case
- Patent number 12,075,600
- Issue date Aug 27, 2024
- Anthony Lane Snyder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Charging connector for electric vehicle
- Patent number 12,054,060
- Issue date Aug 6, 2024
- T-Conn Precision (Zhongshan) Co., Ltd.
- Jia-Heng Zheng
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat exchange assembly for a pluggable module
- Patent number 12,050,352
- Issue date Jul 30, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Zachary Galbraith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal hinge system
- Patent number 12,032,171
- Issue date Jul 9, 2024
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,030,399
- Issue date Jul 9, 2024
- Skydio, Inc.
- Christopher C. Berthelet
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,017,553
- Issue date Jun 25, 2024
- Skydio, Inc.
- Patrick Allen Lowe
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Brushless DC motor power tool with combined PCB design
- Patent number 11,923,752
- Issue date Mar 5, 2024
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Cooking appliance
- Patent number 11,913,649
- Issue date Feb 27, 2024
- WELBILT DEUTSCHLAND GMBH
- Hannes Wild
- A21 - BAKING EDIBLE DOUGHS
Information Patent Grant
Heat dissipation unit
- Patent number 11,910,574
- Issue date Feb 20, 2024
- Asia Vital Components Co., Ltd.
- Kuo-Chun Hsieh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Support plate thin cladding
- Patent number 11,898,808
- Issue date Feb 13, 2024
- Apple Inc.
- Robert F. Meyer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power adapter
- Patent number 11,881,790
- Issue date Jan 23, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solid state drive apparatus and data storage apparatus including th...
- Patent number 11,800,686
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Sungchul Hur
- G11 - INFORMATION STORAGE
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 11,784,434
- Issue date Oct 10, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system with a hybrid cooling system
- Patent number 11,778,785
- Issue date Oct 3, 2023
- Aptiv Technologies Limited
- Jochen Suck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Host electronic device having a movable cooling component for remov...
- Patent number 11,765,848
- Issue date Sep 19, 2023
- Hewlett Packard Enterprise Development LP
- Michael Scott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with shielding covering heat dissipating elements
- Patent number 11,749,951
- Issue date Sep 5, 2023
- Dongguan Luxshare Technologies Co., Ltd.
- XiaoKai Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including thermal management mechanism and methods of man...
- Patent number 11,751,357
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power conversion device
- Patent number 11,711,897
- Issue date Jul 25, 2023
- Mitsubishi Electric Corporation
- Toshikazu Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,711,909
- Issue date Jul 25, 2023
- Kioxia Corporation
- Akitoshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising heat radiating structure
- Patent number 11,700,711
- Issue date Jul 11, 2023
- Samsung Electronics Co., Ltd.
- Chung-Hyo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular sensing device with cooling feature
- Patent number 11,683,911
- Issue date Jun 20, 2023
- Magna Electronics Inc.
- Wilhelm Johann Wolfgang Wöhlte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly
- Patent number 11,653,474
- Issue date May 16, 2023
- Molex, LLC
- You-Qian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing and electronic device
- Patent number 11,641,728
- Issue date May 2, 2023
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Yuhu Jia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assemblies including heat dispersing elements and related systems a...
- Patent number 11,617,284
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Xiaopeng Qu
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Thermal Management and Control System
- Publication number 20240381579
- Publication date Nov 14, 2024
- Scott Agnew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING FIN ARRANGEMENT OF A COOLER, THROUGH WHICH FLUID CAN FLOW,...
- Publication number 20240381591
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Marco Lorenz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CASING FOR COMPUTERS AND RACK FOR COMPUTERS
- Publication number 20240373594
- Publication date Nov 7, 2024
- SYSTEM INTELLIGENT CORP.
- Akihiro HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Busbar with Phase Change Material
- Publication number 20240339247
- Publication date Oct 10, 2024
- TE Connectivity Solutions GMBH
- Michael LUDWIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT SOURCE SIMULATION ASSEMBLY, CHASSIS HEAT DISSIPATIO...
- Publication number 20240314970
- Publication date Sep 19, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Han-Chih HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240276673
- Publication date Aug 15, 2024
- THINKWARE CORPORATION
- Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HE...
- Publication number 20240268076
- Publication date Aug 8, 2024
- ROHDE & SCHWARZ GMBH & CO. KG
- Yin TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER
- Publication number 20240224473
- Publication date Jul 4, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR COOLING A WIRELESS CHARGING SYSTEM
- Publication number 20240223009
- Publication date Jul 4, 2024
- iOttie Inc.
- Jeremy Leeds-Frank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240215202
- Publication date Jun 27, 2024
- TMY Technology Inc.
- Pei-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
- Publication number 20240215200
- Publication date Jun 27, 2024
- SERCOMM CORPORATION
- ChengPu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
- Publication number 20240204615
- Publication date Jun 20, 2024
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COOLING SYSTEM WITH COMMON MODULAR MANIFOLDS
- Publication number 20240206135
- Publication date Jun 20, 2024
- BAE Systems Controls Inc.
- Stephen J. Kosteva
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTEGRATION OF ACTIVE MEMS COOLING SYSTEMS INTO THIN COMPUTING DEVICES
- Publication number 20240179868
- Publication date May 30, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20240178093
- Publication date May 30, 2024
- Sony Semiconductor Solutions Corporation
- Takayuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Base Stations For Unmanned Aerial Vehicles (UAVs)
- Publication number 20240140228
- Publication date May 2, 2024
- Skydio, Inc.
- Patrick Allen Lowe
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL CONDUCTIVE DEVICE AND MANUFACTURING METHOD THEREOF, ELECTRI...
- Publication number 20240147671
- Publication date May 2, 2024
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- XiaoKai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Easily Recyclable Thermoplastic Housing
- Publication number 20240107713
- Publication date Mar 28, 2024
- COVESTRO DEUTSCHLAND AG
- Meiying Zhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANNULAR-SHAPED HEAT PIPE
- Publication number 20240098931
- Publication date Mar 21, 2024
- Dell Products L.P.
- Dominick LOVICOTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY CARD SOCKET
- Publication number 20240086653
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Akihiro IIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPLIANT COOLING PLATES
- Publication number 20240049431
- Publication date Feb 8, 2024
- Transport Phenomena Technologies, LLC
- Georgios KARAMANIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT IN ELECTRICAL BOXES USING PASSIVE COOLING
- Publication number 20240032237
- Publication date Jan 25, 2024
- CRESTRON ELECTRONICS, INC.
- Albert Pedoeem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR TRANSFERRING HEAT FROM AN ELECTRONIC HEAT SOURCE...
- Publication number 20240023281
- Publication date Jan 18, 2024
- Huawei Technologies Co., Ltd
- Fredrik Ohlsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411238
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- ILHAN YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20230411897
- Publication date Dec 21, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...
- Publication number 20230397372
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TERMINAL BLOCK
- Publication number 20230397373
- Publication date Dec 7, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Yuta KANEMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR
- Publication number 20230378683
- Publication date Nov 23, 2023
- YAZAKI CORPORATION
- Katsuya Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE
- Publication number 20230363111
- Publication date Nov 9, 2023
- Amulaire thermal technology, INC.
- KUO-WEI LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT-DISSIPATION HOLDER AND PROTECTIVE CASE FOR ELECTRONIC EQUIPMENT
- Publication number 20230363114
- Publication date Nov 9, 2023
- SHENZHEN BENKS TECHNOLOGY CO., LTD
- Xiaojiong LIN
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Inner thermal coupling elements in heat dissipating housings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Compressible thermal link

Inverter apparatus of a mobility with stacked coolers

Electronic control device with heat-dissipating members and support...

Inlet module, housing and electronic device

Thermal management system and method for medical devices

Fanless computer case

Charging connector for electric vehicle

Heat exchange assembly for a pluggable module

Electronic assembly for a vehicle display

Thermal hinge system

Base stations for unmanned aerial vehicles (UAVs)

Base stations for unmanned aerial vehicles (UAVs)

Brushless DC motor power tool with combined PCB design

Cooking appliance

Heat dissipation unit

Support plate thin cladding

Power adapter

Solid state drive apparatus and data storage apparatus including th...

Connector assembly with movable heat sink

Electronic system with a hybrid cooling system

Host electronic device having a movable cooling component for remov...

Electrical connector with shielding covering heat dissipating elements

Apparatus including thermal management mechanism and methods of man...

Power conversion device

Electronic device

Electronic device comprising heat radiating structure

Vehicular sensing device with cooling feature

Connector assembly

Housing and electronic device

Assemblies including heat dispersing elements and related systems a...

Patents Applicationslast 30 patents

Thermal Management and Control System

COOLING FIN ARRANGEMENT OF A COOLER, THROUGH WHICH FLUID CAN FLOW,...

CASING FOR COMPUTERS AND RACK FOR COMPUTERS

Busbar with Phase Change Material

ADJUSTABLE HEAT SOURCE SIMULATION ASSEMBLY, CHASSIS HEAT DISSIPATIO...

ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HE...

SERVER

SYSTEMS AND METHODS FOR COOLING A WIRELESS CHARGING SYSTEM

PACKAGE STRUCTURE

HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE

BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN

COOLING SYSTEM WITH COMMON MODULAR MANIFOLDS

INTEGRATION OF ACTIVE MEMS COOLING SYSTEMS INTO THIN COMPUTING DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

Base Stations For Unmanned Aerial Vehicles (UAVs)

THERMAL CONDUCTIVE DEVICE AND MANUFACTURING METHOD THEREOF, ELECTRI...

Easily Recyclable Thermoplastic Housing

ANNULAR-SHAPED HEAT PIPE

MEMORY CARD SOCKET

COMPLIANT COOLING PLATES

THERMAL MANAGEMENT IN ELECTRICAL BOXES USING PASSIVE COOLING

HEAT SPREADER FOR TRANSFERRING HEAT FROM AN ELECTRONIC HEAT SOURCE...

SEMICONDUCTOR DEVICE

CONNECTOR ASSEMBLY

APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...

TERMINAL BLOCK

CONNECTOR

IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE

HEAT-DISSIPATION HOLDER AND PROTECTIVE CASE FOR ELECTRONIC EQUIPMENT