Inner thermal coupling elements in heat dissipating housings

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CPC
H05K7/20436

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20436Inner thermal coupling elements in heat dissipating housings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Motor device and oil pump device
- Patent number 12,355,338
- Issue date Jul 8, 2025
- Mitsuba Corporation
- Shun Ogayu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Connector
- Patent number 12,341,287
- Issue date Jun 24, 2025
- Yazaki Corporation
- Katsuya Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conduit for electronic device
- Patent number 12,328,845
- Issue date Jun 10, 2025
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat source simulation assembly, chassis heat dissipatio...
- Patent number 12,317,447
- Issue date May 27, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Han-Chih Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply enclosure, power supply conversion apparatus, and elec...
- Patent number 12,308,734
- Issue date May 20, 2025
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Lin Du
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Camera module
- Patent number 12,309,480
- Issue date May 20, 2025
- LG Innotek Co., Ltd
- Jong Cheol Choi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wireless charging power bank
- Patent number 12,302,534
- Issue date May 13, 2025
- Guangdong Aoyun Technology Co., LTD
- Xueping Zhu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus including thermal management mechanism and methods of man...
- Patent number 12,284,788
- Issue date Apr 22, 2025
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,275,318
- Issue date Apr 15, 2025
- Skydio, Inc.
- Patrick Allen Lowe
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Cooling device for cooling components of a circuit board
- Patent number 12,274,024
- Issue date Apr 8, 2025
- Nexalus Limited
- Anthony Robinson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 12,272,896
- Issue date Apr 8, 2025
- Molex, LLC
- Che-Yuan Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,246,610
- Issue date Mar 11, 2025
- Skydio, Inc.
- Phoebe Josephine Altenhofen
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Enhanced thermal management in electrical boxes using passive cooling
- Patent number 12,250,788
- Issue date Mar 11, 2025
- Crestron Electronics, Inc.
- Albert Pedoeem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration of active MEMS cooling systems into thin computing devices
- Patent number 12,245,396
- Issue date Mar 4, 2025
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system with common modular manifolds
- Patent number 12,238,904
- Issue date Feb 25, 2025
- Bae Systems Controls Inc.
- Stephen J. Kosteva
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device
- Patent number 12,222,783
- Issue date Feb 11, 2025
- Getac Technology Corporation
- Wan-Lin Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for securing and releasing a first module and a second modul...
- Patent number 12,218,402
- Issue date Feb 4, 2025
- Huawei Technologies Co., Ltd.
- Niklas Lekselius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,200,899
- Issue date Jan 14, 2025
- Innolux Corporation
- Yung-Kan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device and heatsink assembly incorporating the same
- Patent number 12,185,493
- Issue date Dec 31, 2024
- Aptiv Technologies AG
- Jakub Antoni Korta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter apparatus of a mobility with stacked coolers
- Patent number 12,150,285
- Issue date Nov 19, 2024
- Hyundai Motor Company
- Ji Hwan Lim
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic control device with heat-dissipating members and support...
- Patent number 12,108,573
- Issue date Oct 1, 2024
- Kubota Corporation
- Motohiro Kawanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inlet module, housing and electronic device
- Patent number 12,096,593
- Issue date Sep 17, 2024
- CHROMA ATE INC.
- Po-Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system and method for medical devices
- Patent number 12,076,525
- Issue date Sep 3, 2024
- ICU Medical, Inc.
- Kevin P. McLennan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fanless computer case
- Patent number 12,075,600
- Issue date Aug 27, 2024
- Anthony Lane Snyder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Charging connector for electric vehicle
- Patent number 12,054,060
- Issue date Aug 6, 2024
- T-Conn Precision (Zhongshan) Co., Ltd.
- Jia-Heng Zheng
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat exchange assembly for a pluggable module
- Patent number 12,050,352
- Issue date Jul 30, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Zachary Galbraith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal hinge system
- Patent number 12,032,171
- Issue date Jul 9, 2024
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Base stations for unmanned aerial vehicles (UAVs)
- Patent number 12,030,399
- Issue date Jul 9, 2024
- Skydio, Inc.
- Christopher C. Berthelet
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
- Publication number 20250239911
- Publication date Jul 24, 2025
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...
- Publication number 20250234493
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOUBLE SIDED DISPLAY ASSEMBLY WITH BI-DIRECTIONAL FLOW THROUGH A CO...
- Publication number 20250227902
- Publication date Jul 10, 2025
- MANUFACTURING RESOURCES INTERNATIONAL, INC.
- Kevin O'Connor
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Optical Transceiver Module and Communication Device
- Publication number 20250220861
- Publication date Jul 3, 2025
- Huawei Technologies Co., Ltd
- Ming Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY-CONDUCTIVE SHEET
- Publication number 20250203815
- Publication date Jun 19, 2025
- SEKISUI POLYMATECH CO., LTD.
- Kenta KUROO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
IMMERSION COOLING FIN ASSEMBLY AND IMMERSION COOLING SYSTEM FOR TWO...
- Publication number 20250194048
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-Hsien WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATION OF ACTIVE MEMS COOLING SYSTEMS INTO THIN COMPUTING DEVICES
- Publication number 20250185203
- Publication date Jun 5, 2025
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK STRUCTURE
- Publication number 20250176139
- Publication date May 29, 2025
- KMW Inc.
- Duk Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM FOR COOLING ELECTRONIC DEVICES
- Publication number 20250169030
- Publication date May 22, 2025
- ICEOTOPE GROUP LIMITED
- Neil EDMUNDS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting System For Mounting An Element To An Aircraft Surface
- Publication number 20250151233
- Publication date May 8, 2025
- Carlisle Interconnect Technologies, Inc.
- Bradley J. Purpus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED HEAT SINK WITH A DISCERNIBLE COMPONENT AS PART OF A DEVICE...
- Publication number 20250126755
- Publication date Apr 17, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Saad Bushnaq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
- Publication number 20250120048
- Publication date Apr 10, 2025
- xFusion Digital Technologies Co., Ltd.
- Minqi Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT MODULAR HYBRID HEAT EXCHANGER (CMH2X)
- Publication number 20250071948
- Publication date Feb 27, 2025
- Rockwell Collins, Inc.
- Chad A. Siemering
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...
- Publication number 20250063701
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE ARRANGEMENT
- Publication number 20250024584
- Publication date Jan 16, 2025
- Genomtec S.A.
- Henryk Roguszczak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARALLEL COOLING METHODOLOGIES
- Publication number 20250024651
- Publication date Jan 16, 2025
- Vitesco Technologies USA, LLC
- Wai-Tak Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOTTOM HOUSING FOR DOME CAMERA HAVING HIGH HEAT DISSIPATION EFFICIENCY
- Publication number 20250020979
- Publication date Jan 16, 2025
- IDIS CO., LTD.
- Jin Kyu SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management and Control System
- Publication number 20240381579
- Publication date Nov 14, 2024
- Scott Agnew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING FIN ARRANGEMENT OF A COOLER, THROUGH WHICH FLUID CAN FLOW,...
- Publication number 20240381591
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Marco Lorenz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CASING FOR COMPUTERS AND RACK FOR COMPUTERS
- Publication number 20240373594
- Publication date Nov 7, 2024
- SYSTEM INTELLIGENT CORP.
- Akihiro HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Busbar with Phase Change Material
- Publication number 20240339247
- Publication date Oct 10, 2024
- TE Connectivity Solutions GMBH
- Michael LUDWIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE HEAT SOURCE SIMULATION ASSEMBLY, CHASSIS HEAT DISSIPATIO...
- Publication number 20240314970
- Publication date Sep 19, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Han-Chih HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240276673
- Publication date Aug 15, 2024
- THINKWARE CORPORATION
- Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HE...
- Publication number 20240268076
- Publication date Aug 8, 2024
- ROHDE & SCHWARZ GMBH & CO. KG
- Yin TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER
- Publication number 20240224473
- Publication date Jul 4, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR COOLING A WIRELESS CHARGING SYSTEM
- Publication number 20240223009
- Publication date Jul 4, 2024
- iOttie Inc.
- Jeremy Leeds-Frank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240215202
- Publication date Jun 27, 2024
- TMY Technology Inc.
- Pei-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
- Publication number 20240215200
- Publication date Jun 27, 2024
- SERCOMM CORPORATION
- ChengPu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
- Publication number 20240204615
- Publication date Jun 20, 2024
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COOLING SYSTEM WITH COMMON MODULAR MANIFOLDS
- Publication number 20240206135
- Publication date Jun 20, 2024
- BAE Systems Controls Inc.
- Stephen J. Kosteva
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Inner thermal coupling elements in heat dissipating housings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Motor device and oil pump device

Connector

Thermal conduit for electronic device

Adjustable heat source simulation assembly, chassis heat dissipatio...

Power supply enclosure, power supply conversion apparatus, and elec...

Camera module

Wireless charging power bank

Apparatus including thermal management mechanism and methods of man...

Base stations for unmanned aerial vehicles (UAVs)

Cooling device for cooling components of a circuit board

Connector assembly with movable heat sink

Base stations for unmanned aerial vehicles (UAVs)

Enhanced thermal management in electrical boxes using passive cooling

Integration of active MEMS cooling systems into thin computing devices

Cooling system with common modular manifolds

Electronic device

Device for securing and releasing a first module and a second modul...

Electronic device

Cooling device and heatsink assembly incorporating the same

Compressible thermal link

Inverter apparatus of a mobility with stacked coolers

Electronic control device with heat-dissipating members and support...

Inlet module, housing and electronic device

Thermal management system and method for medical devices

Fanless computer case

Charging connector for electric vehicle

Heat exchange assembly for a pluggable module

Electronic assembly for a vehicle display

Thermal hinge system

Base stations for unmanned aerial vehicles (UAVs)

Patents Applicationslast 30 patents

BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN

APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MAN...

DOUBLE SIDED DISPLAY ASSEMBLY WITH BI-DIRECTIONAL FLOW THROUGH A CO...

Optical Transceiver Module and Communication Device

THERMALLY-CONDUCTIVE SHEET

IMMERSION COOLING FIN ASSEMBLY AND IMMERSION COOLING SYSTEM FOR TWO...

INTEGRATION OF ACTIVE MEMS COOLING SYSTEMS INTO THIN COMPUTING DEVICES

HEAT SINK STRUCTURE

APPARATUS AND SYSTEM FOR COOLING ELECTRONIC DEVICES

Mounting System For Mounting An Element To An Aircraft Surface

RECESSED HEAT SINK WITH A DISCERNIBLE COMPONENT AS PART OF A DEVICE...

HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE

COMPACT MODULAR HYBRID HEAT EXCHANGER (CMH2X)

LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...

THERMAL INTERFACE ARRANGEMENT

PARALLEL COOLING METHODOLOGIES

BOTTOM HOUSING FOR DOME CAMERA HAVING HIGH HEAT DISSIPATION EFFICIENCY

Thermal Management and Control System

COOLING FIN ARRANGEMENT OF A COOLER, THROUGH WHICH FLUID CAN FLOW,...

CASING FOR COMPUTERS AND RACK FOR COMPUTERS

Busbar with Phase Change Material

ADJUSTABLE HEAT SOURCE SIMULATION ASSEMBLY, CHASSIS HEAT DISSIPATIO...

ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HE...

SERVER

SYSTEMS AND METHODS FOR COOLING A WIRELESS CHARGING SYSTEM

PACKAGE STRUCTURE

HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE

BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN

COOLING SYSTEM WITH COMMON MODULAR MANIFOLDS