This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201310464418.3 filed in China, P.R.C. on Oct. 8, 2013, the entire contents of which are hereby incorporated by reference.
1. Technical Field of the Invention
This disclosure relates to a heat dissipation module, more particularly to a heat dissipation module with a stacked fin heat sink and a heat pipe running through another multiple fins.
2. Description of the Related Art
As the processing capability of an electronic component increases, the processing efficiency thereof improves. The heat generated by the electronic component, however, grows accordingly, which cause the electronic component to fail because of high temperature. To solve this problem, a heat dissipation module is usually installed for heat dissipation.
Generally speaking, in today's heat dissipation module, a heat conducting plate is in thermal contact with a heat source and then a heat pipe is used for transfering heat to multiple fins in order to dissipate the heat. In this heat dissipation module, the heat pipe penetrates the multiple fins so it is hard to reduce the size of the heat dissipation module. On the other hand, the heat pipe is vital for heat transfer so the heat dissipation module cannot work effectively without the heat pipe. Hence, it is very important to design a heat dissipation module having the heat pipe not only capable of being installed in limited space, but also with excellent heat dissipation efficiency.
A heat dissipation module comprises a heat conducting plate having an upper surface, a stacked fins heat sink in thermal contact with and disposed on the upper surface of the heat conducting plate, at least one heat pipe and a plurality of fins. The evaporation end is in thermal contact with and disposed on the upper surface. The plurality of fins are located on the upper surface and positioned at intervals. Each of the fins has at least one through hole and the condensation end runs through the at least one through hole.
The disclosure will become more fully understood from the detailed description given herein below and the drawing are for illustration only, and thus does not limit the present disclosure, wherein:
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
The heat conducting plate 14 has an upper surface 141 and a lower surface 143. In this embodiment, the lower surface 143 is in thermal contact with a heat source 12, but it is not intended to limit the disclosure. For example, in another embodiment, the lower surface of the heat dissipating plate is not in thermal contact with the heat source 12. In contrast, the evaporation end of the heat pipe is in thermal contact with the heat source 12 directly. This will be illustrated in detail later, in the description of another embodiment of the disclosure. In this embodiment, the heat conducting plate 14 is a vapor chamber. The working process of the vapor chamber is similar to that of the heat pipe. That is, the fluid circulates in an enclosed flat chamber while evaporating and condensing, so that the temperature can distribute evenly. However, the heat transfer method of the heat pipe is one dimensional (because the heat transfers along the heat pipe), while that of the vapor chamber is two dimensional (because the chamber is planer shaped). As a result, the vapor chamber can not only transfer the heat to the desired place like heat pipe, but also can distribute heat rapidly. Nonetheless, the conducting plate 14 is not limited to the vapor chamber. In other embodiments, the conducting plate 14 may be a plate made by aluminum or copper.
The stacked fin heat sink 16 is disposed on the upper surface 141 of the heat conducting plate 14. Specifically, the stacked fin heat sink 16 is multiple fins stacked together and each of the stacked fin heat sink 16 is perpendicular to the heat conducting plate 14. Moreover, a first distance H1 is formed between the top of the stacked fin heat sink 16 and the heat conducting plate 14. The stacked fin heat sink 16 is in thermal contact with the heat conducting plate 14, so the heat conducting plate 14 can transfer the heat to the stacked fin heat sink 16. Thereby, the heat can be dissipated from the stacked fin heat sink 16. In this embodiment, the material of the stacked fin heat sink 16 is copper, but the disclosure is not limited thereto.
The four heat pipes 18 each has an evaporating end 181 and a condensation end 183. The evaporating end 181 is disposed on the upper surface 141 of the heat conducting plate 14, and the evaporating end 181 is in thermal contact with the upper surface 141 of the heat conducting plate 14 (as shown in
As seen in
The heat conducting plate 34 has an upper surface 341 and a lower surface 343. In this embodiment, the heat conducting plate 34 is a vapor chamber. The working process of the vapor chamber is already illustrated in the above-mentioned description so it will not be repeated again. Also, the heat conducting plate 34 is not limited to be the vapor chamber. In other embodiments, it can also be a plate made by aluminum or copper.
The stacked fin heat sink 36 is disposed on the upper surface 341 of the heat conducting plate 34. Specifically, the stacked fin heat sink 36 is multiple fins stacked together and since they are disposed, each of the stacked fin heat sink 36 is perpendicular to the heat conducting plate 34. Moreover, a first distance H1′ is formed between the top of the stacked fin heat sink 36 and the heat conducting plate 34. The stacked fin heat sink 36 is in thermal contact with the heat conducting plate 34, so the heat conducting plate 34 can transfer the heat to the stacked fin heat sink 36. Thereby, the heat can be dissipated from the stacked fin heat sink 36. In this embodiment, the material of the stacked fin heat sink 36 is copper, but the disclosure is not limited thereto.
The four heat pipes 38 each has an evaporating end 381 and a condensation end 383. The condensation end 383 is disposed on the upper surface 341 of the heat conducting plate 34, and the evaporating end 381 is in thermal contact with the lower surface 343 of the heat conducting plate 34 and two opposite sides of the evaporating end 381 are in thermal contact with the lower surface 343 and the heat source 32, respectively (as shown in
As seen in
The above-mentioned heat dissipation module comprises both the stacked fin heat sink and the heat pipe running through the multiple fins (different from the stacked fin heat sink). The use of the stacked fin heat sink reduces the partial size of the heat dissipation module, so that it can be installed inside the electronic device with limited inner space. Moreover, this heat dissipation module still has heat pipe penetrating the fins, so the heat can be effectively transferred during the heat dissipation process. As a result, the heat dissipation module of the disclosure can be installed in limited space without sacrificing its heat dissipation efficiency.
Additionally, in the heat dissipation module, the vapor chamber is used for better thermal diffusion, thereby achieving excellent heat dissipation efficiency.
Number | Date | Country | Kind |
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201310464418.3 | Oct 2013 | CN | national |