1. Technical Field
The present disclosure relates to heat dissipation modules, and particularly to a heat dissipation module suitable for use in a device such as a computer for dissipating heat of heat-generating electronic components of the computer.
2. Description of Related Art
With the continuing development of electronics technology, electronic packages such as CPUs (central processing units) are more powerful and liable to generate more heat than previously. When the electronic package is installed and in use in an electronic device, the generated heat requires immediate dissipation. A thermal module is usually mounted on the electronic package for dissipating the heat generated thereby. A plurality of mounting elements are needed for securing the thermal module onto the electronic package.
Typically, each mounting element includes a bolt. The bolt has a head, and defines an annular groove in an outer circumferential surface near a bottom end. A spring is disposed around a top end of the bolt, and a ring-like clipping member (such as a C-clip) is provided. The clipping member is made of a metal with good resiliency, and is capable of being snappingly engaged in the groove. In assembly of the thermal module, the bottom end of each of the bolts is extended through a corresponding through aperture defined in a base of the thermal module, and the corresponding clipping member is snapped into the groove of the bottom end of the bolt. Thus, the spring is biased between the head and the base of the thermal module, and the bolt is stopped from moving up away from the through aperture of the thermal module. Thereby, the bolts are pre-assembled onto the thermal module. The bolts are then screwed into screw apertures defined in a circuit board on which the electronic component is mounted, to assemble the thermal module onto the electronic component and the circuit board.
During the pre-assembling of the bolts and the clipping members to the thermal module, there is no mechanism provided which can reliably ensure that the clipping members are properly snapped into the grooves of the bolts. That is, the clipping members may not be firmly and fittingly snapped into the grooves. When this happens, the clipping members are liable to drop off from the bolts during transportation of the pre-assembled thermal module.
Therefore, a heat dissipation module is desired to overcome the above described shortcomings.
Referring also to
The base 10 is substantially rectangular in profile, and forms four sleeves 101 at four corners thereof, respectively. Each sleeve 101 has a peripheral sidewall 106 extending up from the base 10, and defines a through aperture 102. The sidewall 106 surrounds the through aperture 102. The through aperture 102 includes a small hole 104 at a bottom of the sleeve 101 and a large hole 103 at a top of the sleeve 101. The large hole 103 has a diameter greater than that of the small hole 104. A step 105 is formed in the sidewall 106 where the large hole 103 communicates with the small hole 104. In the illustrated embodiment, the step 105 has an annular filleted surface at a top inner periphery thereof. The coil spring 116 has an outer diameter greater than the diameter of the small hole 104 of the through aperture 102. In the illustrated embodiment, the coil spring 116 has an inner diameter which is also greater than the diameter of the small hole 104 of the through aperture 102. The annular flange 113 has a diameter slightly greater than the diameter of the small hole 104 of the through aperture 102. A through slot 107 is defined in the sidewall 106 of the sleeve 101 parallel to an axis of the sleeve 101, thereby separating the sidewall 106 into two clamping portions 108 spaced from each other.
In assembly of the heat dissipation module 1, the following steps are performed for each fastener 11. The coil spring 116 is mounted to surround the main portion 111 of the fastener 11. The fastener 11 is placed in the corresponding through aperture 102 of the base 10 with the annular flange 113 resting on the step 105 of the through aperture 102. The head portion 110 of the fastener 11 is then pressed downwardly, and the annular filleted surface 114 drives the two clamping portions 108 to expand outwardly away from each other and thereby enlarge the small hole 104 of the through aperture 102. The annular filleted surface 114 guides the annular flange 113 to move into the small hole 104. When the annular flange 113 has completely passed through the small hole 104 of the through aperture 102, the clamping portions 108 resiliently rebound to their original states, and the small hole 104 thereby returns to its original dimension and state. The annular flange 113 abuts against a bottom of the sleeve 101, and the coil spring 116 is partly received in the large hole 103 and located between the head portion 110 of the fastener 11 and the step 105 of the sidewall 106. Thus, the fasteners 11 are pre-assembled to the base 10.
When assembling the base 10 to the electronic component 3, the thread portions 112 of the fasteners 11 are threadedly engaged in the screw holes 20 of the circuit board 2. Thus, the electronic component 3 is sandwiched between the circuit board 2 and the base 10, and intimately contacts the base 10. In the present embodiment, for each fastener 11, the annular flange 113 is integrally formed on the main portion 111 of the fastener 11 and thus cannot drop off from the main portion 111 of the fastener 11. That is, the annular flange 113 and the main portion 111 are monolithically integral.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200910309852.8 | Nov 2009 | CN | national |