The present invention relates to a heat pipe structure and a method for fabricating the heat pipe, and more particular, to a method for fabricating a heat pipe structure of which a wick structure is attached to an inner surface of an end portion thereof such that a heat pipe can be used to contact a heat source with the end portion for dissipation.
Heat pipes have been commonly used for dissipating heat generated by electronic products. The heat pipes have high thermal conducting ability, high thermal transmission, high thermal conductivity, light weight, non-mobile device, simple structure and versatile applications.
As shown in
However, the conoid ends of the heat pipe 1a do not have wick structure attached or with incomplete attachment. Therefore, conventional heat pipes can not use the end portion to contact the heat sink or heat source for dissipating.
The present invention provides a method for fabricating a heat pipe structure of which the woven wick structure is attached to the inner surface of the end portion thereof such that the heat pipe can be used to contact a heat source with the end portion for dissipation. Therefore, more availability for dissipating of the heat pipe can be obtained and further the limitation in use can be reduced too.
The heat pipe structure provided by the present invention includes a tubular member, and a woven wick structure having a base portion formed at one end of the tubular member and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member. As such, an end portion of a heat pipe can be used to contact a heat source for dissipation.
The method for fabricating the heat pipe includes providing at least one layer of woven wick, selecting a jointless and flat center portion of the woven wick as the base portion and folding upward the rest of the woven wick to form the surrounding portion extending from the base portion, and placing the woven wick inside the tubular member to attach the base portion on the inner surface of the bottom portion and attach the surrounding portion on the interior wall of the tubular member.
These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
These, as well as other features of the present invention, will become apparent upon reference to the drawings wherein:
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
The tubular member 10 is hollow and includes two openings 100, 101 at both ends connecting to the bottom portion 11 and the lid 12, respectively. The bottom portion 11 has an inner surface 110 and an outer surface 111. The inner surface 110 can be formed as a plane surface, a conical surface, a convex surface or a concave surface. Further, the bottom portion 11 can be integratedly formed with the tubular member 10. The lid 12 includes a through hole 120 for an injection tube 121 being installed therein so that the working fluid can be filled into the heat pipe thereby.
Furthermore, a woven wick structure 102 having a base portion 103 and a surrounding portion 104 extending therefrom is mounted inside the tubular member 10 of the heat pipe 1. The base portion 103 is attached to the inner surface 110 of the bottom portion 11 and the surrounding portion 104 is attached to the interior wall of the tubular member 10. Please refer to
As such, according to the above description, the heat pipe structure of the present invention is obtained.
Referring to
Finally, as shown in
This disclosure provides exemplary embodiments of the present invention. The scope of this disclosure is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in shape, structure, dimension, type of material or manufacturing process may be implemented by one of skill in the art in view of this disclosure.
This application is a continuation-in-part of U.S. patent application Ser. No. 10/750,966, filed on Jan. 5, 2004 now abandoned.
Number | Name | Date | Kind |
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3720988 | Waters | Mar 1973 | A |
3789920 | Low et al. | Feb 1974 | A |
3955619 | Corman et al. | May 1976 | A |
4951740 | Peterson et al. | Aug 1990 | A |
6466442 | Lin | Oct 2002 | B2 |
6766817 | da Silva | Jul 2004 | B2 |
20050011633 | Garner et al. | Jan 2005 | A1 |
Number | Date | Country | |
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20060086483 A1 | Apr 2006 | US |
Number | Date | Country | |
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Parent | 10750966 | Jan 2004 | US |
Child | 11297370 | US |