Claims
- 1. A heat process device comprising:
- plural heat process units piled one upon the others at a certain interval, each of said heat process units including a heat transfer plate on one side of which an object to be processed is mounted; a film-like heating body attached to the other side of the heat transfer plate; electrodes attached to the film-like heating body; and a system for supplying a predetermined amount of current to the electrodes.
- 2. The heat process device according to claim 1, wherein said object to be processed is a semiconductor wafer, a liquid crystal device or a printing resister.
- 3. A heat process device comprising:
- a heat transfer plate on one side of which an object to be processed is mounted,
- a film-like heating body formed on this one side of said heat transfer plate,
- electrodes formed on and along both side edges of said film-like heating body,
- a means for supplying a predetermined amount of current to said electrodes, and
- an insulation layer formed not on said electrodes but on said film-like heating body.
- 4. A heat process device comprising plural heat process units piled one upon the other at a certain interval, said heat process unit including a heat transfer plate on one side of which an object to be processed is mounted, a film-like heating body formed on this side of said heat transfer plate, electrodes formed on and along both side rims of said film-like heating body, a means for supplying a predetermined amount of current to said electrodes, and an insulation layer formed not on said electrodes but on said film-like heating body.
- 5. The heat process device according to any of claims 3 and 4, wherein said insulation layer formed on the film-like heating is made of a material selected from the group consisting of: alumina, zirconia, silicon carbonite, silicon nitride, quartz, rutile, high alumina brick and carbon brick.
Priority Claims (1)
Number |
Date |
Country |
Kind |
63-148719 |
Jun 1988 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/366,455, filed on Jun. 15, 1989, now abandoned.
US Referenced Citations (18)
Continuations (1)
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Number |
Date |
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Parent |
366455 |
Jun 1989 |
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