Patent Application
20100294462
1. Field of the Invention
The present invention relates to a heat sink, and in particular to a heat sink having folds and heat-dissipating fins of the same.
2. Description of Prior Art
Electronic elements generate heat when they are in operation. With the advancement of technology, the heat generated by the electronic products is increased greatly because their functions and performance are improved. Therefore, most of the electronic elements are provided with a heat-dissipating device so as to control the working temperature and maintain the normal operation of the electronic elements.
In order to dissipate the heat, various kinds of heat sinks are proposed in the market, such as a heat-dissipating fin assembly constituted of a plurality of heat-dissipating fins. When the heat-dissipating fin assembly is used in a light-emitting diode lamp, it is adhered to the light-emitting diodes that are generating heat, thereby providing a large area for heat dissipation. In use, a plurality of heat-dissipating fins is connected and radially arranged in the outer periphery of the light-emitting diodes. Since the heat-dissipating fin is a thin metallic piece with sharp edges, when a user or operator intends to replace or repair the lamp, he/she may be hurt by the sharp edges. Thus, the outer edge of the heat-dissipating fin is bent inwards to form a fold. However, such an edge with an inward fold may obstruct the dissipation of heat and make the heat to be accumulated therein. As a result, the temperature of the heat-dissipating fin becomes so high that the user or operator cannot grip the heat-dissipating fin easily.
Another kind of heat sink is made by stacking up a plurality of heat-dissipating fins. Such a heat sink is widely used in the heat dissipation of an electronic element such as a computer CPU. Two opposite sides of each heat-dissipating fin are upright and bent inwards to form a fold. After being stacked up, the fold becomes a gap between neighboring two heat-dissipating fins. If the user touches the fold, the user may be hurt by the high heat. Since the rigidness of the fold is poor, the fold may suffer damage or deformation so as to deteriorate its performance and external appearance.
Therefore, in order to overcome the above problems, the present Inventor proposes a reasonable and novel structure based on his delicate researches and expert experiments.
The present invention is to provide a heat sink, which can be gripped by a user easily.
The present invention is to provide a heat sink. The rigidness and strength of the folds of the heat sink are enhanced, so that the folds can be prevented from suffering damage or deformation when being touched by the user, thereby maintaining its external appearance.
The present invention is to provide a heat sink adhered to the outside of a heat-generating element. The heat sink comprises a plurality of heat-dissipating fins that are arranged radially and connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing the heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape
The present invention is to provide a heat sink adhered to a heat-generating element. The heat sink comprises a plurality of heat-dissipating fins. The plurality of heat-dissipating fins is stacked up in parallel to one another. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape.
The present invention is to provide a heat-dissipating fin. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape
In comparison with prior art, according to the present invention, the side of each heat-dissipating fin is bent vertically to form a fold. The fold is bent continuously to form a wave shape and the smooth folds are arranged in the periphery of the heat sink. When the user touches the peaks of the wave-shaped folds, the user may not feel so hot because the contact area is small. Furthermore, the smooth surface of the fold may not hurt the user. Further, the rigidness and strength of the wave-shaped fold is enhanced, so that the fold can be prevented from suffering damage or deformation. Thus, the external appearance of the heat-dissipating fins can be maintained.
The characteristics and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
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The wave-shaped folds 12 are arranged in the outer periphery of the heat sink 20, thereby increasing the heat-dissipating area of each heat-dissipating fin 10. When the user grips the heat-dissipating fin 10, the user only touches the peak of the wave-shaped fold 12, so that the user may not feel too hot because of the small contact area. Further, the smooth surface of the heat-dissipating fin may not hurt the user.
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The rigidness and strength of the wave-shaped fold 22 is enhanced. Thus, the heat-dissipating fin can be prevented from suffering damage or deformation when being touched by the user. Thus, the external appearance of the heat-dissipating fin can be maintained.
Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
