Claims
- 1. A heat sink comprising:
a first planar member having an upper face formed with a first groove portion; a second planar member having a lower face formed with a second groove portion; and a partition disposed between said upper face of said first planar member and said lower face of said second planar member; said partition being formed with a hole for communicating a first space and a second space to each other, said first space being formed by said first groove portion and a lower face of said partition, said second space being formed by said second groove portion and an upper face of said partition; said heat sink further comprising a supply port for supplying a fluid into said first space and a discharge port for discharging said fluid from said second space.
- 2. A heat sink according to claim 1, wherein an upper face of said second planar member has a heating element mounting area for mounting a heating element to be cooled,
said hole being disposed at a position opposing said heating element mounting area.
- 3. A heat sink according to claim 1, wherein a plurality of said holes are provided.
- 4. A heat sink according to claim 1, wherein said hole has a sufficiently small cross section for injecting said fluid into said second space.
- 5. A heat sink according to claim 1, wherein a guide piece for restricting a direction in which said fluid is outputted from said hole to said second space is provided at an edge portion of said hole on said second space side.
- 6. A semiconductor laser apparatus comprising:
the heat sink according to claim 1; and a semiconductor laser mounted on an upper face of said second planar member of said heat sink.
- 7. A semiconductor laser apparatus according to claim 6, wherein said semiconductor laser has a plurality of laser emission points arranged in a predetermined direction,
said predetermined direction being oriented so as to become substantially parallel to said upper face of second planar member.
- 8. A semiconductor laser stack apparatus comprising first and second heat sinks and first and second semiconductor lasers;
said first and second heat sinks being the heat sink according to claim 1; said first semiconductor laser being held between an upper face of said second planar member of said first heat sink and a lower face of said first planar member of said second heat sink; said second semiconductor laser being mounted on said upper face of second planar member of said second heat sink.
- 9. A semiconductor laser stack apparatus according to claim 8, wherein said first and second semiconductor lasers have a plurality of laser emission points arranged in a predetermined direction, said predetermined direction being oriented so as to become substantially parallel to said upper faces of first and second planar members.
- 10. A semiconductor laser stack apparatus according to claim 8, further comprising:
a supply tube connected to both of said supply port of said first heat sink and said supply port of said second heat sink; and a discharge tube connected to both of said discharge port of said first heat sink and said discharge port of said second heat sink.
Priority Claims (1)
Number |
Date |
Country |
Kind |
P1998-231576 |
Aug 1998 |
JP |
|
RELATED APPLICATION
[0001] The present application is a continuation-in-part application of PCT application No. PCT/JP99/01603 filed on Mar. 29, 1999, designating U.S.A. and now pending.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
PCT/JP99/01603 |
Mar 1999 |
US |
Child |
09773510 |
Feb 2001 |
US |