1. Field of the Invention
The invention relates generally to thermal transmitting structures, and more particularly to a heat sink apparatus utilizing operating fluid and thereby having enhanced heat dissipating efficiency.
2. Related Art
Electronic components, such as semiconductor chips, are becoming progressively smaller with each new product release, while at the same time the heat dissipation requirements of these kinds of components are increasing due to their improved ability to provide more functionality. In many contemporary applications, a heat sink apparatus is one of the most efficient systems in use for transmitting heat away from such components.
Generally, a typical heat sink apparatus includes a base portion, and a predetermined number of parallel fins projecting from an upper section of the base portion. The fins project a predetermined distance or height, and at a predetermined angle, from the upper section. The heat sink apparatus is usually constructed of metals such as aluminum, aluminum alloy, copper, and copper alloy. The base portion includes a base surface. In typical use, the base surface is positioned against a heat transfer surface of an electronic device package, and is firmly held in contact with the heat transfer surface in order to ensure good thermal transfer between the two surfaces.
The metals including aluminum, aluminum alloy, copper, and copper alloy all have relatively high coefficients of thermal conduction. Thus the heat sink apparatus can readily absorb heat produced by electronic devices contained in the electronic device package, and dissipate such heat to the ambient environment. However, many modern electronic device packages are very compact and generate much heat, and in some cases the above-described heat sink apparatus may not be able to transfer the heat from the electronic device package to the ambient environment quickly enough. This is apt to produce hotspots in the heat sink apparatus, and usually results in nonuniform dissipation of heat from the heat sink apparatus. That is, the thermal operating efficiency of the heat sink apparatus may be unsatisfactory.
What is needed, therefore, is a heat sink apparatus having enhanced heat dissipating efficiency.
In one embodiment, a heat sink apparatus includes a base and a plurality of fins extending from one surface of the base. The base defines a hermetically sealed cavity defined therein. Operating fluid is filled in the cavity. The operating fluid is liquid form. In use, heat produced by a heat source is transferred to the base. Then, the liquid operating fluid in the base absorbs the heat and is vaporized. The vaporized operating fluid is diffused to an upper inner wall of the base and releases the heat, thereby being transformed back into liquid form. The fins transfer the heat to the ambient environment.
Other advantages and novel features of the present heat sink apparatus will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings.
The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat sink apparatus. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The exemplifications set out herein illustrate at least one preferred embodiment of the present heat sink apparatus, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.
Reference will now be made to the drawings to describe embodiments of the present heat sink apparatus in detail.
Referring to
The base 12 is preferably made of material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof. The base 12 can be formed by welding a pair of metal plates together. Each metal plate has a peripheral flange. The metal plates are welded together at the flanges, thereby forming the base 12 having the cavity 122 therein. Then the cavity 122 is vacuumized, and the operating fluid 18 filled in the cavity 122. Finally, the cavity 122 is sealed. A volume of the operating fluid 18 is in the range of approximately ten percent to approximately ninety percent of a volume of the cavity 122. The operating fluid 18 is preferably selected from the group consisting of water, ammonia, methanol, ethanol, hexanol, acetone, and heptane. Furthermore, the operating fluid 18 preferably has heat conduction materials (not shown) added therein. The heat conduction materials are preferably selected from the group consisting of copper powder, carbon nanotubes, carbon nanospheres, and carbon nanofibers.
The fins 14 are preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof. The fins 14 can be integrally molded with the base 12. Alternatively, the fins 14 can be attached on the first surface 124 of the base 12 by means of welding.
The protection layer 126 has stable chemical and physical properties that are compatible with the operating fluid 18. That is, no reaction occurs between the protection layer 16 and the operating fluid 18. In particular, the protection layer 16 is made of material with a high coefficient of thermal conduction, such as graphite, diamond-like carbon material, or nano-scaled carbon material. Preferably, the protection layer 16 is made of nano-scaled carbon material selected from the group consisting of carbon nanotubes, carbon nanospheres, and carbon nanofibers.
In typical use, the second surface 128 of the base 12 engages with an electronic device (not shown). Heat produced by the electronic device is transferred to the operating fluid 18 by conduction through the base 12, and the temperature of the operating fluid 18 rises. When the temperature of the operating fluid 18 reaches and passes a vaporization/boiling temperature of the operating fluid 18, the operating fluid 18 becomes vaporized. Vapor pressure drives the vaporized operating fluid 18 to the upper inner wall 126 of the base 12. At the upper inner wall 126, the vaporized operating fluid 18 transmits the heat to the fins 14 by conduction through the base 12, and the vaporized operating fluid 18 is thereby transformed back into liquid form. The fins 14 dissipate the heat to the external environment. Gravity drives the operating fluid 18 back to the lower inner wall 126. The heat sink apparatus 10 continues this cyclical process of transmitting heat as long as there is a temperature differential between the heat sink apparatus 10 and the electronic device, and as long as the heat is sufficient to vaporize the operating fluid 18.
Compared with a conventional heat sink apparatus, the present heat sink apparatus 10 with the operating fluid 18 can quickly dissipate the heat produced by the electronic device to the ambient environment. Thus, development of hotspots in the heat sink apparatus 10 can be avoided. This helps ensure that the heat sink apparatus 10 dissipates heat uniformly. Therefore, the thermal operating efficiency of the heat sink apparatus 10 is most apt to be satisfactory.
Referring to
As seen, the heat sink apparatus 20 is similar to the above-described heat sink apparatus 10, except that the heat sink apparatus 20 further includes the fan 26 located on the free ends of the fins 24. In use, the fan 26 can accelerate convection of ambient air near the fins 24. This can further accelerate dissipation of heat from the fins 24. Thus, the thermal operating efficiency of the heat sink apparatus 20 is further enhanced.
Referring to
As seen, the heat sink apparatus 30 is similar to the above-described heat sink apparatus 20, except that the heat sink apparatus 30 further includes the second fan 364 located in the cavity 322. In use, the second fan 364 can accelerate diffusion of vaporized operating fluid 38 and flowing of liquid operating fluid 38. This can further accelerate eventual dissipation of heat from the fins 34. Thus, the thermal operating efficiency of the heat sink apparatus 30 is further enhanced.
Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments without departing from the spirit of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.
Number | Date | Country | Kind |
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200510035288.7 | Jun 2005 | CN | national |