Some embodiments relate to a heat sink structure. More in particular, some embodiments relate to a heat sink structure including heat sink parts, such as fins or ribs.
Heat sinks are known, in particular in the field of electronics. Electronic components, such as processors and power switches, produce heat when in use. Such components may not radiate enough heat to keep their temperature within a normal working range. For this reason, a heat sink may be mounted on the component. A heat sink may be a metal structure having elements which serve to lead the heat away from the component.
U.S. Pat. No. 4.884,331, for example, discloses a unitary heat sink apparatus for removal of heat from a heat generating component, such as a semiconductor device. The heat sink apparatus has a heat sink body or base portion from which parallel fins extend outwardly, the fins being separated by grooves produced by sawing.
U.S. Pat. No. 6,807,059 discloses a pin fin heat sink manufactured by fusion or stud welding of fins to a base. The base is shown to be constituted by a single large plate supporting a large number of pin fins, in one embodiment 256 pin fins.
Such related art arrangements are useful when the electronic component on which they are to be mounted have a sufficiently flat top surface which allows a good thermal contact with the heat sink. However, in practice the top surfaces of electronic components are often not perfectly flat, which results in a less than perfect heat transfer. In addition, the top surface of the electronic component may become distorted as the component heats up, thus reducing the heat transfer even when the initial heat transfer was good.
It is an aspect of the presently disclosed subject matter to solve this problem by providing a heat sink structure including a plurality of heat sink parts, each heat sink part having a contact area for contacting a surface of an electronic device, the heat sink parts being spaced apart so as to allow them to adjust and keep the contact areas contacting the surface of the electronic device when the surface is distorted.
By providing a plurality of heat sink parts which are spaced apart, the heat sink structure is better suited to adjust to the surface of the electronic device. In particular, as the heat sink parts are spaced apart, they are capable of altering their mutual positions so as to adjust the heat sink structure to the electronic component. When the surface of the electronic component is distorted due to heat generation and/or other causes, this adjustment of the heat sink structure allows the contact areas of the heat sink parts to remain in contact with the surface of the electronic component.
The heat sink structure of the presently disclosed subject matter therefore includes multiple spaced apart contact areas. Being spaced apart, for example being separated by gaps, allows those contact areas to absorb changes in the surface of the electronic component. In the related art, however, a heat sink structure has a single, relatively large contact area, typically the bottom surface of a base plate, which is not capable of absorbing changes in the surface of the electronic component. By providing spaced apart heat sink parts, and hence spaced apart contact areas, a more flexible heat sink structure is obtained.
The contact area of a heat sink element of the presently disclosed subject matter may be located at an side or end of the heat sink part, and may be equal to a side surface or end surface of the heat sink part.
A heat sink part may be constituted by a single component, such as a heat sink rib. In some embodiments, however, a heat sink part may be constituted by multiple components which may or may not be connected. In an embodiment, therefore, a heat sink part may include at least two heat sink elements, which may be connected by a connecting member.
In an embodiment, the heat sink elements are not connected. That is, there may be no direct connection between the heat sink elements of the heat sink structure, the heat sink elements only being mechanically connected through the electronic component on which they are mounted. However, in other embodiments at least two heat sink elements are connected by a connecting member. Such a connecting member may connect two or more heat sink elements and may thus form a heat sink part. A linear connecting member may, for example, connect a row of heat sink elements. A connecting member may be integral with the two or more heat sink elements it connects, thus forming a single component, but a connecting member may also be constituted by a separate element which is attached to the heat sink elements.
A heat sink part may therefore be constituted by a single rib-like component, or by a number of heat sink elements which may or may not be connected, or by a combination of one or more rib-like elements and heat sink elements which may or may not be connected.
In an embodiment, the connecting member constitutes the contact area for the heat sink part. That is, the connecting member (or connecting members) may be located at the ends of the heat sink elements and may have a surface which serves as contact area for the heat sink elements it connects. In such an embodiment, the connecting member may be integral with the heat sink elements it connects, and may thus form a combe-shaped structure, for example. Two connecting members may be spaced apart by gaps which constitute through grooves in the heat sink structure, thus spacing the heat sink parts apart.
The contact areas of the heat sink parts may define a common plane, that is, a plane which is common to those contact areas, the contact areas substantially lying in the common plane. When at least one connecting member constitutes the contact areas for at least two heat sink elements, then the connecting member may include a surface in the common plane. In other embodiments, however, the at least one connecting member may be spaced apart from the common plane. That is, the connecting member may not be located at the end of the heat sink elements where the contact areas are located, but for example at the opposite end of the heat sink element, or near their middle section.
In embodiments in which the at least one connecting member is not located at the end of the heat sink elements where the contact areas are located, but for example at the opposite end of the heat sink elements, the heat sink elements effectively extend from the contact areas to the at least one connecting member but may not extend beyond the at least one connecting member. Thus, the at least one connecting member may be located at the end of the heat sink elements which is the furthest away from the contact areas.
A connecting member may be coupled with two or more heat sink elements without being coupled to other parts of the heat sink structure. In some embodiments, however, at least two connecting members may be coupled, and may constitute an integral structure. In such embodiments, the connecting members may be coupled to form a base of the heat sink structure.
In accordance with the presently disclosed subject matter, the heat sink parts are spaced apart. To this end, two adjacent connecting members may be spaced apart, at least over part of their lengths, to provide the flexibility that may be required for adjusting to distorted or irregular surfaces. In some embodiments, connecting members may be joined at their ends, leaving a gap over the remainder of their length.
Although the heat sink elements may be solid, in some embodiments at least one heat sink element is hollow. A hollow heat sink element has a reduced weight and an increased surface area, and may therefore be advantageous.
At least one heat sink elements may be a pin heat sink element, that is, a heat sink element shaped like a pin. At least one heat sink part may be rib-shaped. A heat sink part may be hollow, solid or partially hollow.
At least one heat sink part may have an undulating shape. Such a shape increases the surface area of the heat sink part, thus improving the heat sinking capabilities of the structure.
In embodiments of the presently disclosed subject matter, the heat sink parts may extend substantially in parallel, and possibly substantially perpendicular to a common plane. In some embodiments, however, the heat sink parts may not be parallel and may, for example, each have a different angle with respect to a common plane. In such embodiments, the heat sink parts and/or heat sink elements may diverge in the direction from the contact areas.
The heat sink structure of the presently disclosed subject matter may further include a base or base plate arranged at the ends of the heat sink elements opposite to the ends including the contact areas. That is, the base may be arranged on the end of the heat sink elements which are furthest away from the contact areas and therefore from the surface of the electronic device. This base plate can therefore be said to be placed on top of the heat sink structure.
The base plate may be arranged to serve as a reservoir for receiving a solid-liquid or solid-solid PCM (Phase Change Material). PCMs are typically diphasic materials. Suitable PCMs are, for example, paraffin, salt hydrates, or other materials which will be chosen according to the value of the corresponding phase change temperature. The purpose of the reservoir is to use latent energy storage to decrease the maximum temperature value during a transient mission profile.
The presently disclosed subject matter further provides an electronic device, provided with a heat sink structure as described above. The electronic device, which may include a power switch, may be provided with a surface, such as a top surface, for mounting a heat sink structure. The electronic device may further include a housing and electrical contacts extending from the housing.
In the above, the heat sink structure was referred to as being mounted, or capable of being mounted, on an electronic component, such as a power switch. In some embodiments, the electronic component may be mounted on the heat sink structure, or the heat sink structure may be arranged for mounting an electronic component. In some embodiments, the component may not be an electronic component but an optical component, for example, or an electro-optical component.
The presently disclosed subject matter will further be explained with reference to exemplary embodiments illustrated in the drawings, in which:
The presently disclosed subject matter provides a heat sink structure which includes a number of heat sink parts. Each heat sink part may have a contact area for contacting a surface of an electronic device, such as an electronic switch or amplifier. The heat sink parts may be spaced apart. This may allow the heat sink parts to adjust their mutual positions so as to keep their contact areas contacting the surface of the electronic device when this surface is distorted, for example due to heat development.
The heat sink parts of the presently disclosed subject matter may have various shapes and sizes. In some embodiments, a heat sink part may include a number of heat sink elements, such as pins. A row of pins may be connected by a connecting member, thus forming a longitudinal heat sink part. In some embodiments, such a longitudinal heat sink part may be constituted by a plate or rib instead of a connected row of pins. In some embodiments, the plate may be undulating. Longitudinal heat sink parts may be connected to each other, for example at their ends. However, the heat sink parts may still be separated by gaps, which allows the heat sink parts a degree of relative movement to adjust to distortions of a surface on which the heat sink structure may be mounted.
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The contact surfaces 12 may lie approximately in a common plane, at least initially. It will be understood that the surface on which the heat sink structure 10 is mounted, or at least the surface which the heat sink structure 10 abuts, may or may not initially be flat, and may distort as the surface heats up. That is, an initially flat surface may become curved or may deviate from a flat surface in another manner, for example by showing undulations, local depressions or local protrusions. Embodiments can be envisaged in which the surface of the electronic device is initially not flat but curved, for example.
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In some embodiments, at least some heat sink elements and/or heat sink parts may be hollow. Thus, hollow pins and/or hollow plates may be used. In some embodiments, at least some heat sink elements may be solid. That is, solid pins and/or solid plates may be used.
Accordingly, an electronic device may be provided with a heat sink structure according to the presently disclosed subject matter. The electronic device may, for example, be a power switch, but may also be an amplifier, rectifier or other electronic device.
It will be understood that the description of the presently disclosed subject matter given above is not intended to limit the presently disclosed subject matter in any way. Singular nouns and the articles βaβ and βanβ are of course not meant to exclude the possibility of plurals. Devices mentioned in this document may be replaced with their successors, even if these successors are not yet known at the time of writing. The abstract should never be used to limit the scope of the claims, and neither should reference numbers in the claims.
It will further be understood by those skilled in the art that the presently disclosed subject matter is not limited to the embodiments mentioned above and that many additions and modifications are possible without departing from the scope of the presently disclosed subject matter as defined in the appending claims.
This application is a national phase filing under 35 C.F.R. § 371 of and claims priority to PCT Patent Application No. PCT/IB2017/000837, filed on May 31, 2017, the contents of which are hereby incorporated in its entirety by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/IB2017/000837 | 5/31/2017 | WO | 00 |