Claims
- 1. A heat transfer device for conducting heat from an element having a first temperature to a copper member having a tapered slot therein and a second temperature lower than said first temperature resulting in a temperature differential comprising
- an intercalated graphite fiber composite having a hot end and a tapered cool end,
- means for mounting said hot end in thermal contact with said element,
- an electrical isolator interposed between said element and said composite, and
- means for potting said tapered cool end in said tapered slot in said member whereby said composite is in thermal contact with said member for optimum heat transfer.
- 2. A heat transfer device for conducting heat from an element having a first temperature to a member having a second temperature lower than said first temperature resulting in a temperature differential comprising
- an intercalated graphite fiber composite having a hot end and a cool end,
- means for mounting said hot end in thermal contact with said element with the fibers in said composite extending therefrom in a radial array,
- means for mounting an electrical isolator between said element and said composite, and
- means for solder bonding the radially extending fibers in the cool end of said composite to a surface of said member.
STATEMENT OF COPENDENCY
This application is a division of application Ser. No. 880,951 which was filed May 11, 1992, and issued as U.S. Pat. No. 5,224,030 which is a division of application Ser. No. 657,238 which was filed Feb. 19, 1991, and now abandoned, which is a continuation-in-part of application Ser. No. 501,893 which was filed Mar. 30, 1990, and now abandoned.
ORIGIN OF THE INVENTION
The invention described herein was made by employees of the United States Government and may be manufactured and used by or for the Government for governmental purposes without the payment of any royalties thereon or therefor.
US Referenced Citations (20)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0296613 |
Dec 1988 |
EPX |
98756 |
May 1987 |
JPX |
308559 |
Dec 1990 |
JPX |
Non-Patent Literature Citations (2)
Entry |
Ciancanelli, J. M. "Circuit Module with Heat Transfer", IBM Tech. Discl. Bull., vol. 19, No. 7, p. 2652, Dec. 1976. |
"Thermal Conductivity"--Carbon Fibers; Ching-Cheh Hung, Carbon vol. 25, No. 5, pp. 679-684, Feb. 1987. |
Divisions (2)
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Number |
Date |
Country |
Parent |
880951 |
May 1992 |
|
Parent |
657238 |
Feb 1991 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
501893 |
Mar 1990 |
|