Patent Application
20060196639
1. Field of the Invention
The present invention relates to a heatsink assembly of electronic devices, applied to heat-dissipating which heat generated by chipset, particularly used in a computer.
2. Description of the Related Art
Accompany with the continuous upgrade in operation ability and speed of the Central Processing Unit (CPU) or video chipset of computer, the large quantity of those electronic component's operation results in a high temperature occurred. However, there is a temperature limit for each electronic component; the high temperature not only will reduce the working efficiency of the electronic component, but also may damage or even burnout the electronic component. Therefore, the heat-dissipating issue becomes one of important step in the product design of a computer. In order that the computer may work at a normal temperature, a heatsink assembly has been a necessary component in a notebook computer.
Referring to
The heat conduction module thermally conducts heat from a heat-generating component such as CPU or video chipset, etc., via the thermal plate.
The heat generated from the heat conduction module thermally conducts the heat through the heat transfer member (heat pip), to the heatsink fins; wherein the heatsink fins are constructed with a plurality of parallel fins, and the radiate area can be increased. The exchange of heat occurs between the heatsink fins and cooling wind generated by means of the fan module. The heat is expelled from the computer in order to achieve cooling objectives.
Usually, the heatsink device is positioned on CPU or on video chipset of mother board, via thermal pad of heatsink device closely attached to the surface of the CPU or video chipset in order to perform the thermally-conducting and heat-dissipating function; however, due to high request to the display function of interface card in portable notebook computer, interface cards is tending to upgrade to insert card as desk computer, resulted the conventional heatsink device is not suitable anymore.
It is an object to provide a heatsink assembly, used in a thermal module for an interface card. By this invention practices, the heatsink assembly not only can fix the interface card to avoid damage occurred during carry or movement the portable notebook computer, but also can dissipate the heat generated by a video chip or a graphic chip in a interface card when it is operating.
To reach above, the present invention provides a heatsink assembly comprising a heat conduction member, a heat transfer member and heatsink fins, the heat conduction member comprising a thermal pad and a clip. The thermal pad is a well thermal conductive metal plate, connected with heat source component of electric device. The side engaged with heat source component having at least one buckle pillar and a screw pillar. The clip of heat conduction member is constructed of a pair of spring plate and a pair of beam. The spring plate corresponds to each of buckle pillar having a buckle and corresponds to each of screw pillar having a screwed hole. The heat transfer member, one side engaged with thermal pad, the other side engaged with heatsink fins, is used to transfer the heat generated from thermal pad to the heatsink fins. The heatsink fins expel the heat from heat transfer member by the cooling wind from fan module. The thermal pad supports clip by at least one of the buckle pillar and one of the screw pillar; the clip connected with the buckle pillar and the screw pillar, fixed the heat source component, to let the heat generated surface of the heat source component, connect with the thermal pad in heat conductive manner.
Thus, the implementation of the present invention brings forth at least the following desirable results:
The invention will become more fully understood from the detailed description given below for illustration only, and thus are not limitative of the present invention, and wherein:
Referring to
A thermal pad 211 of heat conduction member 21 is a well thermally conductive plate, utilized to thermal conductive connection with a surface generated heat from heat source component 51 of electronic device, to dissipate heat during operation from heat source component 51 wherein has a video chipset or graphic chipset. Enable to achieve the heat conductive well, the thermal pad 211, is usually made of a copper or an aluminum, to have better thermal conductive effect.
Enable to close connected with heat source component 51, one side of the thermal pad 211 connected with heat source component 51, has at least one buckle pillar 212 and one crew pillar 214. To stable connect with thermal pad 211, those pillars are pressed on the thermal pad 211. Near the top of a buckle pillar 212 has a horizontal ring curve 213And on the top of a screw pillar 214 will has a screw hole 215.
The clip 216, is constructed of a pair of spring plate 217 and a pair of beam 222; the beam 222 is applied to hold still the spring plate 217; the spring plate 217, a cure plate, having a buckle 219 to connect with each buckle pillar 212. For each screw pillar 214, having a screwed hole 218 therein; Enable to simple connect with clip 216 and buckle pillar 212, the buckle 219 is designed to have a buckle portion 220 and a extend portion 221.
The heat transfer member 23, one side connected with thermal pad 211, is to transfer the heat generated heat from thermal pad 211 to heatsink fins 24; one of the heat transfer member 23 is preferred to be a heat pipe.
The heatsink fins 24, connected with the other side of heat transfer member 23, is composed of a plurality of parallel fins where are vertical connected with heat transfer member 23. Each fin is a thin slice shape.
Referring to
Referring to
As the clip 216 is connected with ring curve 213 of buckle pillar 212. The buckle 219 having a buckle potion 220 and a extend potion 221, via extend potion 221 space, the buckle 219 can be more easy to aim at buckle pillar 212. Plus spring plate 217 of clip 216 is a curve plate; when clip 216 one side is connected with the buckle pillar 212, the other side is screwed into the screw pillar 214, the tension will be occurred when clip be pressured. Via wherein the tension, the interface card can be stably hold.
Referring to
Those described above are only the preferred embodiments of the present invention, and it is no intended to limit the scope of the present invention. And equivalent variation and modification according to the appended claims of the present invention would not depart from the spirit of the present invention and is to be included within the scope of the present invention.
