BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will become more fully understood from the detailed description given herein below for illustration only, and which thus is not limitative of the present invention, and wherein:
FIG. 1 is a schematic structural view of the conventional art;
FIG. 2A is a schematic structural view of the heatsink device according to a first embodiment of the present invention;
FIG. 2B is a detailed view of a portion of the elements according to the first embodiment of the present invention;
FIG. 3 is a schematic view of the heat conduction according to the present invention;
FIG. 4 is a schematic view of the heat conduction of the capillary spaces according to the present invention;
FIG. 5 is a schematic structural view of the heatsink device according to a second embodiment of the present invention;
FIG. 6 is a schematic structural view of the heatsink device according to a third embodiment of the present invention; and
FIG. 7 is a schematic structural view of the heatsink device according to a fourth embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Please refer to FIGS. 2A and 2B of a schematic structural view and a detailed view of a portion of the elements in the heatsink device according to the first embodiment of the present invention. As shown in FIGS. 2A and 2B, the heatsink device includes a heat dissipation base 211, a lid 212, a bump 213, a heat conductive powder 214, a heat dissipation liquid 215 and a plurality of fins 216. A heat generating component 220 with a heat generating portion 221 that can generate heat is disposed externally.
The heat dissipation base 211 has a base attachment surface 218 for being attached to the heat generating component 220 and an inner surface 217 facing the accommodation space. The bump 213 is disposed on the inner surface 217 opposite to the base attachment surface 218. In addition, when the heat dissipation base 211 is bonded to the lid 212, an inclosed accommodation space is formed therebetween for accommodating the heat dissipation liquid 215. The heat conductive powder 214 is distributed on the inner surface 217, so as to form a plurality of capillary spaces to accommodating the heat dissipation liquid 215. A larger amount of heat conductive powder 214 is deposited on the rim of the bump 213 to form more capillary spaces to enhance the heat dissipation effect.
The bump 213 is mainly disposed opposite to the heat generating portion 221 of the heat generating component 220 when the heat dissipation base is attached to the heat generating component 220, so as to increase the heat conductive path to dissipate the heat uniformly when the base attachment surface 218 absorbs the heat generated by the heat generating portion 221, and conduct the heat into the heat dissipation liquid 215 via the inner surface 217 together with the heat conductive powder 214. The fins 216 are disposed on the external surface of the lid 212, so as to enlarge the heat distribution area to enhance the heat dissipation effect.
Please refer to FIG. 3 of a schematic view of the heat conduction according to the present invention. As shown in FIG. 3, when the heat dissipation base 211 is attached to the heat generating component 220, the heat can be conducted into the heat dissipation liquid 215. The heat conductive powder 214 can assist the heat dissipation base 211 to dissipate the heat uniformly, so as to facilitate dissipating heat into the heat dissipation liquid 215. The bump 213 is opposite to the heat generating portion 221 of the heat generating component 220, so as to extend the heat conductive path to dissipate the heat uniformly. In addition, as the heat conductive powder 214 on the rim of the bump 213 is thicker and has more capillary spaces, a larger amount of heat dissipation liquid 215 is accommodated therein to enhance the heat dissipation effect.
Please refer to FIG. 4 of a schematic view of the heat conduction of the capillary spaces according to the present invention. As shown in FIG. 4, when the heat dissipation liquid 215 accommodated in the capillary spaces of the heat conductive powder (214a or 214c) on the surface of the bump 213 or heat dissipation base 211 changes into gas by absorbing heat to reach the boiling point, and the heat dissipation liquid 215 from other areas cannot complement the vacancies in time, the heat dissipation liquid 215 contained in the thicker heat conductive powder 214b between the bump 213 and the heat dissipation base 211 can be quickly adopted to complement the capillary spaces of the heat conductive powder 214a or heat conductive powder 214c via the capillary phenomenon.
Please refer to FIG. 5 of a schematic structural view of the heatsink device according to the second embodiment of the present invention. As shown in FIG. 5, the bump 213 can be integrally formed with the heat dissipation base 511. The heat dissipation base 511 is directly extended toward the accommodation space from the inner surface 516 to form the bump 213.
Please refer to FIG. 6 of a schematic structural view of the heatsink device according to the third embodiment of the present invention. As shown in FIG. 6, the base attachment surface 618 of a heat dissipation base 611 is recessed into a heat dissipation base 611 toward the accommodation space. Such design is meant to make the heat dissipation base 611 be completely attached to a heat generating component 620, so as to achieve the optimal heat dissipation effect. Moreover, a bump 613 can be designed into a raised shape opposite to the recessed position of the base attachment surface 618, so as to enhance the heat dissipation effect.
Please refer to FIG. 7 of a schematic structural view of the heatsink device according to the fourth embodiment of the present invention. As shown in FIG. 7, the heat generating component 720 does not necessarily have only one heat generating portion 721, and to effectively dissipate the heat generated by the heat generating component 720, a bump 713 disposed on a heat dissipation base 711 can have an area larger than that of the base attachment surface 718, so as to correspondingly cover all of the heat generating portions 721, thus achieving a preferable heat dissipation effect.
The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Patent Application
20080068802
