Number | Name | Date | Kind |
---|---|---|---|
4303934 | Stitt | Dec 1981 | |
4435611 | Ohsawa et al. | Mar 1984 | |
4451540 | Baird et al. | May 1984 | |
4626960 | Hamano et al. | Dec 1986 | |
4659384 | Daigo et al. | Apr 1987 | |
4664629 | Chodkowski | May 1987 | |
4694185 | Weiss | Sep 1987 | |
4727221 | Saitou et al. | Feb 1988 | |
4754900 | MacKay | Jul 1988 | |
4859806 | Smith | Aug 1989 | |
4895291 | Ozimek et al. | Jan 1990 | |
4931854 | Yonemasu et al. | Jun 1990 | |
5043139 | Carnall, Jr. et al. | Aug 1991 | |
5053195 | MacKay | Oct 1991 | |
5061442 | Ozimek | Oct 1991 |
Entry |
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Abstract-C. A. MacKay, International Electronic Packaging Conf., San Diego, Calif., Sep. 11-13, 1989, published in the Conference Proceedings, pp. 1244-1259, Int. Electronic Packaging Society, 1989. |