Claims
- 1. In a semiconductor device wherein a semiconductor body has at least one clean, well-defined bore extending partially therethrough, said bore being defined by a first semiconducting region having a conductivity type opposite to, and resistivity lower than, the material of said body located contiguous with said first semiconducting region along an interface, the improvement wherein each said bore has a diameter of less than about 1.5 mils and an average length-to-diameter ratio of at least about 6:1, said first region defining said bore is free of dislocations and said bore extends to a predetermined depth such that the bottom of said bore is adjacent a major surface of said semiconductor body and is spaced therefrom a distance in the range of from a maximum distance of about one-fifth the hole diameter to a minimum distance of 6 microns.
- 2. The improved device of claim 1 wherein the first semiconducting region penetrates to the major surface and is present at said surface as a circularly shaped area having a diameter of at least one micron.
- 3. The improved device of claim 6 wherein the diameter is about 1 mil and the average length-to-diameter ratio is at least about 12:1.
- 4. The improved device of claim 6 wherein a plurality of bores are arranged in an array with the bores substantially parallel to each other and spaced about 5 mils apart center-to-center.
- 5. The improved device of claim 6 wherein a plurality of bores are arranged in an array with the bores substantially parallel to each other and spaced about 1.5 mils apart center-to-center.
- 6. The improved device of claim 1 wherein the average length-to-diameter ratio is in the range of from about 6:1 to about 50:1.
Parent Case Info
This application is a continuation-in-part of U.S. patent application Ser. No. 267,235--Anthony et al., filed May 26, 1981 and now abandoned. The invention herein is related to the invention disclosed and claimed in U.S. patent application Ser. No. 282,218, now U.S. Pat. No. 4,527,183. This invention is also related to the invention disclosed and claimed in U.S. patent application Ser. No. 293,760, now U.S. Pat. No. 4,471,369. U.S. Pat. No. 4,471,369 and U.S. Pat. No. 4,527,183 are assigned to the assignee of the instant application, U.S. Pat. No. 4,527,183 being incorporated by reference.
US Referenced Citations (15)
Non-Patent Literature Citations (1)
Entry |
Joy et al., "Isolated Power Feed-Through Holes", IBM Technical Disclosure Bulletin, vol. 16, No. 11, pp. 3592-3593 (1974). |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
267235 |
May 1981 |
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