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H01L29/0657

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/0657characterised by the shape of the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional vertically structured electronic devices
- Patent number 12,170,330
- Issue date Dec 17, 2024
- Lawrence Livermore National Security, LLC
- Adam Conway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor diode or transistor device having at least o...
- Patent number 12,166,073
- Issue date Dec 10, 2024
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Peter Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a transistor and a shield electrode
- Patent number 12,166,090
- Issue date Dec 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Zia Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor film
- Patent number 12,159,907
- Issue date Dec 3, 2024
- NGK Insulators, Ltd.
- Hiroshi Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of obtaining a smooth surface with epitaxial lateral overgrowth
- Patent number 12,146,237
- Issue date Nov 19, 2024
- The Regents of the University of California
- Takeshi Kamikawa
- C30 - CRYSTAL GROWTH
Information Patent Grant
Double-channel HEMT device and manufacturing method thereof
- Patent number 12,148,823
- Issue date Nov 19, 2024
- STMicroelectronics S.r.l.
- Ferdinando Iucolano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistors having a fin
- Patent number 12,142,670
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Toru Tanzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High hole mobility transistor (HHMT) and method of manufacturing th...
- Patent number 12,136,669
- Issue date Nov 5, 2024
- GUANGDONG ZHINENG TECHNOLOGIES, CO. LTD.
- Zilan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact trenches extending from opposit...
- Patent number 12,136,670
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced etching technologies for straight, tall and uniform fins a...
- Patent number 12,131,912
- Issue date Oct 29, 2024
- Intel Corporation
- Muralidhar S. Ambati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducting materials with surrounding radial p-n diodes
- Patent number 12,113,136
- Issue date Oct 8, 2024
- University of Louisville Research Foundation, Inc.
- Cindy Harnett
- D03 - WEAVING
Information Patent Grant
Semiconductor device
- Patent number 12,107,159
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Yusuke Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a semiconductor surface and semiconductor bo...
- Patent number 12,094,928
- Issue date Sep 17, 2024
- Osram Opto Semiconductors GmbH
- Markus Tautz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stop ring trench to prevent epitaxy crack propagation
- Patent number 12,094,838
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method of manufacturing the same
- Patent number 12,068,369
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,068,412
- Issue date Aug 20, 2024
- Hyundai Mobis Co., Ltd.
- Sin A Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap structures in auto-doped region under one or more transistors
- Patent number 12,046,633
- Issue date Jul 23, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,040,392
- Issue date Jul 16, 2024
- United Microelectronics Corp.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for fabricating the same
- Patent number 12,040,393
- Issue date Jul 16, 2024
- United Microelectronics Corp.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier trapping region including cry...
- Patent number 12,027,579
- Issue date Jul 2, 2024
- Rohm Co., Ltd.
- Seigo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a necked semiconductor body and method...
- Patent number 12,015,087
- Issue date Jun 18, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical tunneling field-effect transistor cell
- Patent number 11,990,531
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hay-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,978,768
- Issue date May 7, 2024
- Winbond Electronics Corp.
- Tseng-Yao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral fin static induction transistor
- Patent number 11,978,789
- Issue date May 7, 2024
- HRL Laboratories, LLC
- Biqin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 11,973,146
- Issue date Apr 30, 2024
- Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Kengo Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide band gap semiconductor device with surface insulating film
- Patent number 11,967,627
- Issue date Apr 23, 2024
- ROHM Co, Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with voltage resistant structure
- Patent number 11,929,394
- Issue date Mar 12, 2024
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,923,354
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Dayeon Cho
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015171
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Masaki AONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY US...
- Publication number 20250006579
- Publication date Jan 2, 2025
- Intel Corporation
- Avijit Barik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379674
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK STOP RING TRENCH TO PREVENT EPITAXY CRACK PROPAGATION
- Publication number 20240355761
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES
- Publication number 20240339496
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240339532
- Publication date Oct 10, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRU...
- Publication number 20240332353
- Publication date Oct 3, 2024
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240322030
- Publication date Sep 26, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321955
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Tsutomu KIYOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240304599
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...
- Publication number 20240274660
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Edward Robert Van Brunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...
- Publication number 20240274661
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Sungyoung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION
- Publication number 20240274484
- Publication date Aug 15, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...
- Publication number 20240274655
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METASURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240266393
- Publication date Aug 8, 2024
- UNITED MICROELECTRONICS CORP.
- CHUNYUAN QI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL FIN STATIC INDUCTION TRANSISTOR
- Publication number 20240250160
- Publication date Jul 25, 2024
- HRL LABORATORIES, LLC
- Biqin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240243169
- Publication date Jul 18, 2024
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBRANE SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20240243170
- Publication date Jul 18, 2024
- ROBERT BOSCH GmbH
- Christian Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD AND MANUFACTURING...
- Publication number 20240234137
- Publication date Jul 11, 2024
- KYOCERA CORPORATION
- Takeshi KAMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BAND GAP SEMICONDUCTOR DEVICE WITH SURFACE INSULATING FILM
- Publication number 20240234529
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES
- Publication number 20240234346
- Publication date Jul 11, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...
- Publication number 20240222509
- Publication date Jul 4, 2024
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
- Publication number 20240203946
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER DENSITY RECTIFIER DEVICE
- Publication number 20240186423
- Publication date Jun 6, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Jifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS SUPERJUNCTION DEVICES
- Publication number 20240186370
- Publication date Jun 6, 2024
- Virginia Tech Intellectual Properties, Inc.
- Yuhao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178276
- Publication date May 30, 2024
- Rohm Co., Ltd.
- Satoshi IWAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH GATE ELECTRODE FULLY WITHIN V-SHAPED CAVITY
- Publication number 20240178290
- Publication date May 30, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Megan Lydon-Nuhfer
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three dimensional vertically structured electronic devices

Vertical semiconductor diode or transistor device having at least o...

Electronic device including a transistor and a shield electrode

Semiconductor film

Method of obtaining a smooth surface with epitaxial lateral overgrowth

Double-channel HEMT device and manufacturing method thereof

Field effect transistors having a fin

High hole mobility transistor (HHMT) and method of manufacturing th...

Semiconductor device having contact trenches extending from opposit...

Advanced etching technologies for straight, tall and uniform fins a...

Semiconducting materials with surrounding radial p-n diodes

Semiconductor device

Semiconductor device having an antenna arranged over an active main...

Method for structuring a semiconductor surface and semiconductor bo...

Crack stop ring trench to prevent epitaxy crack propagation

Semiconductor devices and method of manufacturing the same

Power semiconductor device

Airgap structures in auto-doped region under one or more transistors

High electron mobility transistor and method for fabricating the same

High electron mobility transistor and method for fabricating the same

Semiconductor device having a carrier trapping region including cry...

Semiconductor device having a necked semiconductor body and method...

Vertical tunneling field-effect transistor cell

Manufacturing method of semiconductor structure

Lateral fin static induction transistor

Semiconductor integrated circuit

Wide band gap semiconductor device with surface insulating film

Thin semiconductor package for notched semiconductor die

Semiconductor device with voltage resistant structure

Semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY US...

Chip Singulation Assisted Structures and Methods for Improving Bond...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CRACK STOP RING TRENCH TO PREVENT EPITAXY CRACK PROPAGATION

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRU...

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...

DIELECTRIC STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...

WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...

METASURFACE STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

LATERAL FIN STATIC INDUCTION TRANSISTOR

SEMICONDUCTOR DEVICE

MEMBRANE SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD AND MANUFACTURING...

WIDE BAND GAP SEMICONDUCTOR DEVICE WITH SURFACE INSULATING FILM

SEAL RING STRUCTURES

SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD

HIGH POWER DENSITY RECTIFIER DEVICE

HETEROGENEOUS SUPERJUNCTION DEVICES

SEMICONDUCTOR DEVICE

IC STRUCTURE WITH GATE ELECTRODE FULLY WITHIN V-SHAPED CAVITY