1. Field of the Invention
The present invention relates to lamps and more particularly, to a high brightness LED lamp.
2. Description of the Related Art
Conventionally, an incandescent bulb uses a metal filament, for example, tungsten filament for giving off light upon connection of electric current. However, the brightness of the light produced through a tungsten filament is generally not enough. Further, an incandescent bulb produces much heat during the operation, and may burn out easily. Following fast development of semiconductor technology, LEDs (light emitting diodes) have been intensively sued in different fields to substitute for conventional incandescent bulbs. An LED lamp is known comprising a transparent lamp holder and an LED installed in the bottom of the lamp holder. Because the light of the LED of this design of LED lamp passes through the transparent shell of the lamp holder, the intensity of the light is greatly reduced before passing to the outside.
The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a high brightness LED lamp, which greatly improves the brightness of the light passing to the outside.
It is another object of the present invention to provide a high brightness LED lamp, which is easy to assemble, and practical for mass production.
To achieve these objects of the present invention, the high brightness LED lamp comprises a base having a receiving groove; a circuit board inserted through the receiving groove into the inside of the base and having two through holes; and an LED package mounted on the base. The LED package comprises an LED, a shell surrounding the LED and mounted to the base, and two conductive leads extending out of the shell. The two conductive leads are electrically connected to the LED, inserted into the base and respectively coupled into the through holes of the circuit board.
Referring to
The base 10 is an electrically insulative member directly molded from plastics, such as PC (polycarbonate), PE (polyethylene), PP (polypropyrene), or the like, comprising a body 11 and a coupling unit, i.e., two coupling blocks 12. The body 11 comprises a bottom block 111 and a mounting block 112. The bottom block 111 is a hollow circular block, having a receiving groove 113 formed in the top and extending horizontally. The mounting block 112 is a hollow block extending upwards from the top of the bottom block 111 over the receiving groove 113, having a receiving chamber 114 in communication with the inside of the hollow bottom block 111, two vertical through holes 115 cut through a close top wall thereof, an annular top locating flange 116 upwardly extending around the border area of the top wall, and a vertical locating groove 117 formed on the inside wall of the annular top locating flange 116. The outer diameter of the mounting block 112 is smaller than the bottom block 111. The coupling blocks 12 are respectively projected from the periphery of the mounting block 112 at two opposite sides, each comprising a retaining portion 121 and a positioning portion 122. The retaining portion 121 projects from the periphery of the mounting block 112 on the middle and spaced from the bottom block 111 at a distance. The positioning portion 122 extends downwards from one side of the retaining portion 121.
The circuit board 20 comprises a substrate 21 having a predetermined circuit layout (not shown) on the top surface thereof, two contact members 22, a resistor 23, and two through holes 24. The two contact members 22 according to this embodiment are formed of tin paste (other electrically conductive materials may be used to form the contact members 22) provided at the top side of the substrate 21 near the two distal ends and electrically connected to the circuit laid on the substrate 21. The resistor 23 can be a plug-in resistor or chip type resistor arranged on the substrate 21 and electrically connected to the circuit laid on the substrate 21 for regulating electric current and voltage passing through the circuit of the substrate 21. The through holes 24 extend through the top and bottom sides of the substrate 21, and electrically connected to the circuit laid on the substrate 21.
The LED package 30 comprises an LED (light emitting diode) 31, a transparent shell 32 surrounding the LED 31, and two conductive leads 33 respectively connected to LED 31 and extending out of the bottom side of the shell 32. The shell 32 has a bottom block 321 and a locating rib 322 protruding from the bottom block 321 at one side for engaging into the vertical locating groove 117 of the base 10.
The assembly process of the LED lamp 100 is outlined hereinafter. At first, the circuit board 20 is inserted into the horizontal receiving groove 113 of the base 10 to keep the two through holes 24 in alignment with the vertical through holes 115 and the contact members 22 disposed outside the mounting block 112, and then the bottom block 321 of the shell 32 of the LED package 30 is forced into the top recess of the base 10, which is defined by the annular top locating flange 116 and the close top wall of the base 10, to have the locating rib 322 be engaged into the vertical locating groove 117 and the conductive leads 33 be respectively inserted through the vertical through holes 115 and the through holes 24, and then the conductive leads 33 are respectively soldered to the through holes 24 to complete the assembly process.
When assembled, the LED package 30 (the LED 31) is disposed at the top side of the whole structure of the LED lamp 100, and the light of the LED 31 can directly be sent to the outside without attenuation. Further, because the periphery of the LED 31 is abutted against the transparent shell 32, the brightness of the light of the LED 31 passing through the periphery of the shell 31 is high. Further, because the conductive leads 33 of the LED package 30 are directly inserted through the vertical through holes 115 of the base 10 and the through holes 24 of the circuit board 20 and then bonded to the circuit board 20 when forcing the bottom block 321 and locating rib 322 of the LED package 30 into the top recess and vertical locating groove 117 of the base 10, the assembly process is quite simple and can be achieved by means of an automatic machine.
Referring to
Number | Date | Country | Kind |
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94214305 | Aug 2005 | TW | national |