Claims
- 1. A plasma reactor having a vacuum chamber and a support disposed within said vacuum chamber, said reactor comprising:
- a plurality of straight, projecting tubes forming gas injection nozzles extending inward from a side wall of said vacuum chamber toward an area overlying said support, each of said gas injection nozzles being capable of injecting a processing gas into the vacuum chamber in an inward direction;
- wherein each of said gas injection nozzles comprises a gas distribution orifice at a distal end thereof and is capable of spraying a reactant gas at a supersonic velocity toward a portion of said chamber overlying said support.
- 2. The plasma reactor of claim 1 wherein a supersonic gas flow from each nozzle forms a gas diffusion center displaced from the distal end thereof to a location overlying a wafer held by said support.
- 3. The plasma reactor of claim 1 wherein each of said gas injection nozzles has an inner portion tapering radially inwardly and an outer portion tapering radially outwardly.
- 4. The plasma reactor of claim 1 wherein each gas distribution orifice has a size on the order of 10 mils and said chamber has a vacuum between 1 and 30 milliTorr.
- 5. A plasma reactor having a vacuum chamber and a support disposed within said vacuum chamber, said reactor comprising:
- a plurality of gas injection nozzles, comprising a plurality of straight tubes, each of said tubes projecting inward from a side wall of said vacuum chamber toward an area overlying said support, each of said nozzles being capable of injecting a processing gas into the vacuum chamber in an inward direction;
- wherein said support is capable of supporting a workpiece on said support, said support having a periphery corresponding to a periphery of the workpiece, and wherein each of said gas injection nozzles comprises a gas distribution orifice at a distal end thereof and is capable of spraying a reactant gas at a supersonic velocity toward a portion of said chamber overlying said support.
- 6. The plasma reactor of claim 5 wherein a supersonic gas flow from each nozzle forms a gas diffusion center displaced from the distal end thereof to a location overlying the support.
- 7. A plasma reactor having a vacuum chamber and a support, capable of supporting a wafer, disposed within said vacuum chamber, said reactor comprising:
- one or more gas sources for introducing reactant gases into said vacuum chamber;
- a dome-shaped ceiling overlying said vacuum chamber, said dome-shaped ceiling further comprising a major dome radius R.sub.1 and a corner radius R.sub.2 ; and,
- an antenna capable of radiating RF power into said vacuum chamber to generate a plasma therein, said antenna comprising a substantially dome-shaped portion at least partially surrounding said plasma and a circular void centered at the apex of the dome-shaped ceiling, said circular void having a diameter between 25% to 100% of a diameter of said wafer.
- 8. The plasma reactor of claim 7 wherein said antenna conforms to said dome-shaped ceiling.
- 9. The plasma reactor of claim 7 wherein said diameter of the circular void is between 33% and 100% of said diameter of said wafer.
Parent Case Info
This is a division of application Ser. No. 08/113,776, filed Aug. 27, 1993, now U.S. Pat. No. 5,614,055.
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2231197 |
Nov 1990 |
GBX |
Divisions (1)
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Number |
Date |
Country |
Parent |
113776 |
Aug 1993 |
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