Patent Application
20210220936
See Application Data Sheet.
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The present disclosure relates to a soldering apparatus for a winding head of a stator of a vehicle drive motor or a generator and a soldering process.
In the formation of a winding of a stator of a flat-wire motor, a formed hair-pin coil or single-sided coil is first inserted in a slot in a stator iron core, a bending die is then used to bend an opening end of the coil, and bent adjacent conductors are soldered to implement the electrical connection of the winding. Existing welding manners mainly include laser beam welding or argon arc welding. In both the methods, copper is molten at an instantaneous high temperature to form a welding spot, so as to implement the electrical connection of a winding. However, the prior art mainly has two disadvantages. First, a high temperature needs to be instantaneously generated to melt copper in laser beam welding or argon arc welding, and enamel films of enamel wires around the welding spot are prone to damage, resulting in reduced insulation reliability. Second, a large number of hair-pin coils or single-sided coils form a winding of a stator of a flat-wire motor, and a large number of welding spots are needed. In laser beam welding or argon arc welding, welding is usually performed at welding spots one by one, and the production efficiency of a flat-wire stator is severely affected.
An objective of the present disclosure is to provide a soldering apparatus mainly for a winding of a stator of a flat-wire motor and a high-efficiency soldering process. In the soldering process, a winding head of a stator is dipped in a molten solder to complete the soldering of all the solder spots once, thereby improving the production efficiency and quality.
A technical solution of the present disclosure is a high-efficiency soldering apparatus for a winding head of a flat-wire motor, wherein the soldering apparatus includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray; the solder tray is provided at the center of the support base; the solder spot isolation and limit plate is provided on the solder tray; the shaft lever is provided on the support base; the movable tray is provided on the shaft lever; the movable tray is located above the solder tray; the movable tray moves vertically along the shaft lever; and a stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.
Preferably, the solder spot isolation and limit plate is provided with threaded holes, and screws pass through the threaded holes to fix the solder spot isolation and limit plate on the solder tray.
Preferably, the solder spot isolation and limit plate is provided with solder spot isolation and limit through holes, and the solder spot isolation and limit through holes are evenly distributed in a ring.
Preferably, the solder tray is provided with an annular solder slot.
Preferably, there are four shaft levers.
Preferably, the shaft lever is a smooth shaft lever.
Preferably, the solder tray is provided with a threaded fixing hole, and the solder tray is connected to the support base by a screw passing through the threaded fixing hole.
A soldering process using the high-efficiency soldering apparatus for a winding head of a flat-wire motor, wherein specific process steps include:
(1) melting a solder: placing the solder in the solder tray, and enabling the solder to reach and stay in a molten state;
(2) applying a flux: before the stator is placed on the movable tray, applying the flux to the winding head to be dip soldered of the stator or dipping the winding head in the flux in advance;
(3) placing the stator: placing the stator applied or dipped with the flux on the movable tray, with the winding head of the stator extending below the movable tray;
(4) performing dip soldering: moving the movable tray downward along the shaft lever, partially dipping the winding head of the stator in the solder tray holding the molten solder, and performing dip soldering by using the solder spot isolation and limit plate; and
(5) performing resetting: after moving the movable tray downward to reach the position to finish the dip soldering, moving the movable tray on which the stator is placed upward along the shaft lever to return to an initial position, thereby completing the soldering process.
The advantages of the present disclosure are as follows.
1. The soldering apparatus of the present disclosure has a compact and appropriate structure and requires simple operations.
2. The design of the solder spot isolation and limit plate can facilitate the soldering of adjacent conductors and can also ensure that adjacent solder spots are not stuck together, thereby improving the production efficiency.
3. The soldering of all the solder spots can be completed by performing the soldering process once, so that the production efficiency is high.
The present disclosure is further described below with reference to the accompanying drawings and embodiments.
Where: 1.8-pole 48-slot flat-wire motor stator; 2. movable tray; 3. shaft lever; 4. solder spot isolation and limit plate; 5. solder tray; 6. support base; 41. threaded hole; 42. solder spot isolation and limit through hole; 51. annular solder slot; and 52. threaded fixing hole.
As shown in
The structure of the solder spot isolation and limit plate in this solution is not limited to the structure in the schematic diagram herein. The arrangement positions, layer numbers, and quantity of the isolation and limit through holes of the solder spot isolation and limit plate depend on the design positions, layer numbers, and quantity of connection solder spots of a flat-wire winding head.
A soldering process using the high-efficiency soldering apparatus for a winding head of a flat-wire motor, wherein specific process steps include:
(1) melting a solder: placing the solder in the annular solder slot 51 of the solder tray 5, and enabling the solder to reach and stay in a molten state;
(2) applying a flux: applying the flux to the winding head to be dip soldered of the 8-pole 48-slot flat-wire motor stator 1 or dipping the winding head in the flux in advance;
(3) placing the stator: placing the 8-pole 48-slot flat-wire motor stator 1 with the winding head applied or dipped with the flux on the movable tray, with the winding head of the stator extending below the movable tray 2;
(4) performing dip soldering: moving the movable tray 2 downward along the shaft lever 3, partially dipping the winding head of the stator in the annular solder slot 51 of the solder tray 5 holding the molten solder, and performing dip soldering by using the solder spot isolation and limit plate, wherein the solder spot isolation and limit through holes 42 are used to limit the positions of adjacent conductors to be soldered and isolate adjacent solder spots, so that it is easier to solder adjacent conductors and it can be ensured that adjacent solder spots are not stuck together.
(5) performing resetting: after moving the movable tray 2 downward to reach the position to finish the dip soldering, moving the movable tray 2 on which the 8-pole 48-slot flat-wire motor stator 1 is placed upward along the shaft lever to return to the initial position, thereby completing the soldering process.
The soldering process in this solution have relatively high requirements for the melting point, adhesive property, and electrical conductivity of the solder, and an appropriate copper-based brazing filler metal or silver-based brazing filler metal may be chosen. The soldering process is applicable to a hair-pin flat-wire winding stator and an I-pin soldered flat-wire winding stator.
The principle and effect of the present disclosure are only schematically described in the foregoing embodiments, and these embodiments are not used to limit the present disclosure. Any person skilled in the art may make modifications or changes to the foregoing embodiments without departing from the spirit and scope of the present disclosure. Therefore, all equivalent modifications or changes completed by a person of ordinary skill in the technical field without departing from the spirit and technical concept disclosed in the present disclosure shall still fall within the claims of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201910067209.2 | Jan 2019 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2019/129702 | 12/30/2019 | WO | 00 |
