with dipping means

Industry

CPC
B23K3/0669

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K3/00Tools, devices, or special appurtenances for soldering

Current Industry

B23K3/0669with dipping means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for selectively pretinning a guidewire core
- Patent number 11,548,086
- Issue date Jan 10, 2023
- Abbott Cardiovascular Systems Inc.
- John A. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting machine
- Patent number 11,503,752
- Issue date Nov 15, 2022
- FUJI CORPORATION
- Hiroaki Ina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-efficiency soldering apparatus for winding head of flat-wire m...
- Patent number 11,235,406
- Issue date Feb 1, 2022
- HEFEI JEE POWER SYSTEMS Co., Ltd.
- Lei Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire automatic soldering system
- Patent number 11,141,807
- Issue date Oct 12, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Fengchun Xie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for selectively pretinning a guidewire core
- Patent number 10,556,287
- Issue date Feb 11, 2020
- Abbott Cardiovascular Systems Inc.
- John A. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component, semiconductor-mounted product including th...
- Patent number 9,925,612
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuo Fukuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective soldering system
- Patent number 9,550,246
- Issue date Jan 24, 2017
- Illinois Tool Works
- Ton Colijn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint structure and solder joining method
- Patent number 9,352,408
- Issue date May 31, 2016
- Nidec Corporation
- Tomoyoshi Yokogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,289,841
- Issue date Mar 22, 2016
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering system of soldering a dip component on a circuit board
- Patent number 8,740,046
- Issue date Jun 3, 2014
- Wistron Corporation
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and soldering system of soldering a DIP component on a circu...
- Patent number 8,690,041
- Issue date Apr 8, 2014
- Wistron Corporation
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting line and electronic component mountin...
- Patent number 8,673,685
- Issue date Mar 18, 2014
- Panasonic Corporation
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for depositing conductive material into opening...
- Patent number 7,845,540
- Issue date Dec 7, 2010
- Micron Technology, Inc.
- Rick C. Lake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for corrective soldering
- Patent number 7,159,754
- Issue date Jan 9, 2007
- Vitronics Soltec B.V.
- Johannes Coleta Maria Van Den Broek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Viscous fluid transfer apparatus and transfer method, electronic co...
- Patent number 7,048,172
- Issue date May 23, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hideki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Viscous fluid transfer apparatus and transfer method, electronic co...
- Patent number 6,957,759
- Issue date Oct 25, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive powder applying device immersing substrate into conducti...
- Patent number 6,886,733
- Issue date May 3, 2005
- Shinko Electric Industries Co., Ltd.
- Masatoshi Katayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Viscous fluid transfer apparatus and transfer method, electronic co...
- Patent number 6,789,720
- Issue date Sep 14, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inert atmosphere soldering apparatus
- Patent number 6,705,506
- Issue date Mar 16, 2004
- William Sund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering alloy
- Patent number 6,659,329
- Issue date Dec 9, 2003
- Edison Welding Institute, Inc.
- Peter Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for selective soldering
- Patent number 6,655,574
- Issue date Dec 2, 2003
- Vitronics Soltec B.V.
- Gerrit Schouten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire processing apparatus, flux applying device, and solder deposit...
- Patent number 6,637,639
- Issue date Oct 28, 2003
- ShinMaywa Industries, Ltd.
- Akira Miyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-immersing wetting balance
- Patent number 6,286,368
- Issue date Sep 11, 2001
- General Electric Company
- Harvey Donald Solomon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and apparatus
- Patent number 6,082,607
- Issue date Jul 4, 2000
- Tamagawa Seiki Kabushiki Kaisha
- Takahiro Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and apparatus
- Patent number 6,073,832
- Issue date Jun 13, 2000
- Tamagawa Seiki Kabushiki Kaisha
- Takahiro Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical circuit board soldering apparatus
- Patent number 6,042,648
- Issue date Mar 28, 2000
- Dave O. Corey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inert atmosphere soldering apparatus
- Patent number 5,860,582
- Issue date Jan 19, 1999
- William Sund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for dip solder processing
- Patent number 5,845,839
- Issue date Dec 8, 1998
- General Motors Corporation
- Thomas Dale Dodge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inert atmosphere soldering apparatus
- Patent number 5,711,473
- Issue date Jan 27, 1998
- William Sund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing circuit boards dipped in molten solder
- Patent number 5,683,743
- Issue date Nov 4, 1997
- International Business Machines Corporation
- Peter Michael Banks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE
- Publication number 20230095943
- Publication date Mar 30, 2023
- ABBOTT CARDIOVASCULAR SYSTEM INC.
- John A. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-EFFICIENCY SOLDERING APPARATUS FOR WINDING HEAD OF FLAT-WIRE M...
- Publication number 20210220936
- Publication date Jul 22, 2021
- HEFEI JEE POWER SYSTEMS Co., Ltd.
- Lei LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE
- Publication number 20200122258
- Publication date Apr 23, 2020
- ABBOTT CARDIOVASCULAR SYSTEMS INC.
- John A. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Automatic Soldering System
- Publication number 20200094339
- Publication date Mar 26, 2020
- Tyco Electronics (Shanghai) Co. Ltd.
- Fengchun Xie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE
- Publication number 20180236581
- Publication date Aug 23, 2018
- ABBOTT CARDIOVASCULAR SYSTEMS INC.
- John A. Simpson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...
- Publication number 20140212678
- Publication date Jul 31, 2014
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT STRUCTURE AND SOLDER JOINING METHOD
- Publication number 20140126956
- Publication date May 8, 2014
- NIDEC CORPORATION
- Tomoyoshi YOKOGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD
- Publication number 20140110458
- Publication date Apr 24, 2014
- Wistron Corporation
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...
- Publication number 20140073088
- Publication date Mar 13, 2014
- PANASONIC CORPORATION
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT HAVING AN ELECTRODE CORROSION PREVENTING LAYER AND A METH...
- Publication number 20140036427
- Publication date Feb 6, 2014
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCU...
- Publication number 20120193400
- Publication date Aug 2, 2012
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and methods for depositing conductive material into opening...
- Publication number 20070057028
- Publication date Mar 15, 2007
- Micron Technology, Inc.
- Rick C. Lake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Viscous fluid transfer apparatus and transfer method, electronic co...
- Publication number 20050023326
- Publication date Feb 3, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Viscous fluid transfer apparatus and transfer method, electronic co...
- Publication number 20050023681
- Publication date Feb 3, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Viscous fluid transfer apparatus and transfer method, electronic co...
- Publication number 20050017052
- Publication date Jan 27, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO, Ltd.
- Hideki Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for corrective soldering
- Publication number 20040200880
- Publication date Oct 14, 2004
- Vitronics Soltec B.V.
- Johannes Coleta Maria Van Den Broek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive powder applying device immersing substrate into conducti...
- Publication number 20030209585
- Publication date Nov 13, 2003
- Shinko Electric Industries Co., Ltd.
- Masatoshi Katayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for selective soldering
- Publication number 20020162879
- Publication date Nov 7, 2002
- Vitronics Soltec B.V.
- Gerrit Schouten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for connecting the winding wire of a coil with a terminal pin
- Publication number 20020092898
- Publication date Jul 18, 2002
- Dieter Proksch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire processing apparatus, flux applying device, and solder deposit...
- Publication number 20020092899
- Publication date Jul 18, 2002
- ShinMaywa Industries, Ltd.
- Akira Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Viscous fluid transfer apparatus and transfer method, electronic co...
- Publication number 20020070460
- Publication date Jun 13, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hideki Uchida
- H01 - BASIC ELECTRIC ELEMENTS

with dipping means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for selectively pretinning a guidewire core

Component mounting machine

High-efficiency soldering apparatus for winding head of flat-wire m...

Wire automatic soldering system

Method for selectively pretinning a guidewire core

Semiconductor component, semiconductor-mounted product including th...

Selective soldering system

Solder joint structure and solder joining method

Soldering device, soldering method, and substrate and electronic co...

Soldering system of soldering a dip component on a circuit board

Method and soldering system of soldering a DIP component on a circu...

Electronic component mounting line and electronic component mountin...

Systems and methods for depositing conductive material into opening...

Apparatus and method for corrective soldering

Viscous fluid transfer apparatus and transfer method, electronic co...

Viscous fluid transfer apparatus and transfer method, electronic co...

Conductive powder applying device immersing substrate into conducti...

Viscous fluid transfer apparatus and transfer method, electronic co...

Inert atmosphere soldering apparatus

Soldering alloy

Apparatus for selective soldering

Wire processing apparatus, flux applying device, and solder deposit...

Self-immersing wetting balance

Soldering method and apparatus

Soldering method and apparatus

Vertical circuit board soldering apparatus

Inert atmosphere soldering apparatus

Method and apparatus for dip solder processing

Inert atmosphere soldering apparatus

Manufacturing circuit boards dipped in molten solder

Patents Applicationslast 30 patents

METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE

HIGH-EFFICIENCY SOLDERING APPARATUS FOR WINDING HEAD OF FLAT-WIRE M...

METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE

Wire Automatic Soldering System

METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE

SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...

SOLDER JOINT STRUCTURE AND SOLDER JOINING METHOD

SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD

ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTIN...

COMPONENT HAVING AN ELECTRODE CORROSION PREVENTING LAYER AND A METH...

METHOD AND SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCU...

Systems and methods for depositing conductive material into opening...

Viscous fluid transfer apparatus and transfer method, electronic co...

Viscous fluid transfer apparatus and transfer method, electronic co...

Viscous fluid transfer apparatus and transfer method, electronic co...

Apparatus and method for corrective soldering

Conductive powder applying device immersing substrate into conducti...

Apparatus for selective soldering

Process for connecting the winding wire of a coil with a terminal pin

Wire processing apparatus, flux applying device, and solder deposit...

Viscous fluid transfer apparatus and transfer method, electronic co...