Claims
- 1. A method of depositing metal onto a substrate comprising the steps of:
forming a stream of molten metal droplets comprising satellite droplets and parent droplets; and directing at least a portion of the satellite droplets to predetermined locations on a substrate.
- 2. The method of claim 1 wherein the forming step further includes directing a capillary stream of molten metal from an orifice by applying an excitation disturbance, wherein the excitation disturbance is determined so that the parent and satellite droplets form from the stream due to capillary stream break-up.
- 3. The method of claim 1, wherein the directing step comprises:
imparting an electrostatic charge to at least some of the satellite droplets; and passing the satellite droplets through an electric field, wherein the electrostatic charge for each satellite droplet and the electric field are determined to deflect each satellite droplet to land at its corresponding predetermined location on the substrate.
- 4. The method of claim 1, further comprising a step of translating the substrate in at least one direction substantially orthogonal to the capillary stream
- 5. The method of claim 1, further comprising the step of recycling back into the molten metal the parent droplets and the satellite droplets that are not deposited onto the substrate.
- 6. The method of claim 5, further comprising the step of filtering the molten metal.
- 7. An electrical assembly comprising:
a substrate; and a plurality of metal balls attached to the substrate, wherein each of the plurality of balls has a diameter in a range of about 1.0 to 100 microns.
- 8. The electrical assembly of claim 7, wherein each of the plurality of balls has a diameter of less than 25 microns.
- 9. The electrical assembly of claim 7, wherein the electrical assembly is a ball grid array.
- 10. An electrical assembly comprising a substrate and a plurality of metallic traces attached thereto, the assembly produced by a process comprising the steps of:
directing a capillary stream of molten metal from an orifice by applying an excitation disturbance, wherein the excitation disturbance is determined so that parent and satellite droplets form from the stream due to capillary stream break-up; and directing at least a portion of the satellite droplets to predetermined locations on the substrate.
- 11. A circuit board comprising:
a substrate; and a conductive trace disposed on the substrate, the conductive trace having a pitch in a range of about 5-100 microns, wherein the conductive trace comprises a plurality of solidified metallic droplets fused together to form an electrical connection therebetween.
- 12. The circuit board of claim 11, wherein the conductive trace has a pitch less than about 25 microns.
- 13. The circuit board of claim 11, wherein the pitch is within a range of about 3.0 to 5.0 percent of a mean pitch value.
Parent Case Info
[0001] This application is related to U.S. applications Ser. Nos. ______ and ______, filed May 18, 2001, the contents of which are hereby fully incorporated by reference. This application is related to provisional U.S. application Ser. No. 60/206,508, filed May 22, 2000, and provisional U.S. application Ser. No. 60/278,495, filed Mar. 23, 2001, the contents of which are hereby filly incorporated by reference.
Government Interests
[0002] This invention was made with Government support under Grant No. DMI-9457205, awarded by NSF. The Government has certain rights in this invention.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60206508 |
May 2000 |
US |
|
60278495 |
Mar 2001 |
US |