The present invention pertains to dispensing systems for dispensing flowable material, and more particularly to hot melt adhesive dispensing systems.
Thermoplastic adhesives, otherwise known as “hot melt” adhesives have been widely used in industry for adhering many types of products. Hot melt adhesive dispensing systems generally include one or more dispensing guns, heated hoses connected to the guns, and a dispensing unit for melting and supplying heated liquid adhesive to the guns through the heated hoses. The dispensing units of conventional hot melt adhesive systems include a tank, a heater, a pump, a manifold, and a controller. The heater is located in a base of the tank and the tank is mounted on top of the manifold so that the heater can heat both the tank and the manifold. The manifold has an inlet connected to the tank and typically has multiple outlet ports for connection to the heated hoses. Adhesive material is supplied to the tank in solid or semi-solid form, where it is melted and heated to a desired application temperature. The pump associated with the tank and manifold pumps liquid adhesive from the tank, through the manifold and heated hoses to the dispensing guns. The controller is generally located adjacent the tank and controls the power supplied to the heater and heated hoses to maintain the liquid adhesive at an appropriate viscosity and temperature, depending on the application. The controller typically controls many other system operations as well.
While conventional dispensing units for hot melt adhesive systems, as described above, have been in use for many years, improvements in design are still needed. For example, the location of the manifold beneath the tank creates an asymmetric layout wherein the heated hoses connecting the outlet ports of the manifold to the adhesive guns must be of different length depending upon whether the gun is located adjacent the tank or on an opposite side of the dispensing unit adjacent the controller. This asymmetry can be problematic when a single dispensing unit is positioned between two manufacturing lines to supply adhesive to the two lines. It can also be problematic if separate dispensing units are used to supply separate manufacturing lines. In each case, as a consequence of the asymmetry of current dispensing units, end users must purchase and stock heated hoses of various lengths to accommodate various arrangements of dispensing systems.
Also, utilizing a common heater to heat both the tank and the manifold can expose the adhesive flowing through the manifold to more heat than is often necessary for maintaining proper adhesive viscosity and temperature. This is especially problematic when the heater is energized to melt solid or semi-solid adhesive that has been added to the tank during operation when the tank level is low. This problem is sometimes referred to as thermal shock and is caused by the control system's attempt to rapidly melt the relatively cool, solid or semi-solid adhesive added by the operator. The rapid, increased heating can cause undesirable charring and degradation of adhesive in the manifold and thereby cause various adhesive performance problems.
Another challenge with conventional hot melt adhesive systems relates to the time period needed to heat the pump to operating temperature at start-up. Since the pump is located within the tank, it is only indirectly heated by the hot adhesive in the tank. This typically lengthens the start-up time. Location of the pump in the tank also minimizes the adhesive holding capacity of the tank and limits the size of the effective tank opening for receiving new adhesive into the tank.
For at least these reasons, a need exists for a dispensing unit of a hot melt adhesive system having a configuration allowing the user to stock heated hoses of more uniform length. A need also exists for a dispensing unit for a hot melt adhesive system which facilitates more precise temperature control of adhesive flowing through the manifold and which heats the pump faster at start-up.
The present invention provides a dispensing unit for a hot melt adhesive system in which the supply hose connections to the adhesive supply manifold are located centrally between right and left sides of the unit. The invention provides advantages in that a common length of heated hose may be used to provide liquid adhesive to one or more manufacturing lines. End users need only purchase and stock a single length of hose for use on different installations of adhesive dispensing systems. The design also improves accessibility of the heated hose cord sets to electrical connections on the controller and significantly reduces the vertical envelope or space occupied by the unit.
More specifically, the dispensing unit for a hot melt adhesive system includes a tank, a manifold, and a controller. The manifold is located adjacent the tank and is positioned between the tank and the controller. Outlet ports on the manifold are arranged to be substantially centrally located with respect to the tank-side and controller-side ends of the unit. Because the manifold is no longer located beneath the tank, the overall height of the dispensing unit may be reduced to provide a shorter service envelope. Another benefit is that a conventional pump, such as a piston pump may be located outside of the tank. This permits easier serviceability of the pump and vertical pump orientation which results in better pumping action. Removing the pump from the tank also maximizes the tank opening and capacity by eliminating the obstruction created by the pump within the tank.
In another aspect, the manifold of the dispensing unit is thermally isolated from the tank and has an independently controllable manifold heater. The temperature of the adhesive flowing through the manifold may therefore be more precisely controlled to ensure that hot melt adhesive is supplied to the adhesive guns at the proper viscosity and temperature. Specifically, controlling the manifold temperature and tank temperature independently prevents undesirable charring and degradation of the adhesive in the manifold especially when relatively cool adhesive is added to the tank. Excessive heat build-up in the manifold is prevented ensuring that the manifold is always maintained at an appropriate application temperature.
In another aspect of the invention, a pump coupled to the manifold is located outside of the tank and is thermally coupled to the manifold so that it is heated by the manifold heater. This arrangement permits the adhesive holding capacity of the tank to be maximized and provides more direct heating of the pump for shorter start-up times.
In yet another aspect of the invention, the manifold heater is easily removable from the manifold to facilitate maintenance or replacement of the heater.
These and other features, advantages and objectives of the invention will become more readily apparent to those of ordinary skill in the art upon review of the following detailed description of the preferred embodiments, taken in conjunction with the accompanying drawing.
The accompanying drawing, which is incorporated in and constitutes a part of this specification, illustrates embodiments of the invention and, together with a general description of the invention given above, and the detailed description given below, serves to explain details of the preferred embodiment.
Referring to
The manifold 26 is mounted to a side wall 30 of the tank 22 with a spacer 41 and is spaced from the tank 22 a distance 42 sufficient to provide thermal isolation of the tank 22 and manifold 26. In an exemplary embodiment, the spacer 41 is made from aluminum. A vertically-oriented piston pump 58 coupled to the manifold 26 pumps liquid adhesive 24 from the tank 22 and into the manifold 26 where it is split into separate flows. The manifold 26 has a plurality of outlet ports 44 which may be fitted with heated hoses 46 attached to one or more adhesive guns 48, 50 to supply the liquid adhesive 24 to the guns 48, 50.
The guns 48, 50 include one or more adhesive dispensing modules 54 which apply the adhesive 24 to a desired product (not shown). The adhesive dispensing modules 54 are mounted to gun bodies 51 having gun heaters 53 and are supported on a frame 52. The hot melt adhesive system 10 shown in
As shown in
The manifold 26 includes a manifold heater 56 which is separate from the tank heater 34 and which can be independently controlled by the controller 28. Because the dispensing unit 20 of the present invention has a separate manifold heater 56 and a manifold 26 which is thermally isolated from the tank 22, the temperature of the adhesive 24 flowing through the manifold 26 may be controlled more precisely than prior systems which utilized a single heater to perform both the function of melting and heating adhesive 24 in the tank 22 and the function of heating the manifold 26. Moreover, the separate manifold heater 56 eliminates or significantly reduces the possibility of overheating the adhesive 24 in the manifold 26 when the tank heater 34 is energized to melt relatively cool solid or semi-solid adhesive 24a that has been newly added to the tank 22.
Another benefit of utilizing a separate tank heater 34 and manifold heater 56 is that the design of the heating elements may be simplified and may even be available as off-the-shelf stock items. The manifold heater 56 may also be configured to be easily removable from the manifold 26, such as by removing bolts 57 which are used to fasten the manifold heater 56 to the manifold 26. While the manifold heater 56 is depicted as being bolted to the manifold 26 in
In another aspect of the invention, the pump 58 is located external to the tank 22. Pump 58 is preferably attached to the manifold 26 and is heated by the manifold heater 56. This arrangement permits a larger tank opening 60, increases the tank capacity, and reduces the time required to heat the pump 58. It also allows the piston (not shown) of pump 58 to move vertically which provides for better pumping action.
Dispensing unit 20 includes a controller 28 which houses the power supply and electronic controls for the dispensing unit 20. The heated hoses 46 are electrically coupled to the controller 28 by cord sets 62 associated with each hose 46. The controller 28 preferably independently monitors and adjusts the tank heater 34, the manifold heater 56, the heated hoses 46, and the gun heater(s) 53 to melt solid or semi-solid adhesive 24a received in the tank 22 and to maintain the temperature of melted adhesive 24 to ensure proper viscosity of the adhesive 24 supplied to the guns 48, 50 and dispensed by the adhesive dispensing modules 54.
The block diagram of
When new adhesive material 24a is added to the tank 22, tank heater control section 70 senses a drop in temperature and the tank heater 34 is cycled on to melt the newly added adhesive 24a, while the manifold 26, heated hoses 46, and adhesive guns 48, 50 are maintained at substantially constant temperature by the manifold heater control section 74, the heated hose control section 72, and the gun heater control section 76, respectively. Individual control of the temperature of the adhesive 24 in each component, as described above, ensures that liquid hot melt adhesive 24 is provided to the adhesive dispensing modules 54 at an appropriate application temperature and viscosity without exposing the adhesive 24 to excessive temperatures which could overheat and char or otherwise degrade the adhesive 24.
While the present invention has been illustrated by the description of various embodiments thereof, and while the embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art. The invention in its broader aspects is therefore not limited to the specific details, representative apparatus and methods and illustrative examples shown and described. Accordingly, departures may be made from such details without departing from the scope or spirit of Applicants' general inventive concept.
This application is a continuation of U.S. application Ser. No. 10/278,394 filed on Oct. 23, 2002 (pending) which claims the benefit of U.S. Provisional Application Nos. 60/345,886 and 60/345,887 both filed on Oct. 29, 2001, and the disclosures of which are hereby incorporated by reference herein.
Number | Date | Country | |
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60345886 | Oct 2001 | US | |
60345887 | Oct 2001 | US |
Number | Date | Country | |
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Parent | 10278394 | Oct 2002 | US |
Child | 11042295 | Jan 2005 | US |