Number | Name | Date | Kind |
---|---|---|---|
4600658 | Anderson et al. | Jul 1986 | |
4786962 | Koch | Nov 1988 | |
4970176 | Tracy et al. | Nov 1990 | |
5108570 | Wang | Apr 1992 | |
5267607 | Wada | Dec 1993 | |
5270255 | Wong | Dec 1993 | |
5288665 | Nulman | Feb 1994 | |
5312512 | Allman et al. | May 1994 | |
5360524 | Hendel et al. | Nov 1994 | |
5371042 | Ong | Dec 1994 | |
5378660 | Ngan et al. | Jan 1995 | |
5380678 | Yu et al. | Jan 1995 | |
5443995 | Nulman | Aug 1995 | |
5470792 | Yamada | Nov 1995 |
Number | Date | Country |
---|---|---|
0 223 787 B1 | Nov 1986 | EP |
0 420 597 B1 | Apr 1991 | EP |
0 420 595 B1 | Apr 1991 | EP |
0 425 084 B1 | May 1991 | EP |
0 439 128 B1 | Jul 1991 | EP |
0451740A2 | Oct 1991 | EP |
0451571A2 | Oct 1991 | EP |
0499241A1 | Aug 1992 | EP |
0425084 | Mar 1996 | EP |
0790641A1 | Aug 1997 | EP |
Entry |
---|
Zheng Xu et al., Al planarization processes for multilayer metallization of quarter micrometer devices, Thin Solid Films 253 (1994), Elsevier Science S.A., pp. 367-371. |
Zheng Xu et al., Planar Multilevel Metallization Technologies for ULSI Devices, SPIE, vol. 2335, pp. 70-79. |
Singer, Pete, “The Interconnect Challenge: Filling Small, High Aspect Ratio Contact Holes,” Semiconductor International, Aug. 1994, pp. 57-64. |