by physical means

Industry

CPC
H01L21/2855

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2855by physical means

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 12,211,745
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition system and method
- Patent number 12,211,756
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conditioning treatment for ALD productivity
- Patent number 12,195,845
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Christina L. Engler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity tungsten film and method of manufacture
- Patent number 12,191,198
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition method and element including film deposited by the...
- Patent number 12,183,582
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD target design and semiconductor devices formed using the same
- Patent number 12,180,576
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate structure and method of manufacturing...
- Patent number 12,170,280
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition process apparatus and method of optimizin...
- Patent number 12,165,935
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,148,621
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices
- Patent number 12,148,622
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp ring and method of using clamp ring
- Patent number 12,142,514
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing electronic structures
- Patent number 12,136,632
- Issue date Nov 5, 2024
- Pragmatic Printing Ltd
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving deposition process
- Patent number 12,112,930
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Tang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deep trench capacitor including stress-relief voids and methods of...
- Patent number 12,113,099
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protection layer and method for fabricati...
- Patent number 12,112,950
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,112,973
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for filling a gap
- Patent number 12,104,244
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,087,637
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,084,757
- Issue date Sep 10, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrically and magnetically enhanced ionized physical vapor depos...
- Patent number 12,077,849
- Issue date Sep 3, 2024
- IonQuest Corp.
- Bassam Hanna Abraham
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having interconnection structure and method of...
- Patent number 12,080,591
- Issue date Sep 3, 2024
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature deposition of pure molybdenum films
- Patent number 12,080,558
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Kunal Bhatnagar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,074,023
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Ji-woon Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and formation method of semiconductor device with capacitors
- Patent number 12,074,162
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Jyun Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250038050
- Publication date Jan 30, 2025
- LAM RESEARCH CORPORATION
- Son Vo Nam TRAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE
- Publication number 20250031433
- Publication date Jan 23, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Shouguo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...
- Publication number 20250031393
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20250024758
- Publication date Jan 16, 2025
- 1372934 B.C. Ltd.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Application
Substrate Processing Apparatus, Substrate Processing Method, Method...
- Publication number 20250011930
- Publication date Jan 9, 2025
- Kokusai Electric Corporation
- Kentaro GOSHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250003067
- Publication date Jan 2, 2025
- Soulbrain Co., LTD
- Jae Sun JUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Metal Gapfill
- Publication number 20240395614
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP RING AND METHOD OF USING CLAMP RING
- Publication number 20240387233
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Deposition Process
- Publication number 20240387155
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...
- Publication number 20240387190
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guangyan Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structure of Semiconductor Device and Method of Forming Same
- Publication number 20240379812
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240371645
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS
- Publication number 20240363350
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240363424
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS
- Publication number 20240355817
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Jyun Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FILLING A GAP
- Publication number 20240352576
- Publication date Oct 24, 2024
- ASM IP HOLDING B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...
- Publication number 20240355499
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- CHANG SEOK LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR CONTROLLING RESISTIVITY AND CRYSTALLINITY OF LOW-RESISTA...
- Publication number 20240355626
- Publication date Oct 24, 2024
- ULVAC, Inc.
- Chang Min SHIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...
- Publication number 20240347610
- Publication date Oct 17, 2024
- Intel Corporation
- Koustav GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240332024
- Publication date Oct 3, 2024
- Kokusai Electric Corporation
- Yutaka MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240312792
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon and/or Oxygen Doped Polysilicon Resistor
- Publication number 20240312984
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yanbiao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PACKAGING MANUFACTURING METHOD AND SEMICONDUCTOR DEVICES MAN...
- Publication number 20240312782
- Publication date Sep 19, 2024
- Seoul National University R&DB Foundation
- Woo Young CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN OHMIC CONTACT ON A GERMANIUM-TIN BASED LAYER
- Publication number 20240304451
- Publication date Sep 12, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Nicolas COUDURIER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME
- Publication number 20240271271
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH CARBON-DENSITY-DECREASING REGION
- Publication number 20240258380
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Tsunenobu KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION
- Publication number 20240240316
- Publication date Jul 18, 2024
- LAM RESEARCH CORPORATION
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

by physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Methods of fabricating semiconductor devices

Deposition system and method

Semiconductor device and method for manufacturing the semiconductor...

Conditioning treatment for ALD productivity

Low resistivity tungsten film and method of manufacture

Film deposition method and element including film deposited by the...

PVD target design and semiconductor devices formed using the same

Formation and in-situ etching processes for metal layers

Method of manufacturing gate structure and method of manufacturing...

Physical vapor deposition process apparatus and method of optimizin...

Method of processing substrate, method of manufacturing semiconduct...

Semiconductor devices

Method of forming semiconductor device

Clamp ring and method of using clamp ring

Methods of manufacturing electronic structures

Methods for forming recesses in source/drain regions and devices fo...

Method for improving deposition process

Deep trench capacitor including stress-relief voids and methods of...

Semiconductor device with protection layer and method for fabricati...

Semiconductor structure and method for manufacturing the same

Methods and systems for filling a gap

Methods for forming a metallic film on a substrate by cyclical depo...

Semiconductor device and method of manufacture

Method of manufacturing semiconductor device, substrate processing...

Electrically and magnetically enhanced ionized physical vapor depos...

Semiconductor device having interconnection structure and method of...

Low temperature deposition of pure molybdenum films

Methods of manufacturing semiconductor devices

Structure and formation method of semiconductor device with capacitors

Patents Applicationslast 30 patents

FEATURE FILL WITH NUCLEATION INHIBITION

METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE

DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

Substrate Processing Apparatus, Substrate Processing Method, Method...

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

Method for Metal Gapfill

CLAMP RING AND METHOD OF USING CLAMP RING

Method for Improving Deposition Process

FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...

Method of Forming Semiconductor Device

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

Gate Structure of Semiconductor Device and Method of Forming Same

SEMICONDUCTOR DEVICES

FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CAPACITORS

METHODS AND SYSTEMS FOR FILLING A GAP

SPIRAL GRAPHENE NANOCRYSTAL, GRAPHENE FILM, INTERCONNECTSTRUCTURE,...

METHOD FOR CONTROLLING RESISTIVITY AND CRYSTALLINITY OF LOW-RESISTA...

CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Carbon and/or Oxygen Doped Polysilicon Resistor

VACUUM PACKAGING MANUFACTURING METHOD AND SEMICONDUCTOR DEVICES MAN...

METHOD FOR FORMING AN OHMIC CONTACT ON A GERMANIUM-TIN BASED LAYER

PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME

SEMICONDUCTOR DEVICE WITH CARBON-DENSITY-DECREASING REGION

DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION