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H01L21/2855

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2855by physical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact resistance reduction in transistor devices with metallizati...
- Patent number 12,342,574
- Issue date Jun 24, 2025
- Intel Corporation
- Koustav Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for homogenous intermixing of precursors in all...
- Patent number 12,331,396
- Issue date Jun 17, 2025
- Lam Research Corporation
- Ilanit Fisher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power control for rf impedance matching network
- Patent number 12,334,307
- Issue date Jun 17, 2025
- ASM IP Holding B.V.
- Ronald Anthony Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,328,930
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet radiation activated atomic layer deposition
- Patent number 12,327,721
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Christine Y. Ouyang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor tool for copper deposition
- Patent number 12,327,715
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Void-free contact trench fill in gate-all-around FET architecture
- Patent number 12,327,761
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of low temperature plasma enhanced chemical va...
- Patent number 12,300,497
- Issue date May 13, 2025
- Applied Materials, Inc.
- Thai Cheng Chua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and formation method of semiconductor device with carbon-...
- Patent number 12,300,541
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing display device, and electro...
- Patent number 12,289,959
- Issue date Apr 29, 2025
- Sony Group Corporation
- Hitoshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride semiconductor photoelectrode
- Patent number 12,286,718
- Issue date Apr 29, 2025
- Nippon Telegraph and Telephone Corporation
- Yuya Uzumaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual metal wrap-around contacts for semiconductor devices
- Patent number 12,284,820
- Issue date Apr 22, 2025
- Tokyo Electron Limited
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant filter for solid state RF impedance matching network
- Patent number 12,272,522
- Issue date Apr 8, 2025
- ASM America, Inc.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal and smooth titanium nitride layers and methods of forming...
- Patent number 12,272,599
- Issue date Apr 8, 2025
- Eugenus, Inc.
- Hyunchol Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a barrier layer in an interconnect structure of s...
- Patent number 12,266,567
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field stop IGBT with grown injection region
- Patent number 12,262,553
- Issue date Mar 25, 2025
- iPower Semiconductor
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium aluminum and tantalum aluminum thin films
- Patent number 12,237,392
- Issue date Feb 25, 2025
- ASM IP Holding B.V.
- Suvi Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital pen with enhanced educational and therapeutic feedback
- Patent number 12,233,661
- Issue date Feb 25, 2025
- Lauren Michelle Neubauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Haloalkynyl dicobalt hexacarbonyl precursors for chemical vapor dep...
- Patent number 12,237,170
- Issue date Feb 25, 2025
- Entegris, Inc.
- Sangbum Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vanadium nitride layer and structure including th...
- Patent number 12,237,171
- Issue date Feb 25, 2025
- ASM IP Holding B.V.
- Giuseppe Alessio Verni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 12,211,745
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition system and method
- Patent number 12,211,756
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conditioning treatment for ALD productivity
- Patent number 12,195,845
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Christina L. Engler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity tungsten film and method of manufacture
- Patent number 12,191,198
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition method and element including film deposited by the...
- Patent number 12,183,582
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD target design and semiconductor devices formed using the same
- Patent number 12,180,576
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR ELECTRODE FORMING METHOD
- Publication number 20250210358
- Publication date Jun 26, 2025
- Jusung Engineering Co., Ltd.
- Jeong Soo JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250203995
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Tomoki AYANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250204011
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Seongdong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM ALUMINUM AND TANTALUM ALUMINUM THIN FILMS
- Publication number 20250176248
- Publication date May 29, 2025
- ASM IP HOLDING B.V.
- Suvi Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK
- Publication number 20250162342
- Publication date May 22, 2025
- Lauren Michelle Neubauer
- B43 - WRITING OR DRAWING IMPLEMENTS BUREAU ACCESSORIES
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250149383
- Publication date May 8, 2025
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250142926
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films
- Publication number 20250140543
- Publication date May 1, 2025
- Intel Corporation
- Ilya KARPOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUSES FOR TEMPERATURE INDEXED ALD
- Publication number 20250129473
- Publication date Apr 24, 2025
- ASM IP HOLDING B.V.
- Bert Jongbloed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250125280
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Taejun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250118600
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARTICLES COATED WITH CRACK-RESISTANT FLUORO-ANNEALED FILMS AND METH...
- Publication number 20250109483
- Publication date Apr 3, 2025
- Entegris, Inc.
- Nilesh Gunda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Publication number 20250092508
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY
- Publication number 20250089277
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRO...
- Publication number 20250072214
- Publication date Feb 27, 2025
- SONY GROUP CORPORATION
- Hitoshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE WITH OPTIMIZED RELIABILITY FOR POWER DEVICE, PRE...
- Publication number 20250072095
- Publication date Feb 27, 2025
- Huahong ZealCore Electronics Technology Co.,Ltd
- Yimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
- Publication number 20250062165
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20250038050
- Publication date Jan 30, 2025
- LAM RESEARCH CORPORATION
- Son Vo Nam TRAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE
- Publication number 20250031433
- Publication date Jan 23, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Shouguo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...
- Publication number 20250031393
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20250024758
- Publication date Jan 16, 2025
- 1372934 B.C. Ltd.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Application
Substrate Processing Apparatus, Substrate Processing Method, Method...
- Publication number 20250011930
- Publication date Jan 9, 2025
- Kokusai Electric Corporation
- Kentaro GOSHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250003067
- Publication date Jan 2, 2025
- Soulbrain Co., LTD
- Jae Sun JUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Metal Gapfill
- Publication number 20240395614
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP RING AND METHOD OF USING CLAMP RING
- Publication number 20240387233
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Deposition Process
- Publication number 20240387155
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...
- Publication number 20240387190
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guangyan Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structure of Semiconductor Device and Method of Forming Same
- Publication number 20240379812
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS

by physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact resistance reduction in transistor devices with metallizati...

Systems and methods for homogenous intermixing of precursors in all...

Power control for rf impedance matching network

Gate structures for semiconductor devices

Ultraviolet radiation activated atomic layer deposition

Semiconductor tool for copper deposition

Void-free contact trench fill in gate-all-around FET architecture

Semiconductor package having composite seed-barrier layer and metho...

Method and apparatus of low temperature plasma enhanced chemical va...

Structure and formation method of semiconductor device with carbon-...

Display device, method of manufacturing display device, and electro...

Method for producing nitride semiconductor photoelectrode

Dual metal wrap-around contacts for semiconductor devices

Resonant filter for solid state RF impedance matching network

Conformal and smooth titanium nitride layers and methods of forming...

Method of forming a barrier layer in an interconnect structure of s...

Field stop IGBT with grown injection region

Titanium aluminum and tantalum aluminum thin films

Digital pen with enhanced educational and therapeutic feedback

Haloalkynyl dicobalt hexacarbonyl precursors for chemical vapor dep...

Method of forming vanadium nitride layer and structure including th...

Semiconductor device and manufacturing method thereof

Methods of fabricating semiconductor devices

Deposition system and method

Semiconductor device and method for manufacturing the semiconductor...

Conditioning treatment for ALD productivity

Low resistivity tungsten film and method of manufacture

Film deposition method and element including film deposited by the...

PVD target design and semiconductor devices formed using the same

Formation and in-situ etching processes for metal layers

Patents Applicationslast 30 patents

CAPACITOR ELECTRODE FORMING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME

TITANIUM ALUMINUM AND TANTALUM ALUMINUM THIN FILMS

DIGITAL PEN WITH ENHANCED EDUCATIONAL AND THERAPEUTIC FEEDBACK

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films

METHOD AND APPARATUSES FOR TEMPERATURE INDEXED ALD

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

ARTICLES COATED WITH CRACK-RESISTANT FLUORO-ANNEALED FILMS AND METH...

PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME

METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY

DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRO...

TERMINAL STRUCTURE WITH OPTIMIZED RELIABILITY FOR POWER DEVICE, PRE...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS

FEATURE FILL WITH NUCLEATION INHIBITION

METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE

DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

Substrate Processing Apparatus, Substrate Processing Method, Method...

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

Method for Metal Gapfill

CLAMP RING AND METHOD OF USING CLAMP RING

Method for Improving Deposition Process

FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK AP...

Method of Forming Semiconductor Device

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

Gate Structure of Semiconductor Device and Method of Forming Same