Patent Application
20090213017
This application is one of the six related co-pending U.S. patent applications listed below. All listed applications have the same assignee and were concurrently filed herewith. The disclosure of each of the listed applications is incorporated by reference into all the other listed applications.
1. Field of the Disclosure
The present disclosure relates to wireless communication devices, and particularly to a device housing having a conductive track for sending and receiving electromagnetic waves.
2. Description of Related Art
The present disclosure relates to wireless communication devices, and particularly to a device housing having a conductive track for sending and receiving electromagnetic waves.
The antennas incorporated in the housings are usually copper or silver sheets formed in a patterned conductive track. A frequent method of manufacturing such housings includes attaching a patterned copper or silver sheet to a laminate using adhesive, in which the laminate may be a plastic film used in an insert molding process. The laminate is mounted into an injection mold, and a melted resin is injected into the injection mold and molded thereon to form a molded housing. The resulting patterned copper or silver sheet can function as an antenna when the molded housing is used in a mobile communication device. However, the patterned copper or silver sheet typically has a thickness exceeding 0.3 millimeters (mm), increasing the thickness and size of the molded housing.
Therefore, there is room for improvement within the art.
Many aspects of the housing for a wireless communication device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the molded article. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views.
Referring to
The main body 11 includes a printed circuit board 111 installed therein. The printed circuit board 111 has a flexible conductive pole 112 configured for sending and/or receiving electromagnetic waves.
The housing 13 includes a substrate 131, an antenna pattern 133 formed on the substrate 131, and a protective coating 134 covering the antenna pattern 133.
The substrate 131 may be acrylonitrile-butadiene-styrene, polycarbonate, or a mixture of acrylonitrile-butadiene-styrene and polycarbonate. Further, the substrate 131 can alternatively be silic gel or glass.
The antenna pattern 133 is an electrically conductive coating of conductive ink. The conductive ink may have at least one of gold powder, silver powder, copper powder, carbon powder, graphite powder or any combination thereof therein. In this embodiment the antenna pattern 133 is generally C-shaped, but may be shaped differently in other embodiments according to need, via a printing process in which the conductive ink is applied onto the substrate 131. A thickness of the antenna pattern 133 is from 0.002 mm to 0.015 mm.
The protective coating 134 may be a protective ink coating having good adhesion to plastic. The protective coating 134 has a thickness in an approximate range from 0.002 mm to 0.015 mm and protects the antenna pattern 133 from abrasion and oxidation.
The housing 13 is integrally mounted on the main body 11. The protective coating 134 is defined at a side of the substrate 131 facing the printed circuit board 111. The conductive pole 112 of the printed circuit board 111 is near the antenna circuit pattern 133. The gap between the conductive pole 112 and the antenna circuit pattern 133 is less than 0.5 mm.
During the disclosed method of manufacturing the housing 13, a substrate of plastic, silica gel, or glass is provided. One surface of the substrate is then plasma activated in a plasma of nitrogen gas, oxygen gas, or hydrogen gas. The activated surface of the substrate is coated with a conductive ink via a printing process to form the antenna pattern 133. A protective coating is then applied onto the surface of the substrate and coated with conductive ink to cover the antenna pattern 133. As such, the housing 13 with an antenna integrated therein is obtained.
The antenna circuit pattern 133 obtained by the disclosed process may be thinner than a currently used metal sheet antenna, thereby benefiting the reduction in profile and size of the wireless communication device 10, and provides a simplified manufacturing process as well.
It should be also understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200810300401.3 | Feb 2008 | CN | national |
