This is a continuation-in-part (CIP) of U.S. patent application Ser. No. 09/617,815 filed Jul. 17, 2000 now pending, which is a CIP of U.S. patent application Ser. No. 09/303,548, filed May 3, 1999 now allowed, a continuation-in-part (CIP) of U.S. patent application Ser. No. 09/442,805, filed Nov. 18, 1999 now pending, and a continuation-in-part (CIP) of U.S. patent application Ser. No. 09/583,862 filed Jun. 1, 2000 now pending, entitled “Hydrophobic Coating Including DLC on Substrate”, the disclosures of which are all hereby incorporated herein by reference.
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Number | Date | Country | |
---|---|---|---|
Parent | 09/617815 | Jul 2000 | US |
Child | 09/627441 | US | |
Parent | 09/303548 | May 1999 | US |
Child | 09/617815 | US | |
Parent | 09/442805 | Nov 1999 | US |
Child | 09/303548 | US | |
Parent | 09/583862 | Jun 2000 | US |
Child | 09/442805 | US |