Patent Application
20060008939
1. Field of the invention
The invention relates to an image sensor package, and in particular to an image sensor is capable of increasing the reliability of the product.
2. Description of the Related Art
Referring to
The substrate 10 has a first surface 12 on which a plurality of first electrodes 15 are formed, and a second surface 14 on which a plurality of second electrodes 16 are formed. The first electrodes 15 are corresponding to electrically connect to the second electrodes 16 by the conductive wires 17, which are located at the side of the substrate. The frame layer 18 has an upper surface 20 and a lower surface 22 adhered to the first surface 12 of the substrate 10 to form a chamber 24 together with the substrate 10. The photosensitive chip 26 is arranged within the chamber 24, and is mounted to the first surface 12 of the substrate 10. Each wire 28 has a first terminal 30 and a second terminal 32. The first terminals 30 are electrically connected to the photosensitive chip 26, and the second terminals 32 are electrically connected to the first electrodes 15 of the substrate 10. The transparent layer 34 is adhered to the upper surface 20 of the frame layer 18.
Referring to
An object of the invention is to provide an image sensor package, it can prevent the wet-air from the atmosphere air to inter the internal of the product. So as to, may be enhanced the reliability of the product
To achieve the above-mentioned object, the invention provides a substrate, a frame layer, a photosensitive chip, wires and transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, wherein the each first electrode is curved. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is arranged within the cavity and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrode of the substrate. The transparent layer is covered over the frame layer to cover the photosensitive chip.
Please refer to
The substrate 40 has an upper surface 50 on which first electrodes 54 are formed, and a lower surface 52 on which second electrodes 56 are formed. The first electrodes 54 are corresponding to electrically connect to the second electrode 56, wherein the each first electrode 54 is curved, in the embodiment, the each first electrode 54 is S-shape. A green-paint 58 is coated between the each first electrode 54 of the substrate 40.
The frame layer 42 is arranged on the upper surface 50 of the substrate 40 to form a cavity 62 together with the substrate 40.
The photosensitive chip 44 is arranged within the cavity 62 and is mounted on the upper surface 50 of the substrate 40.
The plurality of wires 46 are electrically connected the photosensitive chip 44 to the first electrode 54 of the substrate 40.
The transparent layer 48 is covered over the frame layer 42 to cover the photosensitive chip 44.
Therefore, the first electrodes man prevent the wet-air to enter the internal of the product, thus, the reliability of the product may be enhanced.
While the invention has been described by way of an example and in terms of a preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
