Claims
- 1. An image head assembly comprising:
- a printed circuit substrate with at least a pair of apertures formed in the substrate;
- a cover glass assembly having at least a pair of pins that mate with the apertures within the printed substrate, the pins to the cover glass assembly being fixedly secured to the apertures within the printed circuit substrate;
- an image sensor located on the printed circuit substrate between the apertures and covered by a cover glass on the cover glass assembly and above the image sensor;
- interface means for providing an electrical connection between the substrate and the image sensor.
- 2. The assembly of claim 1 further comprising a lens system mounted on top the cover glass.
- 3. The assembly of claim 2 further comprising a single element blur filter contained within the lens system.
- 4. The assembly of claims 1 wherein the optics assembly further comprises a housing containing the pins with a cover glass contained on the housing.
- 5. The assembly of claim 1 wherein the optics assembly comprises a housing containing the pins with an integral lens element contained on the housing.
- 6. The assembly of claims 1 wherein the optical assembly further comprises a housing containing the pins with an IR filter contained on the housing.
- 7. The assembly of claim 1 where the optical assembly further comprises a housing containing a shelf to align cover glasses and IR filters.
- 8. The assembly of claim 1 where the blur filter is a cross-pleated blur filter.
CROSS-REFERENCE TO RELATED APPLICATIONS
The present application is related to U.S. application Ser. No. 08/876634 (Kodak Docket No. 75814), filed Jun. 16, 1997, by Peter Zepetella et al., and entitled, "Circuit Board Standoff", U.S. application Ser. No. 08/876,456 (Kodak Docket No. 75819), filed Jun. 16, 1997 by Bryan Beaman, et al., and entitled "Integrated Imaging Head.", U.S. application Ser. No. 08/876,453 (Kodak Docket No. 75821), filed Jun. 16, 1997, by Dean Johnson and entitled, "Packaging of Imaging Devices Assembly," and U.S. application Ser. No. 08/876,376 (Kodak Docket No. 75822), filed Jun. 16, 1997 by Dean Johnson et al., and entitled "CCD Attachment Module."
US Referenced Citations (11)