1. Technical Field
The present invention relates to imaging technology and, particularly, to an imaging module package integrated with multiple functional units and having a compact configuration.
2. Description of Related Art
Many electronic devices, such as mobile phones, notebooks, or personal digital assistants etc, are integrated with imaging module packages. An imaging module package generally comprises a substrate, an imaging sensor chip mounted to the substrate, a lens module, and a housing mounted to the substrate for housing the imaging sensor chip and the lens module. It is well-known that the imaging module package must be coupled to functional units, such as processing units, controlling units, or memory units etc, which can process or store images. Thus, the electronic device must be equipped with the imaging module package as well as these units for supporting an imaging function thereof.
What is needed, therefore, is an imaging module package integrated with multiple functions and having a compact configuration.
In accordance with a present embodiment, an imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.
Other advantages and novel features will be drawn from the following detailed description of at least one preferred embodiment, when considered in conjunction with the attached drawings.
Many aspects of the present imaging module package can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present imaging module package. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Embodiments of the present imaging module package will now be described in detail below and with reference to the drawings.
Referring to
The substrate 110 comprises a bottom surface 112 and a top surface 114 opposite to the bottom surface 112. The substrate 110 defines a lower chamber 116 extending through the bottom surface 112, and an upper chamber 118 extending through the top surface 114. The lower and upper chambers 116, 118 are communicated and coaxially aligned with each other, and are differently dimensioned. In the embodiment, the upper chamber 118 is larger than the lower chamber 116. The substrate 110 comprises a plurality of soldering pads 119 on the top surface 114.
The imaging sensor chip 130 is mechanically positioned in the upper chamber 118 of the substrate 110 by an adhesive 131. The imaging sensor chip 130 comprises a sensing area 132, and a plurality of soldering pads 134 around the sensing area 132. A plurality of bonding wires 136 connects the soldering pads 134 on the imaging sensor chip 130 to the soldering pads 119 on the substrate 110, respectively, to electrically connect the imaging sensor chip 130 to the substrate 110. A transparent plate 140 is adhered to the imaging sensor chip 130 by an adhesive 142. The adhesive 142 and the transparent plate 140 enclose the sensing area 132 of the imaging sensor chip 130. In the embodiment, the adhesive 142 covers the soldering pads 134 on the imaging sensor chip 130.
The housing 170 with the lens module 150 is mounted on the top surface 114 of the substrate 110 and disposed above the imaging sensor chip 130.
The functional unit 190 is mechanically positioned in the lower chamber 116 of the substrate 110 by an adhesive 191, and electrically connected to the substrate 110 by bonding wires 196. A bottom surface of the functional unit 190 is coplanar with the bottom surface 112 of the substrate 110.
Referring to
The imaging module packages 100, 200 integrate the functional units 190, 260,290 in the substrates 110, 210, without enlarging volumes of the imaging module packages 100, 200. That is, the imaging module packages 100, 200 are multi-functional and compact.
It will be understood that the above particular embodiments and methods are shown and described by way of illustration only. The principles and features of the present invention may be employed in various and numerous embodiments thereof without departing from the scope of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.
Number | Date | Country | Kind |
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200710203169.7 | Dec 2007 | CN | national |