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G. T. Galyon et al., IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, "New TCM Design Using Bellows", p. 4759. |
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K. S. Sachar, IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, "Liquid Jet Cooling of Integrated Circuit Chips", pp. 3727-3728. |
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J. C. Eid et al., IBM Technical Disclosure Bulletin, vol. 29, No. 12, May 1987, "Circuit Module With Evaporative Cooling From Sintered Coating On Pistons", pp. 5195-5196. |
Edmund L. Andrews, Business Technology, "For Chips That Overheat: A Tiny Radiator" (New York Times, Wednesday, Sep. 20, 1989). |
M. E. Ecker, IBM Technical Disclosure Bulletin, vol. 10, No. 7, Dec. 1967, "Interface For Thermal Exchange Devices", p. 943. |