This application claims the priority benefit of Taiwan application serial no. 104144569, filed on Dec. 31, 2015. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
The invention relates to an integrating sphere cover and an integrating sphere module. More particularly, the invention relates to an integrating sphere cover and an integrating sphere module that allow the temperature of an integrating sphere not to easily increase.
With the progress of modern semiconductor science and technologies, light emitting diodes (LEDs) have been extensively used to provide light sources required by electronic apparatuses, such as traffic signs, large bulletin, scanners, liquid crystal displays, and so on.
After illumination light sources are completely manufactured and before they are dispatched from the factory, light intensity of the illumination light sources are often inspected through measurement instruments, so as to determine whether the illumination light sources are in normal operation. As to the measurement of the optical illumination devices, e.g., the LED, luminous flux and chromaticity are two crucial optical parameters. The luminous flux is relevant to the illumination area and is thus conventionally measured with use of an integrating sphere. The integrating sphere collects light entering the sphere and creates reflection effects within the sphere, so as to uniformize the light. The light intensity, e.g., the luminous flux, can be measured through a light detector arranged on the integrating sphere. In general, the integrating sphere is located close to the LED to increase the light collection rate.
However, during the optical inspection, the LED is often heated by a heating module, so as to perform a heat test. The neighboring integrating sphere is thus being heated together with the LED. The inner surface of the integrating sphere may be coated with barium sulfate or any other coating layer. Hence, when the integrating sphere is being heated, the coating layer may undergo chemical changes due to the heat, which may further affect the performance of the integrating sphere.
The invention is directed to an integrating sphere cover that allows the temperature of an integrating sphere covered by the integrating sphere cover not to easily increase.
The invention is also directed to an integrating sphere module having said integrating sphere cover.
In an embodiment of the invention, an integrating sphere cover is adapted to cover at least one portion of an integrating sphere, and the integrating sphere includes a light receiving entrance. The integrating sphere cover includes a first casing and a fixing assembly. The first casing is adapted to partially cover the integrating sphere and includes a first opening, the light receiving entrance passes through the first opening, and a curvature radius of the first casing is greater than a curvature radius of the integrating sphere. The fixing assembly is disposed at the first casing, and the first casing is adapted to be fixed to the integrating sphere through the fixing assembly. The first casing or the fixing assembly includes a nozzle. When the first casing covers the integrating sphere, a first interval communicating with the first opening and the nozzle is between the first casing and the integrating sphere, so as to form a first hollow intermediate layer between the first casing and the integrating sphere, and an air flow passes through the first hollow intermediate layer via the nozzle and the first opening.
According to an embodiment of the invention, the fixing assembly includes a holder and a plurality of locking members locking the first casing to the holder, and the integrating sphere is adapted to be fixed to the holder.
According to an embodiment of the invention, the first casing is a heat insulating member and a material of the heat insulating member includes plastic, plastic steel, or backlite, or the first casing is a heat conductor and a material of the heat conductor includes metal.
According to an embodiment of the invention, a color code of an outer surface of the first casing is a combination of color codes greater than R60, G20, and B30.
According to an embodiment of the invention, the integrating sphere cover further includes a second casing adapted to partially cover the integrating sphere, and the second casing includes a second opening. The integrating sphere includes a light exit passing through the second opening, and a curvature radius of the second casing is greater than the curvature radius of the integrating sphere. The fixing assembly is disposed at the second casing, and the second casing is adapted to be fixed to the integrating sphere through the fixing assembly. When the second casing covers other portions of the integrating sphere, a second interval communicating with the second opening is between the second casing and the integrating sphere, so as to form a second hollow intermediate layer between the second casing and the integrating sphere. The first hollow intermediate layer communicates with the second hollow intermediate layer. The air flow passes through the first hollow intermediate layer and the second hollow intermediate layer via the nozzle, the first opening, and the second opening.
In an embodiment of the invention, an integrating sphere module includes an integrating sphere and an integrating sphere cover. The integrating sphere includes a light receiving entrance. The integrating sphere cover covers at least one portion of the integrating sphere and includes a first casing and a fixing assembly. The first casing partially covers the integrating sphere and includes a first opening. The light receiving entrance passes through the first opening, and a curvature radius of the first casing is greater than a curvature radius of the integrating sphere. The fixing assembly fixes relative positions of the first casing and the integrating sphere. The first casing or the fixing assembly includes a nozzle. A first interval communicating with the first opening and the nozzle is between the first casing and the integrating sphere, so as to form a first hollow intermediate layer between the first casing and the integrating sphere, and an air flow passes through the first hollow intermediate layer via the nozzle and the first opening.
According to an embodiment of the invention, the fixing assembly includes a holder and a plurality of locking members locking the first casing to the holder, and the integrating sphere is adapted to be fixed to the holder.
According to an embodiment of the invention, the first casing is a heat insulating member and a material of the heat insulating member includes plastic, plastic steel, or backlite, or the first casing is a heat conductor and a material of the heat conductor includes metal.
According to an embodiment of the invention, a color code of an outer surface of the first casing is a combination of color codes greater than R60, G20, and B30.
According to an embodiment of the invention, the integrating sphere cover further includes a second casing. The second casing partially covers the integrating sphere and includes a second opening. The integrating sphere includes a light exit that passes through the second opening. A curvature radius of the second casing is greater than the curvature radius of the integrating sphere. The fixing assembly fixes relative positions of the second casing and the integrating sphere. When the second casing covers other portions of the integrating sphere, a second interval communicating with the second opening is between the second casing and the integrating sphere, so as to form a second hollow intermediate layer between the second casing and the integrating sphere. The first hollow intermediate layer communicates with the second hollow intermediate layer. The air flow passes through the first hollow intermediate layer and the second hollow intermediate layer via the nozzle, the first opening, and the second opening.
As provided above, in the integrating sphere module provided herein, the integrating sphere cover is arranged to cover at least one portion of the integrating sphere. The curvature radius of the first casing is greater than the curvature radius of the integrating sphere. When the first casing covers the integrating sphere, the first hollow intermediate layer is sandwiched between the first casing and the integrating sphere. Since the first hollow intermediate layer communicates with the nozzle and the first opening, the air flow is able to pass through the first hollow intermediate layer via the nozzle and the first opening. As such, when a heating module heats the LED to perfolin the heat inspection, the first casing located between the heating module and the integrating sphere can control the air flow to flow within the first hollow intermediate layer, so as to effectively reduce the possibility of transferring the heat to the integrating sphere. Thereby, the temperature of the integrating sphere can stay low.
To make the above features and advantages of the invention more comprehensible, several embodiments accompanied with drawings are described in detail as follows.
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
Besides, the test system also conducts the heat test on the LEDs. In the present embodiment, the heating module 8 is located below the wafer 6, so as to heat the LEDs of the wafer 6 and perform the heat test. As shown in
The first casing 110 is a hollow semi-sphere and covers a lower portion of the integrating sphere 12. The first casing 110 includes a first opening 112, and the light receiving entrance 14 passes through the first opening 112. A curvature radius of the first casing 110 is greater than a curvature radius of the integrating sphere 12; hence, when the first casing 110 covers the integrating sphere 12, a first interval 114 is between the first casing 110 and the integrating sphere 12. The first interval 114 allows the formation of a first hollow intermediate layer 116 between the first casing 110 and the integrating sphere 12. A nozzle 130 is located at the first casing 110. The first hollow intermediate layer 116 communicates with the first opening 112 and the nozzle 130, as shown in
In the present embodiment, the first casing 110 may be a heat insulating member, and a material of the heat insulating member includes plastic, plastic steel, or backlite. Note that the type of the material of the heat insulating member is not limited herein. When the heating module 8 starts to heat the LEDs of the wafer 6, the first casing 110 of the integrating sphere cover 100 between the integrating sphere 12 and the heating module 8 insulates some heat, and thus only the remaining heat can be transferred toward the integrating sphere 12. In addition, due to the first hollow intermediate layer 116 between the first casing 110 and the integrating sphere 12, it is possible to generate a negative or positive pressure through performing an air pumping or filling process at the first opening 112 or the nozzle 130, such that an air flow can be generated in the air channel constituted by the first opening 112, the first hollow intermediate layer 116, and the nozzle 130. The air flow passing through the first hollow intermediate layer 116 can remove some heat. Hence, the remaining heat transferred to the integrating sphere 12 is insignificant. Thereby, the temperature of the integrating sphere 12 can stay low and is not affected by the heating module 8.
Certainly, in other embodiments, the first casing 110 may also be a heat conductor, and a material of the heat conductor includes metal, e.g., aluminum or copper. In this case, the heat is conducted to the first casing 110, and it is possible to expedite the speed of the air flow within the first hollow intermediate layer 116, so as to rapidly remove the heat. As a result, the temperature of the integrating sphere 12 can stay low. Besides, in other embodiments of the invention, the outer surface of the first casing 110 may be further equipped with a heat dissipation fin (not shown), so as to enhance the heat dissipating efficiency of the first casing 110. It should be mentioned that the direction of the air flow shown in
To ensure the light received by the integrating sphere 12 is the light directly emitted by the LEDs, the chromaticity of the first casing 110 is less than 50% according to the present embodiment, such that the outer surface of the first casing 110 is dark, e.g., black, so as to reduce the possibility of light reflection. Specifically, in the present embodiment, a color code of the outer surface of the first casing 110 is a combination of color codes greater than R60, G20, and B30.
Besides, the relative positions of the first casing 110 and the integrating sphere 12 are fixed by the fixing assembly 120 in the present embodiment. Here, the fixing assembly 120 includes a holder 122 and a plurality of locking members 124. The holder 122 may be the original holder of the integrating sphere 12 or any other additional holder. The locking members 124 lock the first casing 110 to the holder 122, and the integrating sphere 12 is fixed to the holder 122, so as to fix the first casing 110 to the integrating sphere 12.
With reference to
According to the present embodiment, a curvature radius of the second casing 140 is greater than the curvature radius of the integrating sphere 12. Thereby, when the second casing 140 covers the other portion of the integrating sphere 12, a second interval 144 communicating with the second opening 142 is between the second casing 140 and the integrating sphere 12, so as to form a second hollow intermediate layer 146 between the second casing 140 and the integrating sphere 12. The second hollow intermediate layer 146 communicates with the first hollow intermediate layer 116. The air flow is adapted to pass through the first hollow intermediate layer 116 and the second hollow intermediate layer 146 via the nozzle 130, the first opening 112, and the second opening 142.
In the present embodiment, the curvature radius of the second casing 140 is the same as the curvature radius of the first casing 110; by contrast, in other embodiments of the invention, the curvature radius of the second casing 140 may be different from the curvature radius of the first casing 110. Alternatively, in other embodiments of the invention, the first casing 110 and the second casing 140 may have an irregular shape or may be shaped as hollow squares.
The second casing 140 provided herein may be a heat insulating member, and a material of the heat insulating member includes plastic, plastic steel, or backlite. Note that the type of the material of the heat insulating member is not limited herein In an alternative embodiment, the second casing 140 may be a heat conductor, and a material of the heat conductor includes metal, e.g., aluminum or copper.
When the heating module 8 starts to heat the LEDs of the wafer 6, the first casing 110 and the second casing 140 of the integrating sphere cover 100 between the integrating sphere 12 and the heating module 8 insulate some heat, and thus only the remaining heat can be transferred toward the integrating sphere 12. In addition, due to the first hollow intermediate layer 116 between the first casing 110 and the integrating sphere 12 and the second hollow intermediate layer 146 between the second casing 140 and the integrating sphere 12, it is possible to generate a negative or positive pressure through performing an air pumping or filling process at the first opening 112, the second opening 142, or the nozzle 130, such that an air flow can be generated in the air channel constituted by the first opening 112, the first hollow inteiiiiediate layer 116, the second opening 142, the second hollow intermediate layer 146, and the nozzle 130. The air flow passing through the first hollow intermediate layer 116 and the second hollow intermediate layer 146 can remove some heat, such that the temperature of the integrating sphere 12 can stay low.
To sum up, in the integrating sphere module provided herein, the integrating sphere cover is arranged to cover at least one portion of the integrating sphere. The curvature radius of the first casing is greater than the curvature radius of the integrating sphere. When the first casing covers the integrating sphere, the first hollow intermediate layer is sandwiched between the first casing and the integrating sphere. Since the first hollow intermediate layer communicates with the nozzle and the first opening, the air flow is able to pass through the first hollow intermediate layer via the nozzle and the first opening. As such, when a heating module heats the LED to perform the heat inspection, the first casing located between the heating module and the integrating sphere can control the air flow to flow within the first hollow intermediate layer, so as to effectively reduce the possibility of transferring the heat to the integrating sphere. Thereby, the temperature of the integrating sphere can stay low.
It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention covers modifications and variations of this disclosure provided that they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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104144569 | Dec 2015 | TW | national |