Surface mounted components

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CPC
H05K3/303

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/303Surface mounted components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connector mounting one or more cables to a printed circuit board
- Patent number 12,341,274
- Issue date Jun 24, 2025
- MD Elektronik GmbH
- Johannes Trae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element unit and method of manufacturing thereof, sem...
- Patent number 12,328,928
- Issue date Jun 10, 2025
- Oki Electric Industry Co., Ltd.
- Yuuki Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module having a shield film and method of manufacturing the same
- Patent number 12,295,129
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuits of substrate of display device
- Patent number 12,295,106
- Issue date May 6, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic coating of components
- Patent number 12,289,840
- Issue date Apr 29, 2025
- Heraeus Medevio GmbH & Co. KG
- Ulrich Hausch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with housed power semiconductors for controllable elec...
- Patent number 12,284,749
- Issue date Apr 22, 2025
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter insulator apparatus and method
- Patent number 12,273,044
- Issue date Apr 8, 2025
- Rivian IP Holdings, LLC
- Young Mok Doo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermal connection between printed circuit board and base plate wit...
- Patent number 12,266,874
- Issue date Apr 1, 2025
- Vitesco Technologies USA, LLC.
- Uwe Stephan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional patterned module exterior surface for improved he...
- Patent number 12,245,382
- Issue date Mar 4, 2025
- Qorvo US, Inc.
- Loizos Loizou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Circuit carrier for an electronic circuit, and method for producing...
- Patent number 12,230,432
- Issue date Feb 18, 2025
- Robert Bosch GmbH
- Felix Stewing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit system and method of manufacturing a printed circuit board
- Patent number 12,225,665
- Issue date Feb 11, 2025
- NVIDIA Corp.
- MingYi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-mounted heat sink and power module using same
- Patent number 12,225,694
- Issue date Feb 11, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Mingjuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin-fin cooling for printed circuit boards (PCBs)
- Patent number 12,213,240
- Issue date Jan 28, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board configured for waveguide coupling a diplexer...
- Patent number 12,206,150
- Issue date Jan 21, 2025
- Vubiq Networks, Inc.
- Michael Gregory Pettus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,176,615
- Issue date Dec 24, 2024
- Kore Semiconductor Co., Ltd.
- Ying-Chieh Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component and method for manufacturing a component
- Patent number 12,177,986
- Issue date Dec 24, 2024
- TDK ELECTRONICS AG
- Jan Ihle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,156,337
- Issue date Nov 26, 2024
- Dai Nippon Printing Co., Ltd.
- Seiji Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive assembly, camera module and manufacturing method the...
- Patent number 12,081,849
- Issue date Sep 3, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ceramic electronic component, circuit substrate arrangement, and me...
- Patent number 12,068,115
- Issue date Aug 20, 2024
- Taiyo Yuden Co., Ltd.
- Anju Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with embedded coil and position sensor
- Patent number 12,063,742
- Issue date Aug 13, 2024
- Apple Inc.
- Sai Harsha Jandhyala
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging design for a flow sensor and methods of manufacturing the...
- Patent number 12,061,103
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hybrid transformers for power supplies
- Patent number 12,057,255
- Issue date Aug 6, 2024
- Acleap Power Inc.
- Arturo Silva
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...
- Publication number 20250220814
- Publication date Jul 3, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203751
- Publication date Jun 19, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PACKAGING ARRANGEMENT FOR A QUANTUM PROCESSOR
- Publication number 20250194015
- Publication date Jun 12, 2025
- SCALINQ AB
- Robert REHAMMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...
- Publication number 20250168990
- Publication date May 22, 2025
- GRUPO ANTOLIN-INGENIERIA, S.A.
- Marta Castillo Garcia
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method For Manufacturing Electronic Device
- Publication number 20250155466
- Publication date May 15, 2025
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- G01 - MEASURING TESTING
Information Patent Application
PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...
- Publication number 20250151251
- Publication date May 8, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD
- Publication number 20250142714
- Publication date May 1, 2025
- Dell Products L.P.
- Changsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD, AND ELECTRICAL CIRCUIT FORMATI...
- Publication number 20250142734
- Publication date May 1, 2025
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY HAVING CIRCUIT BOARD WITH ADJACENT CHIPS IMM...
- Publication number 20250125246
- Publication date Apr 17, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126715
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hak KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILTER COMPONENT AND METHOD FOR PRODUCING A FILTER COMPONENT
- Publication number 20250081352
- Publication date Mar 6, 2025
- TDK Electronics AG
- Karl Niklas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS
- Publication number 20250048543
- Publication date Feb 6, 2025
- Hewlett-Packard Development Company, L.P.
- Gabriel Scott MCDANIEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CORRECTING OVEN TECHNOLOGY
- Publication number 20250033131
- Publication date Jan 30, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR
- Publication number 20250040057
- Publication date Jan 30, 2025
- BAUMUELLER NUERNBERG GMBH
- Johannes PIRLING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD
- Publication number 20250029887
- Publication date Jan 23, 2025
- Vitesco Technologies GMBH
- Andreas Mühlbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Poling of Electro-Optic Phase Modulators
- Publication number 20250028195
- Publication date Jan 23, 2025
- Lightwave Logic, Inc.
- Jasper Altman Drisko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Wearable Battery and System
- Publication number 20250016924
- Publication date Jan 9, 2025
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20250016928
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Seiji TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...
- Publication number 20240369389
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID TRANSFORMERS FOR POWER SUPPLIES
- Publication number 20240355534
- Publication date Oct 24, 2024
- AcLeap Power Inc.
- Arturo Silva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Surface mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector mounting one or more cables to a printed circuit board

Compact thin film surface mountable coupler having wide-band perfor...

Semiconductor element unit and method of manufacturing thereof, sem...

Electronic device

Circuit board with convex shaped post, light emitting device, and m...

Module having a shield film and method of manufacturing the same

Method of producing circuits of substrate of display device

Hermetic coating of components

Power module with housed power semiconductors for controllable elec...

Inverter insulator apparatus and method

Thermal connection between printed circuit board and base plate wit...

Three-dimensional patterned module exterior surface for improved he...

Flexible pressure sensors and user interfaces

Circuit carrier for an electronic circuit, and method for producing...

Interlaced crosstalk controlled traces, vias, and capacitors

Circuit system and method of manufacturing a printed circuit board

Surface-mounted heat sink and power module using same

Pin-fin cooling for printed circuit boards (PCBs)

Printed circuit board configured for waveguide coupling a diplexer...

Electronic device and manufacturing method thereof

High frequency and high power thin film component

Component and method for manufacturing a component

Electronic assembly and method for thermal balancing of surfacemoun...

Wiring board and method for manufacturing wiring board

Conformal wearable battery and system

Photosensitive assembly, camera module and manufacturing method the...

Ceramic electronic component, circuit substrate arrangement, and me...

Printed circuit board with embedded coil and position sensor

Packaging design for a flow sensor and methods of manufacturing the...

Hybrid transformers for power supplies

Patents Applicationslast 30 patents

MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

A PACKAGING ARRANGEMENT FOR A QUANTUM PROCESSOR

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...

Method For Manufacturing Electronic Device

PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...

MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD

ELECTRICAL CIRCUIT FORMATION METHOD, AND ELECTRICAL CIRCUIT FORMATI...

CIRCUIT BOARD ASSEMBLY HAVING CIRCUIT BOARD WITH ADJACENT CHIPS IMM...

PRINTED CIRCUIT BOARD

FILTER COMPONENT AND METHOD FOR PRODUCING A FILTER COMPONENT

BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS

SELF CORRECTING OVEN TECHNOLOGY

METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR

CIRCUIT BOARD ASSEMBLY AND METHOD

Wafer-Level Poling of Electro-Optic Phase Modulators

Conformal Wearable Battery and System

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

HIGH SPEED, EFFICIENT SIC POWER MODULE

PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

HYBRID TRANSFORMERS FOR POWER SUPPLIES

PRINTING COMPONENTS TO SUBSTRATE POSTS

REFLOW FURNACE

BGA Element Self-Alignment Structure and Alignment Method