This application is a division of application Ser. No. 08/332,328 filed on Oct. 31, 1994 now U.S. Pat. No. 5,565,707.
Number | Name | Date | Kind |
---|---|---|---|
4307179 | Chang et al. | Dec 1981 | |
4335506 | Chiu et al. | Jun 1982 | |
4884123 | Dixit et al. | Nov 1989 | |
5010039 | Ku et al. | Apr 1991 | |
5071714 | Rodbell et al. | Dec 1991 | |
5110759 | Ryoichi Mukai | May 1992 | |
5130274 | Harper et al. | Jul 1992 | |
5171642 | DeHaven et al. | Dec 1992 | |
5243221 | Ryan et al. | Sep 1993 | |
5300307 | Frear et al. | Apr 1994 | |
5455195 | Ramsey et al. | Oct 1995 | |
5565707 | Colgan et al. | Oct 1996 |
Number | Date | Country |
---|---|---|
A-0 045 405 | Jul 1981 | EPX |
A-0 395 560 | Mar 1990 | EPX |
A-2 143 709 | Jun 1972 | FRX |
A-04 111317 | Apr 1992 | JPX |
Entry |
---|
B. Luther et al., Proc. IEEE, VLSI Multilevel Interconnections Conf., Santa Clara, CA, Jun. 8-9, 1993, pp. 15-21. |
Anonymous, "L1 and V1 Stud Metal Rework Procedure", Research Disclosure 31758; Sep. 1990. |
J. Havas et al., "Self-Aligning Metal Land and Feed-Through Structure", IBM TDB, vol. 27, No. 7B, Dec. 1984, pp. 4159-4160. |
A. Nagy et al., "Planarized Inorganic Interlevel Dielectric for Multilevel Metallization -Part I", Solid State Technology, vol. 34, No. 1, pp. 53-56, Jan. 1991. |
Number | Date | Country | |
---|---|---|---|
Parent | 332328 | Oct 1994 |