Via connections in a multilevel interconnection structure

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H01L23/5226

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5226Via connections in a multilevel interconnection structure

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system including the same
- Patent number 12,368,099
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-substrate composite semiconductor device
- Patent number 12,368,052
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including interconnect structures including dielectric...
- Patent number 12,368,101
- Issue date Jul 22, 2025
- Battelle Energy Alliance, LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and semiconductor memory device with the same
- Patent number 12,369,306
- Issue date Jul 22, 2025
- SK Hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having air gap and method for manufacturing th...
- Patent number 12,368,073
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,369,292
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing dual-depth drain-select-...
- Patent number 12,369,319
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Akihiro Tobioka
- G11 - INFORMATION STORAGE
Information Patent Grant
IGBT chip integrating temperature sensor
- Patent number 12,368,082
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,368,094
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous filling of variable aspect ratio single damascene cont...
- Patent number 12,368,095
- Issue date Jul 22, 2025
- Intel Corporation
- AKM Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor devices with shared electrode and methods of fabrication
- Patent number 12,369,326
- Issue date Jul 22, 2025
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled dielectric on metal rie lines to increase reliability
- Patent number 12,362,231
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled 2T DRAM
- Patent number 12,362,004
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,363,899
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Yonghoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
- Patent number 12,364,019
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving profile of interconnect structure
- Patent number 12,362,227
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure including a plurality of an...
- Patent number 12,362,275
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE
- Publication number 20250240965
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250241002
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Doohyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS
- Publication number 20250241052
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250241057
- Publication date Jul 24, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
- Publication number 20250239520
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239525
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Se Ra HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING
- Publication number 20250240966
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250241012
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Sang Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
- Publication number 20250239485
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...
- Publication number 20250239305
- Publication date Jul 24, 2025
- SANDISK TECHNOLOGIES LLC
- Akira TAKAHASHI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...
- Publication number 20250239524
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jianfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250239304
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huai-Ying HUANG
- G11 - INFORMATION STORAGE
Information Patent Application
CROSS-POINT MEMORY CELL AND METHOD
- Publication number 20250240976
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen WU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233016
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JHENG-HONG JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
- Publication number 20250233020
- Publication date Jul 17, 2025
- Intel Corporation
- Abhijit Jayant PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...
- Publication number 20250234553
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- G11 - INFORMATION STORAGE
Information Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
- Publication number 20250233018
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPACKAGING IC CHIP FOR FAULT IDENTIFICATION
- Publication number 20250231233
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ALIGNMENT MARK STRUCTURE
- Publication number 20250233078
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233113
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENTIONAL SEMICONDUCTOR DEVICE
- Publication number 20250233065
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20250233068
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
- Publication number 20250233074
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...
- Publication number 20250234593
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20250232796
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Nam Jae LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250233026
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250233035
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyeong Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Via connections in a multilevel interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Microelectronic devices with through-substrate interconnects and as...

Semiconductor device and electronic system including the same

Chip-substrate composite semiconductor device

Methods of forming semiconductor device

Apparatuses including interconnect structures including dielectric...

Memory cell and semiconductor memory device with the same

Semiconductor device having air gap and method for manufacturing th...

Hybrid integrated circuit packages

Memory device

Three-dimensional memory device containing dual-depth drain-select-...

IGBT chip integrating temperature sensor

Semiconductor structures and methods of forming the same

Simultaneous filling of variable aspect ratio single damascene cont...

Contact structures for reducing electrical shorts and methods of fo...

Capacitor devices with shared electrode and methods of fabrication

Fan out package with integrated peripheral devices and methods

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor structure and manufacturing method thereof

Self-assembled dielectric on metal rie lines to increase reliability

Scaled 2T DRAM

Semiconductor device structures

MIM structure

Conductive structures and methods of fabrication thereof

Package structure and method of forming the same

Semiconductor devices and data storage systems including the same

Deep trench capacitor fuse structure for high voltage breakdown def...

Method for improving profile of interconnect structure

Contact structure for semiconductor device

Method of fabricating package structure including a plurality of an...

Patents Applicationslast 30 patents

MEMORY DEVICE

SEMICONDUCTOR DEVICE

METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SELF-ALIGNED CONTACTS

INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING

SEMICONDUCTOR DEVICE

MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS

THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...

MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE

CROSS-POINT MEMORY CELL AND METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME

METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...

CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE

REPACKAGING IC CHIP FOR FAULT IDENTIFICATION

MULTI-LAYER ALIGNMENT MARK STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

THREE-DIMENTIONAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...

METHODS FOR SELECTIVE METAL CAP FORMATION

SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...