Via connections in a multilevel interconnection structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5226Via connections in a multilevel interconnection structure

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell design architecture for reduced voltage droop utilizi...
- Patent number 12,205,897
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,205,941
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device with wrap-around top electrode
- Patent number 12,207,561
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit structure, semiconductor device and method of manufacturing...
- Patent number 12,205,890
- Issue date Jan 21, 2025
- Macronix International Co., Ltd.
- Li-Yen Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 12,207,469
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,207,471
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Hae-min Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming microelectronic devices, and related electronic...
- Patent number 12,205,846
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Regina Tien Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid method for forming semiconductor interconnect structure
- Patent number 12,205,886
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal cell semiconductor device and method
- Patent number 12,205,898
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory structure fabrication using channel replac...
- Patent number 12,205,645
- Issue date Jan 21, 2025
- SUNRISE MEMORY CORPORATION
- Shohei Kamisaka
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via rail structure
- Patent number 12,199,034
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao Kuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having interconnection lines with different li...
- Patent number 12,199,042
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,016
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, circuit and electronic apparatus includi...
- Patent number 12,199,031
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...
- Publication number 20250029924
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250029870
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Feng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS
- Publication number 20250029894
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250029906
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyounglim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR INTEGRATED CIRCUIT
- Publication number 20250029931
- Publication date Jan 23, 2025
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20250031378
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF PREVENTING CHARGING DAMAGE TH...
- Publication number 20250031458
- Publication date Jan 23, 2025
- UNITED MICROELECTRONICS CORP.
- Ming-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTERCONNECT VIA
- Publication number 20250029872
- Publication date Jan 23, 2025
- IMEC vzw
- Anshul Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES
- Publication number 20250029917
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250029956
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Yasunori IWASHITA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HORIZONTAL SEMICONDUCTOR...
- Publication number 20250024672
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- G11 - INFORMATION STORAGE
Information Patent Application
SEAL RING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250022825
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...
- Publication number 20250022878
- Publication date Jan 16, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022794
- Publication date Jan 16, 2025
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024681
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20250024657
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP OR WAFER STACK
- Publication number 20250022800
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...
- Publication number 20250022798
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- HAKSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...
- Publication number 20250022875
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sunjung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022930
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sunjung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20250014990
- Publication date Jan 9, 2025
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS
- Publication number 20250015024
- Publication date Jan 9, 2025
- RF360 Singapore Pte. Ltd.
- Poh Hoong YONG
- H01 - BASIC ELECTRIC ELEMENTS

Via connections in a multilevel interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods of forming the same

Standard cell design architecture for reduced voltage droop utilizi...

Wafer-level design and wiring pattern for a semiconductor package

TSV as pad

Integrated circuit and method of forming the same

Method of preparing semiconductor structure having low dielectric c...

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Semiconductor device and method for manufacturing the semiconductor...

Contact via formation

MRAM device with wrap-around top electrode

Circuit structure, semiconductor device and method of manufacturing...

Three-dimensional memory device having staircase structure and meth...

Semiconductor device, circuit board structure and manufacturing met...

Sensor packages

Vertical memory devices and methods of manufacturing the same

Semiconductor memory device

Methods of forming microelectronic devices, and related electronic...

Method to create MIMcap designs across changing MIMcap structures

Hybrid method for forming semiconductor interconnect structure

Metal-oxide-metal cell semiconductor device and method

Three-dimensional memory structure fabrication using channel replac...

Memory devices

Semiconductor device and a manufacturing method thereof

Via rail structure

Semiconductor device having interconnection lines with different li...

Semiconductor device and method of fabricating the same

Multi-die package structures including redistribution layers

3D semiconductor devices and structures with metal layers

Semiconductor device

Interconnection structure, circuit and electronic apparatus includi...

Patents Applicationslast 30 patents

CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...

INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE ASSEMBLY FOR INTEGRATED CIRCUIT

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SEMICONDUCTOR MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF PREVENTING CHARGING DAMAGE TH...

METHOD FOR PRODUCING AN INTERCONNECT VIA

METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES

SEMICONDUCTOR MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HORIZONTAL SEMICONDUCTOR...

SEAL RING STRUCTURE AND METHOD OF FORMING SAME

USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

BACKSIDE LOCAL INTERCONNECT

THREE-DIMENSIONAL CHIP OR WAFER STACK

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...

SEMICONDUCTOR DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS