Via connections in a multilevel interconnection structure

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H01L23/5226

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5226Via connections in a multilevel interconnection structure

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Patents Grantslast 30 patents

Information Patent Grant
Ferroelectric memory cell
- Patent number 12,250,824
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising interconnect structures
- Patent number 12,249,518
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having shield patterns
- Patent number 12,249,573
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Tetsuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap structure for interconnect dielectrics and methods of fabrication
- Patent number 12,249,577
- Issue date Mar 11, 2025
- Intel Corporation
- Shashi Vyas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device and method of formin...
- Patent number 12,249,574
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside via
- Patent number 12,249,575
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,249,576
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising vertically-stacked decks with inte...
- Patent number 12,249,598
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Werner Juengling
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit device, method, layout, and system
- Patent number 12,249,601
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Zeng Kang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,249,608
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yun-Feng Kao
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 12,250,814
- Issue date Mar 11, 2025
- SanDisk Technologies, Inc.
- Kenichi Shimomura
- G11 - INFORMATION STORAGE
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier layer in dual damascene cu interconnect for enhan...
- Patent number 12,243,773
- Issue date Mar 4, 2025
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,815
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 12,243,820
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 12,243,805
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor including an insulator cup an...
- Patent number 12,245,439
- Issue date Mar 4, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional vertical nor flash thin-film transistor strings
- Patent number 12,245,430
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical memory structure with air gaps and method for preparing th...
- Patent number 12,245,431
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Yuan-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,245,437
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit
- Patent number 12,243,822
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor storage device
- Patent number 12,243,869
- Issue date Mar 4, 2025
- Kioxia Corporation
- Yasuhiro Suematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning of vias with hardmasks
- Patent number 12,243,771
- Issue date Mar 4, 2025
- Interational Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,243,618
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Sheng Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,237,342
- Issue date Feb 25, 2025
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and same
- Patent number 12,238,915
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kejun Mu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250079297
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Ilsup Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079313
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cian-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTAC...
- Publication number 20250079314
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hans HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH TWO-SIDE METALLIZATION AND EXTERNAL STIFFE...
- Publication number 20250079337
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...
- Publication number 20250079346
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ting Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BOTTOM ELECTRODE VIA FOR MEMORY DEVICE
- Publication number 20250079299
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhen Yu Guan
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081582
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- James WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20250079293
- Publication date Mar 6, 2025
- UNITED MICROELECTRONICS CORP.
- Tai-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...
- Publication number 20250079294
- Publication date Mar 6, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20250079317
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Changyeon SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
- Publication number 20250079359
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeong Wan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF AND SEMICONDUCTOR D...
- Publication number 20250081451
- Publication date Mar 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Wugen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20250081654
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- IKJUN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONDUCTIVE STRUCTURE FOR CIRCUIT PROBE TESTING
- Publication number 20250076340
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079237
- Publication date Mar 6, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250079295
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20250079296
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Minjun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20250079298
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES
- Publication number 20250079303
- Publication date Mar 6, 2025
- Intel Corporation
- Shairfe Salahuddin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250079306
- Publication date Mar 6, 2025
- KIOXIA Corporation
- Megumi ISHIDUKI
- G11 - INFORMATION STORAGE
Information Patent Application
Devices and Methods of Local Interconnect Stitches and Power Grids
- Publication number 20250079311
- Publication date Mar 6, 2025
- ARM Limited
- Jean-Luc Pelloie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250081598
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Heng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081625
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masato KITSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250071968
- Publication date Feb 27, 2025
- Beijing Superstring Academy of Memory Technology
- Xuezheng AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250070024
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Takafumi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072119
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070002
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kyungtae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250070021
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Ki-Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MEMORY DEVICE
- Publication number 20250070025
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS

Via connections in a multilevel interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ferroelectric memory cell

Semiconductor device comprising interconnect structures

Semiconductor device having shield patterns

Cap structure for interconnect dielectrics and methods of fabrication

Interconnect structure of semiconductor device and method of formin...

Semiconductor device including penetration via structure

Integrated circuit structure with backside via

Semiconductor device structure with stacked conductive plugs and me...

Integrated assemblies comprising vertically-stacked decks with inte...

Integrated circuit device, method, layout, and system

Method for manufacturing semiconductor structure and semiconductor...

Through-stack contact via structures for a three-dimensional memory...

Protection structures for bonded wafers

Liner and barrier layer in dual damascene cu interconnect for enhan...

Semiconductor device and method of fabricating the same

Semiconductor device with fine metal lines for BEOL structure and m...

Conductive line structures and method of forming same

Offset pads over TSV

Through-circuit vias in interconnect structures

Metal-insulator-metal (MIM) capacitor including an insulator cup an...

Three-dimensional vertical nor flash thin-film transistor strings

Vertical memory structure with air gaps and method for preparing th...

Semiconductor device

Method of manufacturing integrated circuit

Semiconductor device and semiconductor storage device

Selective patterning of vias with hardmasks

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit semiconductor device

Method for manufacturing semiconductor structure and same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTAC...

INTEGRATED CIRCUITS WITH TWO-SIDE METALLIZATION AND EXTERNAL STIFFE...

STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...

SEMICONDUCTOR DEVICE

METHOD OF FORMING BOTTOM ELECTRODE VIA FOR MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA ST...

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH

SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF AND SEMICONDUCTOR D...

SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR CHIPS

INTEGRATED CIRCUIT CONDUCTIVE STRUCTURE FOR CIRCUIT PROBE TESTING

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

HYBRID METAL LINE STRUCTURE

INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES

SEMICONDUCTOR MEMORY DEVICE

Devices and Methods of Local Interconnect Stitches and Power Grids

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING MEMORY DEVICE